DSPIC33EP512MC504-H/TL - 70MIPS 512KB Flash DSC | Microchip
MPN: DSPIC33EP512MC504-H/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.17 | $5.17 |
| 10 | $4.8 | $48.00 |
| 100 | $4.25 | $425.00 |
| 500 | $3.95 | $1,975.00 |
| 1,000 | $3.65 | $3,650.00 |
DSPIC33EP512MC504-H/TL Overview
A digital signal controller combines the computational architecture of a microcontroller with DSP capabilities such as single-cycle multiply-accumulate and hardware divide support. Within the semiconductor hierarchy, the dsPIC33EP family sits under the broader categories of microcontrollers and digital signal processors, merging MCU control peripherals with DSP math throughput for embedded control systems.
Key features include the 70 MIPS dsPIC33E core, dual 10-bit/12-bit ADC operation for simultaneous multi-channel sampling, high-speed Motor Control PWM (MCPWM) modules with complementary outputs and dead-time control, quadrature encoder interface (QEI) inputs, and a CAN 2.0B controller. Communication coverage includes multiple UART, SPI, and I2C peripherals, with 4 DMA channels and 5 timers offloading the CPU in mixed signal-control workloads.
Architecturally, the device integrates a pipelined 16-bit RISC core with fixed-point DSP instructions, an internal FRC oscillator and PLL for clock generation, and flash program memory organized as 170K x 24-bit words. Supply operation spans 3.0V to 3.6V (3.3V nominal) in CMOS technology, and multiple PGECx/PGEDx pin pairs support in-circuit serial programming (ICSP) and debugging with tools such as PICkit and ICD.
Typical applications include precision motor control (BLDC, PMSM, AC induction) for drives and robotics, digital power supplies and solar inverters, and industrial automation nodes requiring CAN connectivity and deterministic PWM timing.
Design consideration: to guarantee flash endurance and data retention, always verify the junction temperature against the VTLA exposed-pad thermal design - solder the exposed pad to a ground pour for both electrical and thermal performance.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and comparison data not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP512MC504-H/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512MC504-H/TL (same form factor and footprint) — differing in Package, Core, Core Architecture, Operating Temperature, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512MC504-E/TL
✅ Drop-In✓ In Stock
$4.98 / Unit
View Datasheet →DSPIC33EP512MC504-I/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP512MC504T-H/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256MC504T-I/TL
✅ Drop-In✓ In Stock
$3.32 / Unit
View Datasheet →DSPIC33EP512MC504-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.44 / Unit
View Datasheet →DSPIC33EP512MC504-H/TL Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC RISC with DSP |
| Max MIPS | 70 MIPS |
| Max Core Clock Frequency | 60 MHz |
| Program Memory Size | 512 KB (170K x 24) Flash |
| Data RAM Size | 48 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Data Bus Width | 16 bit |
| Instruction Type | Fixed/Floating Point |
| Interface Type | I2C, SPI, UART, CAN |
| DMA Channels | 4 |
| Timers | 5 |
| Motor Control PWM | MCPWM with QEI |
| Package | 44-VTLA Exposed Pad (10x10 mm) |
| Mounting Style | SMD/SMT |
| Technology | CMOS |
| Qualification | AEC-Q100 |
DSPIC33EP512MC504-H/TL 44-vtla exposed pad (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512MC504-H/TL (44-vtla exposed pad (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512MC504-H/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512MC504-H/TL is suitable for 6 applications: Precision Motor Control (BLDC/PMSM/ACIM), Digital Power Conversion (Solar Inverters, PFC), Industrial Automation and CAN Networking Nodes, Robotics and Servo Drives, Automotive Embedded Control Units, Portable Instrumentation and Sensing Systems.
Precision Motor Control (BLDC/PMSM/ACIM)
The DSPIC33EP512MC504-H/TL is Microchip's flagship-class DSC for precision motor control. Its 70 MIPS DSP core executes field-oriented control (FOC) loops well within typical 10-20 kHz PWM update rates, while the high-speed MCPWM module provides complementary PWM outputs with dead-time insertion for three-phase inverters. Quadrature encoder interface (QEI) inputs accept position feedback from incremental encoders without CPU overhead. The 4-channel DMA moves ADC results and PWM updates autonomously, keeping the control loop jitter-free. Designers should use the 12-bit ADC mode with simultaneous multi-channel sampling of phase currents, exploiting the dual ADC architecture, to minimize current-sampling latency in the FOC inner loop.
Recommended
Digital Power Conversion (Solar Inverters, PFC)
In digital power supplies, PFC stages, and solar micro-inverters, the DSPIC33EP512MC504-H/TL provides the deterministic timing and math throughput needed for high-frequency control loops. The 70 MIPS core runs PI/PID compensators for current- and voltage-mode control, while MCPWM outputs with fault inputs support cycle-by-cycle current limiting. The 12-bit ADC samples feedback signals with programmable conversion timing synchronized to the PWM carrier, reducing switching-noise-induced measurement error. CAN 2.0B connectivity enables inverter-to-string-controller communication in solar architectures. With 512 KB Flash, engineers can store multiple modulation strategies (SPWM, SVPWM, hysteresis) and field-updatable firmware images within the same device.
Recommended
Industrial Automation and CAN Networking Nodes
The integrated CAN 2.0B controller makes the DSPIC33EP512MC504-H/TL well suited for factory automation nodes, sensor hubs, and actuator interfaces on CAN/CANopen networks. Multiple UART, SPI, and I2C ports bridge legacy field devices to the CAN backbone, and the 4-channel DMA sustains multi-protocol traffic without CPU bottlenecks. The 70 MIPS core handles protocol stacks plus local control tasks concurrently, and 48 KB RAM buffers network messages and logging data. AEC-Q100 qualification (per distributor data) supports industrial environments with demanding reliability expectations. The 512 KB Flash accommodates CANopen stacks, firmware-update bootloaders, and application code with room for expansion across product variants.
Recommended
Robotics and Servo Drives
Robot joints and servo drives demand fast, coordinated multi-axis control - a match for the DSPIC33EP512MC504-H/TL's 70 MIPS DSP engine, MCPWM with QEI, and deterministic interrupt latency. The QEI decoders track two encoder channels for position/velocity feedback, while complementary PWM outputs drive H-bridge stages; the 512 KB Flash stores trajectory planners, homing routines, and communication stacks simultaneously. The 12-bit ADC and dual-sample-and-hold architecture capture bus voltage and motor current synchronously with PWM edges, which improves torque-ripple performance in FOC loops. DMA offloads sample transfer so the CPU maintains consistent loop periods critical to stable multi-axis coordination.
Recommended
Automotive Embedded Control Units
With AEC-Q100 qualification reported in distributor comparison data, the DSPIC33EP512MC504-H/TL suits automotive auxiliary ECUs such as pump controllers, fan modules, throttle actuators, and window lift drives. The MCPWM module's dead-time control and fault protection meet inverter safety requirements for 12V motor loads, and QEI supports position feedback in actuators. The on-chip CAN 2.0B controller integrates the node into in-vehicle networks when paired with a CAN transceiver. The 3.0V to 3.6V operating range matches regulated automotive logic rails, and the 44-pin VTLA exposed-pad package supports thermal dissipation in enclosed modules while keeping board area under 121 mm square.
Recommended
Portable Instrumentation and Sensing Systems
Handheld test instruments, battery-powered data loggers, and precision sensing front ends benefit from the DSPIC33EP512MC504-H/TL's flexible clocking and DSP math. The internal FRC oscillator with PLL allows crystal-less operation at full 60 MHz/70 MIPS, reducing BOM cost and board space in portable designs. The 12-bit ADC with multiple channels digitizes sensor inputs, while DSP library routines (FIR/IIR filters, FFTs) execute on the 16-bit core with single-cycle MAC for real-time signal conditioning. DMA-driven ADC sampling keeps CPU load low, extending battery life. UART and USB-bridge-friendly connectivity exports processed results to hosts, and 512 KB Flash retains calibration tables and multi-protocol firmware in the field.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512MC504-H/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512MC504-E/TL | DSPIC33EP512MC504-I/TL | DSPIC33EP256MC504T-I/TL | DSPIC33EP512MC504-I/PT |
|---|---|---|---|---|---|
| Package | 44-VTLA Exposed Pad (10x10 mm) | 44-VTLA Exposed Pad - same | 44-VTLA Exposed Pad - same | 44-VTLA Exposed Pad - same | 44-TQFP 10x10 mm (same footprint, thicker body) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 512 KB (170K x 24) | 512 KB | 512 KB | 256 KB (-50%) | 512 KB |
| Max MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Key Differentiators
- Maximum Flash in the 44-pin dsPIC33EP family (vs DSPIC33EP256MC504T-I/TL)
- Same die available in extended temperature grade (vs DSPIC33EP512MC504-E/TL)
- Exposed-pad thin package for thermal and height margin (vs DSPIC33EP512MC504-I/PT)
Design Notes
The DSPIC33EP512MC504-H/TL operates from 3.0V to 3.6V; use a clean 3.3V LDO or buck output and decouple every VDD pin with 100 nF ceramics placed within 2-3 mm of the pin, plus one bulk 10 uF per device. All VDD and VSS pins must be connected per Microchip documentation - omitting one on the 44-pin VTLA can cause erratic ADC readings or brown-out resets. Add a bulk capacitor near the VCAP/core regulator pin exactly as specified in the datasheet power section, since core regulation stability depends on it.
Solder the VTLA exposed pad to a ground pour with an array of thermal vias (typically 5x5, 0.3 mm drill filled or plugged). The exposed pad is the primary thermal and ground return path; a floating pad raises junction temperature and degrades EMC performance. For motor-control layouts, keep the MCPWM outputs away from the analog ANx traces and route the ADC reference away from PWM switching nodes to preserve 12-bit accuracy in FOC current sampling.
ICSP programming requires matched PGECx/PGEDx pairs - per Microchip documentation, if PGEC2 is used for ICSPCLK, ICSPDAT must connect to PGED2; mixing pairs from different indexes prevents programming. Reserve a programming header on every board. Also, set configuration fuses (oscillator source, watchdog, code protection) deliberately at project start: incorrect OSC settings on a dsPIC33EP can lock the device at an unintended clock, complicating re-flashing on assembled boards.
Compliance Information
Xecor comparison data lists the DSPIC33EP512MC504-H/TL as AEC-Q100 qualified and RoHS compliant. REACH, lead-free, halogen-free, and conflict-minerals status not stated in provided data - verify on the official Microchip product page.
