DSPIC33EP64GS708-I/PT - 16-bit 70 MIPS DSC | Microchip Technology
MPN: DSPIC33EP64GS708-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.58 | $55.80 |
| 100 | $4.96 | $496.00 |
| 500 | $4.4 | $2,200.00 |
| 1,000 | $3.95 | $3,950.00 |
DSPIC33EP64GS708-I/PT Overview
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the math-acceleration of a digital signal processor (DSP) in a single core. In the power-management hierarchy, the dsPIC33EP GS family sits at the system-control level, orchestrating switch-mode power conversion loops, power factor correction stages, and inverter control while also handling housekeeping tasks such as communication, sequencing, and fault management.
Key features of this device include its 70 MIPS 16-bit pipeline core, dual-partition FLASH supporting live field updates, and a peripheral set purpose-built for digital power: interconnected high-speed PWM modules, high-speed ADC with hardware support for multiple simultaneous sampling, integrated programmable gain amplifiers (PGA), and analog comparators tightly coupled to the PWM for cycle-by-cycle current limiting.
The architecture ties the ADC, comparators, and PWM into a deterministic control loop with minimal CPU intervention, which is what distinguishes the GS series from general-purpose dsPIC33EP GP variants. Functional Safety (FuSa) support documentation makes it suitable for safety-relevant industrial power designs. The dual-partition FLASH allows firmware execution from one partition while the other is erased and reprogrammed, enabling fail-safe over-the-air or in-field updates.
Typical applications include AC-DC converters, power factor correction (PFC) stages, digital lighting ballasts, solar micro-inverters, battery chargers, and uninterruptible power supplies (UPS). The 350W interleaved PFC reference design from Microchip demonstrates the family's intended use in universal-input single-output power conversion.
When designing with this DSC, plan control-loop timing around the 70 MIPS core budget and route high-frequency PWM outputs away from analog PGA/ADC inputs; the 0.5 mm terminal pitch TQFP requires careful PCB land-pattern design. Verify that the industrial temperature grade (-40C to +85C for the /I suffix) matches your thermal environment, selecting the /E grade (up to +125C) for harsher conditions.
This page synthesizes distributor pricing, drop-in family alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64GS708-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GS708-I/PT (same form factor and footprint) — differing in Operating Temperature, Package, Functional Safety Support, Target Applications.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GS708-E/PT
✅ Drop-In✓ In Stock
$4.65 / Unit
View Datasheet →DSPIC33EP128GS708-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$8.8 / Unit
View Datasheet →DSPIC33EP64GS708-I/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC DSC |
| Series | dsPIC33EP GS (Digital Power) |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 64KB (64K x 8) FLASH |
| RAM Size | 8KB |
| Supply Voltage | 3.3 V |
| Package | 80-TQFP (12x12 mm) |
| Terminal Pitch | 0.5 mm |
| Operating Temperature | -40C to +85C (I grade) |
| Mounting Type | Surface Mount |
| Flash Partitions | Dual Partition FLASH (live update) |
| PWM | Interconnected high-speed PWM for digital power |
| ADC | High-speed ADC with PGA and comparators |
| Functional Safety Support | Yes (FuSa documentation package) |
| Programming/Debug | ICSP via PGECx/PGEDx pin pairs |
| Target Applications | SMPS and digital power conversion |
DSPIC33EP64GS708-I/PT 80-tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP64GS708-I/PT (80-tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GS708-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GS708-I/PT is suitable for 6 applications: AC-DC Power Supply Control, Power Factor Correction (PFC), Solar Micro-Inverter and String Inverter Control, Battery Chargers and BMS Host Control, Uninterruptible Power Supplies (UPS), Digital Lighting and Electronic Ballasts.
AC-DC Power Supply Control
The DSPIC33EP64GS708-I/PT serves as the primary digital controller in offline AC-DC converters, per Microchip's positioning of the GS family for SMPS and digital power conversion. Its 70 MIPS core executes voltage- and current-loop compensation at switching frequencies of hundreds of kHz, while the interconnected high-speed PWM generates precisely phased gate drive signals. The high-speed ADC with integrated PGA samples sense signals directly without external amplifier stages, and analog comparators provide hardware cycle-by-cycle overcurrent protection with response times faster than any software loop. Running the control loop in the dual-partition FLASH device allows firmware updates in fielded units without power interruption.
Recommended
Power Factor Correction (PFC)
Microchip demonstrates this family with a 350W interleaved PFC reference design operating from universal input voltage, producing a single high-voltage DC output. The DSPIC33EP64GS708-I/PT controls interleaved boost stages where phase management between channels is essential - the interconnected high-speed PWM modules generate phase-shifted outputs deterministically. The high-speed ADC samples input current and bus voltage synchronized to PWM cycles, keeping current draw sinusoidal and power factor near unity. Hardware comparators handle inrush and overcurrent events independently of the CPU, improving robustness under line transients and start-up conditions in the 350W-class design envelope.
Recommended
Solar Micro-Inverter and String Inverter Control
Grid-tied solar inverters demand coordinated MPPT, DC-DC, and DC-AC control loops with fast fault protection - exactly the workload the DSPIC33EP64GS708-I/PT was architected for. The 70 MIPS DSP core executes MPPT algorithms while the interconnected PWM synthesizes grid-frequency modulation with high-resolution phase control. The PGA-equipped ADC scales current and voltage feedback internally, reducing BOM count, and comparators gate PWM outputs during grid faults within a single switching cycle. The 64KB dual-partition FLASH supports remote firmware upgrades of deployed inverters, a common serviceability requirement in rooftop installations where physical access is costly.
Recommended
Battery Chargers and BMS Host Control
Multi-stage battery charging (CC/CV/trickle, termination, and balancing supervision) benefits from the DSPIC33EP64GS708-I/PT's multi-loop PWM architecture and 12-bit-class high-speed ADC with PGA for precise current and voltage sensing. Hardware comparators enforce pack-level overcurrent limits cycle-by-cycle, while the 70 MIPS core executes charge-profile state machines and communication protocols simultaneously. The 64KB FLASH accommodates charging algorithms plus host communication stacks, and the dual-partition memory lets manufacturers ship field updates as new battery chemistries emerge. The 80-pin TQFP provides ample GPIO for relay, LED, and connector-interface duties in charger designs.
Recommended
Uninterruptible Power Supplies (UPS)
In UPS designs, the DSPIC33EP64GS708-I/PT manages the rectifier PFC front end, battery converter, and inverter output stage with deterministic multi-loop control enabled by the interconnected PWM/ADC/comparator fabric. The 70 MIPS core handles transfer logic, waveform synthesis, and CAN or UART communication to network management cards. High-speed ADC channels synchronized to PWM sampling windows deliver clean feedback despite switching noise, and hardware comparators implement instantaneous overcurrent shutdown protecting both the inverter bridge and downstream loads. Field firmware updates via dual-partition FLASH keep deployed UPS units compliant as grid codes evolve.
Recommended
Digital Lighting and Electronic Ballasts
High-intensity discharge and LED ballast controllers use the DSPIC33EP64GS708-I/PT for resonant half-bridge and buck-stage control, exploiting the GS family's high-resolution interconnected PWM for frequency and phase modulation. The PGA-equipped high-speed ADC senses lamp current and bus voltage without external signal conditioning, and the integrated comparators provide fast arc/lamp-fault protection through hardware PWM gating. The 3.3V, 70 MIPS core executes dimming curves and DALI-style communication concurrently. The dual-partition 64KB FLASH enables field firmware updates for changing dimming standards, and the industrial temperature grade suits enclosed luminaires.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GS708-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GS708-E/PT | DSPIC33EP128GS708-I/PT |
|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Memory | 64KB | 64KB | 128KB |
| RAM | 8KB | 8KB | 8KB |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Digital Power Peripherals (PWM/ADC/PGA/Comparators) | Interconnected high-speed PWM, high-speed ADC with PGA, comparators | Identical peripheral set | Identical peripheral set |
Key Differentiators
- Identical silicon with +40C more thermal headroom available (vs DSPIC33EP64GS708-E/PT)
- Balanced 64KB memory keeps unit cost down (vs DSPIC33EP128GS708-I/PT)
- Purpose-built digital-power fabric vs general-purpose dsPIC33EP (vs DSPIC33EP64GP503-I/TL)
Design Notes
The 80-TQFP has a 0.5 mm terminal pitch on a 12x12 mm body - use non-solder-mask-defined (NSMD) lands and verify the land pattern against the datasheet mechanical drawing before fabrication. Route the PGECx/PGEDx ICSP pair together to a programming header; any pair works (e.g., PGEC2 with PGED2) but the pair must be kept matched. Keep high-dv/dt PWM traces short and away from PGA/ADC input traces to protect conversion accuracy.
The device runs from a single 3.3V rail. Decouple every VDD/VSS pair with 0.1uF ceramics placed within a few millimeters of the pins, and add bulk capacitance (4.7uF-10uF) near the supply entry. Filter AVDD separately (ferrite plus 1uF) because the integrated PGA and high-speed ADC analog performance degrades with core/PWM switching noise coupling through the supply domain, per Microchip's 16-bit DSC family power-supply guidance.
Estimated: the /I grade is limited to +85C ambient. A 70 MIPS DSC driving multiple PWM outputs in a dense power-supply enclosure can self-heat; as a rough check, assume 150-250 mA typical core+I/O current at 3.3 V, i.e., ~0.5-0.8 W dissipation, and verify the resulting Tj with the TQFP theta-JA from the datasheet against your enclosure airflow. In hot power electronics, prefer the /E variant (up to +125C) as a pin-compatible safety margin.
Do not treat this part as interchangeable with GP or MC series dsPIC33EP devices - only same-family GS708/80X members share the 80-pin TQFP footprint and the interconnected digital-power peripheral fabric. Also, when designing field-update bootloaders, reserve both FLASH partitions correctly; the 64KB total is split, so effective per-image code space is less than 64KB - plan firmware size accordingly or step up to the 128GS708.
Compliance Information
Compliance data not stated in the provided verified web data; verify against the Microchip product page environmental datasheet before procurement.
