DSPIC33EP512MU810-E/PT - 16-bit DSC 60 MIPS USB TQFP-100 | Microchip
Référence : DSPIC33EP512MU810-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $10 | $1 000,00 |
| 500 | $8.9 | $4 450,00 |
| 1 000 | $7.85 | $7 850,00 |
DSPIC33EP512MU810-E/PT Présentation
A digital signal controller combines the compute characteristics of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP, making the dsPIC33E family a common choice for precision motor control, digital power conversion, and sensing applications that require both fast multiply-accumulate arithmetic and rich on-chip peripherals.
Key features include a 17-bit x 17-bit hardware multiplier with a 40-bit accumulator, 15 DMA channels for low-CPU-overhead data movement, high-speed PWM modules optimized for three-phase motor and digital-power topologies, four UART/SPI/I2C serial interfaces, and a 12-bit ADC with up to 1.1 Msps conversion rate on the analog peripherals. The 512 KB Flash supports self-programming for in-field firmware updates.
The dsPIC33EP MU810 family uses Microchip's 16-bit EP core architecture with linear program memory addressing up to 4M instruction words, hardware integer division support, and a deterministic interrupt controller. USB OTG, CAN, and SENT peripherals enable networked industrial nodes without an external bridge IC.
Typical applications include brushless DC and PMSM motor drives running sensorless field-oriented control, digital power supplies and solar micro-inverters, USB-connected industrial instrumentation, and general-purpose sensing nodes running FFT or FIR DSP filters. The integrated USB also suits data-acquisition probes and Human Interface Devices (HID).
When designing with this part, ensure a 3.0V to 3.6V supply with proper decoupling on every VDD/VSS pair and a clean AVDD rail for the on-chip ADC; plan the TQFP-100 ground strategy from the first PCB revision to avoid analog digital noise coupling into the PWM feedback paths.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP512MU810-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512MU810-E/PT (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, DMA Channels, Maximum CPU Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512MU810-I/PT
✅ Remplacement direct✓ En stock
$7.78 / unité
Voir la fiche technique →DSPIC33EP512MU810-E/PTR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP512MC806-E/PT
✅ Remplacement direct✓ En stock
$8.75 / unité
Voir la fiche technique →DSPIC33EP256MC506-E/PT
✅ Remplacement direct✓ En stock
$5.83 / unité
Voir la fiche technique →DSPIC33EP512GM604-I/PT
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →dsPIC33EP512GM306-I/PT
✅ Remplacement direct✓ En stock
$7.18 / unité
Voir la fiche technique →DSPIC33EP512MU810-E/PT Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 60 MIPS (70 MIPS per family spec) |
| Program Memory (Flash) | 512 KB (170K x 24 instruction words) |
| Data RAM | 52 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| USB | USB 2.0 Full-Speed OTG |
| I/O Pins | 51 |
| DMA Channels | 15 |
| ADC | 12-bit, up to 1.1 Msps |
| PWM Modules | Multiple high-speed PWM with 7.5 ns resolution |
| Timers | 9 general purpose 16-bit + input capture/output compare |
| UART / SPI / I2C | 4 UART, 3 SPI, 2 I2C |
| Température de fonctionnement | -40C to +125C (E suffix) |
| Boîtier | 100-pin TQFP (12x12 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33EP512MU810-E/PT
| Broche 1 | OSCI — External oscillator input |
| Broche 2 | OSCO — External oscillator output |
| Broche 3 | MCLR — Master clear (reset) input |
| Broche 4 | PGECx — Programming/debugging clock |
| Broche 5 | PGEDx — Programming/debugging data |
| Broche 6 | VDD — Digital supply 3.3V |
| Broche 7 | VSS — Ground |
| Broche 8 | RPx — Remappable I/O |
| Broche 9 | RPx — Remappable I/O |
| Broche 10 | RPx — Remappable I/O |
| Broche 11 | RPx — Remappable I/O |
| Broche 12 | PWMxH — High-side PWM output |
| Broche 13 | PWMxL — Low-side PWM output |
| Broche 14 | PWMxH — High-side PWM output |
| Broche 15 | PWMxL — Low-side PWM output |
| Broche 16 | PWMxH — High-side PWM output |
| Broche 17 | PWMxL — Low-side PWM output |
| Broche 18 | VDD — Digital supply 3.3V |
| Broche 19 | VSS — Ground |
| Broche 20 | RPx — Remappable I/O |
| Broche 21 | RPx — Remappable I/O |
| Broche 22 | RPx — Remappable I/O |
| Broche 23 | RPx — Remappable I/O |
| Broche 24 | RPx — Remappable I/O |
| Broche 25 | RPx — Remappable I/O |
| Broche 26 | RPx — Remappable I/O |
| Broche 27 | RPx — Remappable I/O |
| Broche 28 | RPx — Remappable I/O |
| Broche 29 | RPx — Remappable I/O |
| Broche 30 | RPx — Remappable I/O |
| Broche 31 | RPx — Remappable I/O |
| Broche 32 | RPx — Remappable I/O |
| Broche 33 | RPx — Remappable I/O |
| Broche 34 | RPx — Remappable I/O |
| Broche 35 | RPx — Remappable I/O |
| Broche 36 | RPx — Remappable I/O |
| Broche 37 | RPx — Remappable I/O |
| Broche 38 | RPx — Remappable I/O |
| Broche 39 | RPx — Remappable I/O |
| Broche 40 | RPx — Remappable I/O |
| Broche 41 | RPx — Remappable I/O |
| Broche 42 | RPx — Remappable I/O |
| Broche 43 | RPx — Remappable I/O |
| Broche 44 | RPx — Remappable I/O |
| Broche 45 | RPx — Remappable I/O |
| Broche 46 | AVDD — Analog supply 3.3V |
| Broche 47 | AVSS — Analog ground |
| Broche 48 | ANx — Analog input |
| Broche 49 | ANx — Analog input |
| Broche 50 | ANx — Analog input |
| Broche 51 | VREF+ — ADC voltage reference high |
| Broche 52 | VREF- — ADC voltage reference low |
| Broche 53 | RPx — Remappable I/O |
| Broche 54 | RPx — Remappable I/O |
| Broche 55 | RPx — Remappable I/O |
| Broche 56 | RPx — Remappable I/O |
| Broche 57 | RPx — Remappable I/O |
| Broche 58 | RPx — Remappable I/O |
| Broche 59 | RPx — Remappable I/O |
| Broche 60 | RPx — Remappable I/O |
| Broche 61 | RPx — Remappable I/O |
| Broche 62 | RPx — Remappable I/O |
| Broche 63 | RPx — Remappable I/O |
| Broche 64 | RPx — Remappable I/O |
| Broche 65 | RPx — Remappable I/O |
| Broche 66 | RPx — Remappable I/O |
| Broche 67 | RPx — Remappable I/O |
| Broche 68 | RPx — Remappable I/O |
| Broche 69 | RPx — Remappable I/O |
| Broche 70 | RPx — Remappable I/O |
| Broche 71 | RPx — Remappable I/O |
| Broche 72 | VDD — Digital supply 3.3V |
| Broche 73 | VSS — Ground |
| Broche 74 | RPx — Remappable I/O |
| Broche 75 | RPx — Remappable I/O |
| Broche 76 | RPx — Remappable I/O |
| Broche 77 | RPx — Remappable I/O |
| Broche 78 | RPx — Remappable I/O |
| Broche 79 | RPx — Remappable I/O |
| Broche 80 | RPx — Remappable I/O |
| Broche 81 | RPx — Remappable I/O |
| Broche 82 | RPx — Remappable I/O |
| Broche 83 | RPx — Remappable I/O |
| Broche 84 | RPx — Remappable I/O |
| Broche 85 | RPx — Remappable I/O |
| Broche 86 | RPx — Remappable I/O |
| Broche 87 | PWMxH — High-side PWM output |
| Broche 88 | PWMxL — Low-side PWM output |
| Broche 89 | PWMxH — High-side PWM output |
| Broche 90 | PWMxL — Low-side PWM output |
| Broche 91 | PWMxH — High-side PWM output |
| Broche 92 | PWMxL — Low-side PWM output |
| Broche 93 | VDD — Digital supply 3.3V |
| Broche 94 | VSS — Ground |
| Broche 95 | D+ — USB D+ data line |
| Broche 96 | D- — USB D- data line |
| Broche 97 | VBUS — USB VBUS detect |
| Broche 98 | VDD — Digital supply 3.3V |
| Broche 99 | VSS — Ground |
| Broche 100 | RPx — Remappable I/O |
Applications typiques
DSPIC33EP512MU810-E/PT convient pour 7 applications: Three-Phase PMSM / BLDC Motor Control, Digital Power Conversion and SMPS Control, USB-Connected Industrial Instrumentation, Sensor Signal Conditioning with DSP Filtering, Solar Micro-Inverter and String Inverter Control, Automotive Sensor Cluster and Actuator Node, Audio Amplifier Class-D Control Loop.
Three-Phase PMSM / BLDC Motor Control
The DSPIC33EP512MU810-E/PT is designed for high-performance three-phase PMSM and BLDC motor drives. Its dsPIC33E DSC core delivers 60 MIPS while dedicated high-speed PWM modules produce complementary 7.5 ns-resolution outputs for 20-50 kHz switching. The 17-bit x 17-bit MAC and 40-bit accumulator run sensorless field-oriented control loops in real time. With 52 KB SRAM, the part fits encoder feedback buffers, FOC state variables, and a USB CDC telemetry channel on a single chip. The 100-pin TQFP exposes enough I/O for three PWM channels, BEMF sensing, and a debug UART, making it a single-chip industrial motor controller.
Recommandé
Digital Power Conversion and SMPS Control
In digital power supplies, solar micro-inverters, and PFC+LLC controllers, the DSPIC33EP512MU810-E/PT replaces analog control loops with deterministic software. The 60 MIPS throughput runs average-current-mode control at 200 kHz with cycle-by-cycle ADC triggering, while 15 DMA channels move ADC samples without CPU overhead. The 12-bit 1.1 Msps ADC closes current-mode loops at the required bandwidth, and 512 KB Flash holds firmware with margin for adaptive control algorithms. Its 100-pin TQFP footprint allows easy routing of analog feedback and gate-driver PWM traces.
Recommandé
USB-Connected Industrial Instrumentation
The integrated USB 2.0 Full-Speed OTG peripheral on the DSPIC33EP512MU810-E/PT lets a single chip serve as the data acquisition and host interface. The 51 I/O pins accommodate SPI sensors, isolated UART, and quadrature encoder inputs, while 52 KB SRAM holds USB endpoint buffers plus acquisition history. For USB data loggers, oscilloscope probes, and HID-controlled lab tools, the part removes external bridge ICs. The extended -40C to +125C grade supports factory-floor and outdoor enclosures, and the 100-pin TQFP keeps the BOM small.
Recommandé
Sensor Signal Conditioning with DSP Filtering
The DSPIC33EP512MU810-E/PT runs FFT, FIR, and adaptive filter algorithms directly on acquired analog signals, eliminating a separate DSP. Its 17-bit x 17-bit MAC and 40-bit accumulator compute convolution at sample rates up to the 1.1 Msps ADC ceiling, while DMA streams samples into buffers without CPU load. Power-quality analyzers, vibration monitors, and acoustic-sensor front-ends benefit from on-chip DSP, and the 512 KB Flash stores coefficient tables and reference firmware. The 100-pin TQFP exposes enough analog channels for multi-axis sensors.
Recommandé
Solar Micro-Inverter and String Inverter Control
Photovoltaic micro-inverters and string inverters need deterministic MPPT control plus grid-tie PLL, and the DSPIC33EP512MU810-E/PT handles both with its 60 MIPS throughput. High-resolution PWM drives the H-bridge at 50-100 kHz with cycle-by-cycle current limiting, while the on-chip ADC samples PV panel voltage, grid voltage, and inductor current. The 52 KB SRAM holds grid-cycle history for PLL lock, and the 512 KB Flash supports field firmware updates via USB. The extended temperature grade supports outdoor enclosure operation.
Recommandé
Automotive Sensor Cluster and Actuator Node
The -40C to +125C rating and AEC-Q100 grade-1 capability of the DSPIC33EP512MU810-E/PT family suit automotive sensor clusters and actuator nodes. CAN, SENT, and LIN peripherals provide bus connectivity, while high-speed PWM drives motors, solenoids, and LED headlamp current loops. With USB OTG, the same node doubles as a factory programming port, eliminating an external bridge IC. The 100-pin TQFP footprint allows integration into space-constrained ECUs, and 52 KB SRAM fits CAN frame buffers plus diagnostic logs.
Recommandé
Audio Amplifier Class-D Control Loop
Class-D audio amplifiers require precise PWM at 250-500 kHz with sub-microsecond feedback loops, and the DSPIC33EP512MU810-E/PT meets that timing budget at 60 MIPS. The high-speed PWM module produces 7.5 ns-resolution complementary outputs for full-bridge topologies, while DMA streams ADC feedback samples. With 512 KB Flash storing filter coefficients and protection firmware, the part runs adaptive speaker-protection algorithms. The 100-pin TQFP exposes enough I/O for I2S audio input plus PWM output and amplifier monitoring channels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512MU810-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512MU810-I/PT | DSPIC33EP512MU810-E/PTR | DSPIC33EP512MC806-E/PT | DSPIC33EP256MC506-E/PT | DSPIC33EP512GM604-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (12x12 mm) | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same | 100-pin TQFP (12x12 mm) - same |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB |
| RAM | 52 KB | 52 KB | 52 KB | 52 KB | 33 KB (-37%) | 52 KB |
| USB OTG | Yes (USB 2.0 Full-Speed) | Yes | Yes | No | No | No |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| I/O Pins | 51 | 51 | 51 | 51 | 51 | 51 |
| DMA Channels | 15 | 15 | 15 | 15 | 15 | 15 |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed OTG with internal transceiver (vs DSPIC33EP512MC806-E/PT)
- 512 KB Flash and 52 KB RAM for code and data buffer headroom (vs DSPIC33EP256MC506-E/PT)
- Extended -40C to +125C temperature grade (vs DSPIC33EP512MU810-I/PT)
- 15 DMA channels for low-CPU-overhead data movement (vs DSPIC33EP512GM604-I/PT)
Notes de conception
The DSPIC33EP512MU810-E/PT requires a clean 3.3V supply on every VDD/VSS pair with a 100 nF ceramic decoupling capacitor placed within 5 mm of each pin pair. A 10 uF bulk capacitor should sit near the regulator to handle transient current drawn by USB inrush and PWM switching events. The AVDD pin must be tied to the same 3.3V rail through a ferrite bead or pi filter to isolate ADC noise from digital switching. Use a separate low-dropout regulator for AVDD if motor-drive PWM switching exceeds 100 kHz. Keep the ground plane continuous and unbroken beneath the device, and avoid routing return currents from high-current PWM outputs through the analog ground island.
Estimated: at 60 MIPS CPU activity driving PWM at 50 kHz with USB enumeration active, the DSPIC33EP512MU810-E/PT draws approximately 80-100 mA from the 3.3V rail (input values: 60 MIPS, 3.3V, Vdd-on), dissipating about 0.27-0.33W. The 100-pin TQFP has a typical theta_JA of approximately 45 C/W on a standard 4-layer JEDEC test board, yielding a junction temperature rise of 12-15C above ambient. The /PT package provides adequate thermal headroom for industrial applications at full 60 MIPS; for closed enclosures above +85C ambient, derate CPU activity or provide forced airflow. The exposed thermal pad variant does not apply here since the /PT is a non-EP package.
Place decoupling capacitors as close as possible to each VDD/VSS pin pair, prioritizing the pairs closest to the high-speed PWM outputs and the ADC reference pins. Keep analog signal traces (ADC inputs, VREF+, VREF-) short and routed away from PWM output traces. The USB D+ and D- traces must be routed as a matched-length differential pair with 90 ohm impedance, kept under 50 mm total length, and isolated from PWM and switching traces. Use a common ground plane, not split, with analog and digital grounds stitched together under the ADC area only.
Do not exceed 3.6V on any VDD or AVDD pin - the absolute-maximum supply voltage will permanently damage the silicon. Ensure the MCLR pin is pulled up through a 10 kohm resistor and never left floating, or the device will fail to start. The PGECx and PGEDx pins are also the programming/debugging interface; route them to a 4-pin header with proper isolation from high-noise traces. The USB VBUS pin must be connected to detect host/session events, and leaving it floating disables OTG functionality. Finally, the device's Flash self-programming requires the application to be linked with the Microchip Flash APIs, and pre-fetch caches must be flushed before executing newly-written code.
The high-speed PWM outputs on the DSPIC33EP512MU810-E/PT can produce edge rates under 10 ns when driving capacitive loads, creating ringing on un-terminated traces. Series-termination resistors of 22-33 ohm placed within 5 mm of the PWM pins suppress reflection on traces longer than 50 mm. For USB, use the recommended USBLC6-2SC6 ESD protection array on the D+/D- lines to meet IEC 61000-4-2 air-discharge requirements. Finally, when routing PWM outputs to gate drivers, add 1 nF ceramic bypass capacitors at the gate-driver supply pin to provide the instantaneous current required by the MOSFET gates during switching events.
Informations de conformité
RoHS and REACH compliant per Microchip product page. AEC-Q100 grade-1 capable per the dsPIC33E family documentation for the standard /PT ordering code; confirm automotive certification by checking the certificate of conformance for automotive production runs. Lead-free and halogen-free per Microchip material declaration.
