DSPIC33EP64MC506-I/MR - 70 MIPS 16-bit DSC, 64KB Flash | Microchip
MPN: DSPIC33EP64MC506-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.98 | $39.80 |
| 100 | $3.75 | $375.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.4 | $3,400.00 |
DSPIC33EP64MC506-I/MR Overview
A digital signal controller combines the computational power of a digital signal processor (DSP) with the control peripherals and ease of use of a microcontroller (MCU). Within the power management hierarchy, the dsPIC33EP family sits in the 16-bit microcontroller and DSC class, targeting closed-loop real-time control systems such as motor drives, digital power supplies, and embedded control where deterministic interrupt latency and hardware PWM matter more than raw throughput.
Key features of this part include the 70 MIPS dsPIC33E core with integrated DSP engine (single-cycle MAC, 40-bit accumulator), high-speed motor control PWM (MCPWM) with complementary outputs and dead-time insertion, a Quadrature Encoder Interface (QEI) for position feedback, one CAN 2.0B module for industrial networking, three on-chip operational amplifiers, and four analog comparators - reducing external component count in power-conversion designs.
The architecture provides 27 general-purpose timers (per family documentation, nine 16-bit), a 16-channel 10/12-bit ADC option within the family, and up to 51 I/O ports on this 64-pin variant. Clock operation is specified at 60 MHz device frequency per distributor data, corresponding to the 70 MIPS instruction execution rate. The device operates over the industrial -40C to +85C temperature range indicated by the -I suffix, with supply voltage of 3V to 3.6V.
Typical applications include precision motor control (BLDC, PMSM, AC induction), digital power supplies (PFC, LLC, solar inverters), industrial automation nodes with CAN connectivity, and sensor signal conditioning leveraging the on-chip op amps and comparators. The QEI module directly interfaces rotary encoders for servo drives.
For design, ensure a clean 3.3V rail with local decoupling, and use Microchip MPLAB X IDE with XC16 compiler or MPLAB Code Configurator for firmware development; in-circuit debug uses ICSP via the PICkit or ICD tools.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout/package guidance, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64MC506-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64MC506-I/MR (same form factor and footprint) — differing in Core, Package, Operating Temperature, Supply Voltage, Communication Interfaces.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64MC506-E/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.86 / Unit
View Datasheet →DSPIC33EP128MC506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32MC506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64MC506-I/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC core |
| Performance | 70 MIPS |
| Device Frequency | 60 MHz |
| Flash Memory | 64 KB (22K x 24) |
| SRAM | 8 KB |
| Supply Voltage | 3 V to 3.6 V |
| I/O Ports | 51 |
| PWM Module | Motor Control PWM (MCPWM) |
| Quadrature Encoder Interface | Yes (QEI) |
| CAN Module | CAN 2.0B |
| On-chip Op Amps | 3 |
| Analog Comparators | 4 |
| General Purpose Timers | 27 (nine 16-bit per family data) |
| Operating Temperature | -40C to +85C (industrial, -I suffix) |
| Package | 64-VQFN (9 x 9 mm, 0.90 mm height) |
| Mounting Type | Surface Mount |
| Lifecycle Stage | ACTIVE |
DSPIC33EP64MC506-I/MR 64-vqfn (9 x 9 mm, 0.90 mm height) Pin Configuration Guide
Pin configuration for DSPIC33EP64MC506-I/MR (64-vqfn (9 x 9 mm, 0.90 mm height) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64MC506-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64MC506-I/MR is suitable for 6 applications: BLDC/PMSM Precision Motor Control, Digital Power Supplies (PFC / LLC), Industrial Automation and CAN Networking Nodes, Solar Inverters and Renewable Energy Conversion, Sensor Signal Conditioning and Measurement, Embedded Control and Robotics.
BLDC/PMSM Precision Motor Control
The DSPIC33EP64MC506-I/MR is purpose-built for field-oriented control of BLDC and PMSM motors. Its 70 MIPS DSP core with single-cycle MAC executes current and speed control loops with deterministic latency, while the motor control PWM (MCPWM) module generates complementary outputs with hardware dead-time insertion for three-phase inverter bridges. The Quadrature Encoder Interface reads rotary encoders directly for rotor position feedback, and four on-chip comparators provide cycle-by-cycle overcurrent protection without CPU intervention. Placed at the heart of the drive board, the DSC replaces discrete gate control and analog protection circuits, reducing BOM cost. Design consideration: ensure the PWM switching frequency aligns with ADC sampling triggered from the PWM module to keep the control loop deterministic.
Recommended
Digital Power Supplies (PFC / LLC)
In digitally controlled AC-DC and DC-DC converters, the DSPIC33EP64MC506-I/MR implements PFC, LLC, or phase-shifted full-bridge control laws in firmware. The high-speed MCPWM module supports adjustable dead time and fault clamp outputs needed for resonant topologies, while the DSP engine computes compensator equations within 70 MIPS headroom. The three on-chip op amps buffer current-sense signals before the ADC, and comparators implement hardware overcurrent shutdown with microsecond response - faster than any software loop. The CAN module enables digital power supplies to report telemetry or participate in parallel-current-sharing schemes. Trade-off versus analog control: firmware control allows adaptive non-linear compensation and startup sequencing, but requires careful firmware validation; use Microchip's DigitalCompensator libraries to shorten development time.
Recommended
Industrial Automation and CAN Networking Nodes
The integrated CAN 2.0B module makes the DSPIC33EP64MC506-I/MR a strong fit for industrial automation nodes such as servo drive interfaces, I/O modules, and machine controllers on CANopen or DeviceNet-style networks. The 51 I/O lines of the 64-pin VQFN package interface buttons, limit switches, and actuators, while 27 general-purpose timers handle scheduling and pulse measurement. The DSP engine performs signal processing tasks such as vibration analysis or sensor filtering on-node. With 70 MIPS and hardware DSP, deterministic response to network and process interrupts is maintained. For design, implement proper CAN bus termination (120 ohm) and use the on-chip ECAN message buffers to minimize CPU load; the industrial -40C to +85C rating suits factory-floor environments.
Recommended
Solar Inverters and Renewable Energy Conversion
Solar micro-inverters and string inverters require simultaneous MPPT computation, grid-synchronization, and inverter PWM control - all handled by the DSPIC33EP64MC506-I/MR's 70 MIPS core and DSP engine. The MCPWM module drives power stages with complementary, dead-time-controlled outputs, and the ADC (triggered synchronously from PWM) samples grid voltage and current for software phase-locked loop (SPLL) implementation. On-chip comparators add a hardware-level protection layer against overcurrent faults. The CAN interface supports inverter fleet monitoring. Design consideration: allocate the DSP accumulation units to SPLL and MPPT integrators to keep interrupt service routines short; verify ADC sampling alignment with PWM zero vectors to avoid switching noise in the measurements.
Recommended
Sensor Signal Conditioning and Measurement
The three on-chip operational amplifiers and four comparators of the DSPIC33EP64MC506-I/MR enable compact analog front ends for industrial sensing: the op amps amplify bridge or current-shunt signals before internal ADC conversion, while comparators implement threshold alarms in hardware. The 70 MIPS DSP core applies digital filtering (IIR/FIR) to raw conversions, achieving measurement accuracy beyond the raw converter resolution. Applications include strain-gauge conditioning, thermocouple front ends with cold-junction compensation math, and power-quality meters computing RMS values in real time. The 51 I/O and CAN support multi-sensor nodes sharing one network. For best results, follow Microchip's analog layout guidance: short, guarded traces to the op-amp inputs and solid ground planes beneath the analog section.
Recommended
Embedded Control and Robotics
Robotic joint controllers and mobile-robot main boards benefit from the DSPIC33EP64MC506-I/MR's combination of encoder interfaces (QEI), high-resolution PWM, and DSP headroom for kinematics calculations. Each DSC can close servo position, velocity, and current loops at kilohertz rates while reporting status over CAN to a higher-level controller - a common distributed robot architecture. The 51 I/O lines drive auxiliary peripherals such as ultrasonic sensors, limit switches, and status indicators. The industrial temperature rating covers outdoor and factory robot environments. Design tip: distribute servo control across multiple dsPIC33EP MC nodes over the CAN bus rather than centralizing, exploiting the deterministic 70 MIPS core per axis and reducing wiring harness complexity.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64MC506-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64MC506-E/MR | DSPIC33EP128MC506-I/MR | DSPIC33EP256MC506-I/MR | DSPIC33EP32MC506-I/MR | DSPIC33EP64GP506-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS, 16-bit dsPIC33E | 70 MIPS, identical | 70 MIPS, identical | 70 MIPS, identical | 70 MIPS, identical | 70 MIPS, identical |
| Flash Memory | 64 KB | 64 KB | 128 KB | 256 KB | 32 KB | 64 KB |
| Motor Control PWM (MCPWM) | Yes | Yes | Yes | Yes | Yes | No (GP family - standard PWM) |
| Quadrature Encoder Interface | Yes | Yes | Yes | Yes | Yes | No |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
| Temperature Range | -40C to +85C (industrial) | Extended (-E suffix) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Dedicated motor-control peripheral set (vs DSPIC33EP64GP506-I/MR)
- Extended-temperature drop-in option (vs DSPIC33EP64MC506-E/MR)
- Pin-compatible memory upgrade path (vs DSPIC33EP256MC506-I/MR)
- On-chip analog integration (vs DSPIC33EP32MC506-I/MR)
Design Notes
Supply the DSPIC33EP64MC506-I/MR from a clean 3V to 3.6V rail (nominal 3.3V). Place 0.1uF ceramic decoupling capacitors at every VDD pin, within 2 mm of the pin, plus one bulk 10uF capacitor per power domain. Follow the datasheet VCAP pin requirements exactly - the internal regulator capacitor is mandatory and miswiring it is a common bring-up failure. Avoid routing switching-node traces under the VQFN; motor-control designs with 48V or higher bus voltages should keep the DSC ground island separate from the power ground with a single-point connection.
The 64-pin VQFN (9x9 mm) requires an exposed thermal pad land pattern per Microchip's package outline drawing; connect this pad to ground with a 4x4 or larger via array for both thermal dissipation and signal-integrity grounding. Soldering the center pad is essential for reliable ground return of the 51 I/O lines. For prototype assembly, stencil 70-80% paste coverage on the pad to avoid floating the die; excessive paste causes the part to self-align onto paste bumps and lift pins off their lands during reflow.
The -I suffix designates the industrial temperature range (-40C to +85C); do not substitute the E-suffix or I-suffix parts interchangeably in designs validated only at room temperature without reviewing extended-range electrical parameters. The 64MC506 is NOT footprint-compatible with the /PT TQFP variant - confirm the correct suffix (MR vs PT) on your BOM before PCB release. Firmware must configure peripheral pin-select and ADC/PWM mapping at reset; unconfigured analog pins default to analog mode and will not read digital inputs, a frequent first-firmware surprise.
When using the MCPWM module to drive IGBT or SiC gate drivers, insert at least 33 ohm series resistors on PWM outputs near the DSC to damp ringing from gate-driver input capacitance, and route PWM pairs with ground return spacing. Keep QEI encoder inputs (phase A/B) away from PWM and gate-driver traces; consider RC filters (1k/100pF) on long encoder cables. The four on-chip comparators used for overcurrent trip should have their inputs routed short and direct, with the trip output asserted before software can react - verify propagation delay in your protection budget.
Compliance Information
Compliance details were not present in the provided Verified Web Data; confirm RoHS/REACH status on the Microchip product page compliance documentation. Automotive-grade dsPIC33EP variants exist but qualification level for this exact ordering code must be verified with Microchip.
