DSPIC33EP64MC506-E/MR - 16-bit 60 MIPS DSC 64KB Flash | Microchip
MPN: DSPIC33EP64MC506-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.89 | $48.90 |
| 100 | $4.41 | $441.00 |
| 500 | $4.12 | $2,060.00 |
| 1,000 | $3.86 | $3,860.00 |
DSPIC33EP64MC506-E/MR Overview
A digital signal controller combines the computational architecture of a microcontroller with the DSP capability of a digital signal processor. In the power-management hierarchy, the dsPIC33EP family sits above basic MCUs by adding a DSP engine, high-speed PWM modules, and advanced analog peripherals on one die, making it a single-chip solution for embedded control systems.
Key features include the 16-bit dsPIC33E CPU core running at up to 60 MIPS, motor-control PWM (MCPWM) peripherals, quadrature encoder interface (QEI) inputs, a CAN module for industrial networking, three on-chip operational amplifiers, and four comparators. The -E suffix denotes an extended operating temperature range of -40C to +125C, supporting demanding industrial and automotive-adjacent environments.
Architecturally, the device integrates DSP multiply-accumulate instructions, an optimized interrupt controller for fast context switching, and multiple 16-bit timers (up to 27 general-purpose timers across the family). The 3V to 3.6V supply range matches standard 3.3V rails. The 64-pin VQFN-EP package provides 51 I/O ports in a compact 9x9 mm footprint with 0.90 mm height.
Typical applications include precision motor control (BLDC, PMSM, AC induction), digital power conversion, industrial automation, and sensor signal conditioning where the integrated op-amps reduce external component count.
For design, keep decoupling capacitors close to all VDD pins and route the exposed thermal pad to a ground pour for both thermal and EMC performance.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and comparison data not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64MC506-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64MC506-E/MR (same form factor and footprint) — differing in Operating Temperature, Core, Package, Supply Voltage, Peripheral Trigger Generator.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64MC506-I/MR
✅ Drop-In✓ In Stock
$3.4 / Unit
View Datasheet →DSPIC33EP128MC506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64MC206-E/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.2 / Unit
View Datasheet →DSPIC33EP64MC506-E/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E (16-bit DSC) |
| Maximum Clock Speed | 60 MHz (60 MIPS) |
| Program Memory | 64KB (22K x 24) FLASH |
| SRAM | 8KB |
| Supply Voltage Range | 3 V to 3.6 V |
| I/O Ports | 51 |
| Package | 64-VQFN (9x9 mm), exposed pad |
| Package Height | 0.90 mm |
| Operating Temperature | -40C to +125C (extended, E grade) |
| PWM | Motor Control PWM (MCPWM) |
| Encoder Interface | QEI (Quadrature Encoder Interface) |
| Communication Interfaces | CAN, UART, SPI, I2C |
| On-chip Op-Amps | 3 |
| Comparators | 4 |
| Timers | 16-bit timers (family up to 27 GPT) |
| Mounting Type | Surface Mount |
| Lifecycle Status | ACTIVE |
DSPIC33EP64MC506-E/MR 0.90 mm Pin Configuration Guide
Pin configuration for DSPIC33EP64MC506-E/MR (0.90 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64MC506-E/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64MC506-E/MR is suitable for 6 applications: BLDC/PMSM Motor Control, Digital Power Conversion, Industrial Automation Nodes, Sensor Signal Conditioning, Automotive-Adjacent Embedded Control, Robotics and Motion Control.
BLDC/PMSM Motor Control
The DSPIC33EP64MC506-E/MR is purpose-built for precision motor control. Its dedicated MCPWM module generates complementary PWM pairs with dead-time insertion for three-phase bridges, while the QEI interfaces directly with incremental encoders for rotor position feedback. The three on-chip op-amps amplify shunt current signals and the four comparators provide hardware-level overcurrent trips without CPU latency. Running at 60 MIPS, the core executes field-oriented control (FOC) loops fast enough for low-inductance PMSM motors. The extended -40C to +125C temperature range suits motor drives mounted near power stages where ambient heat is significant.
Recommended
Digital Power Conversion
In digitally controlled switch-mode power supplies, the DSPIC33EP64MC506-E/MR provides high-resolution PWM outputs for buck, boost, and LLC topologies. The 60 MIPS DSP core runs compensator algorithms (PID, 2P2Z) at switching frequencies common in telecom and server power, while on-chip comparators implement cycle-by-cycle current limiting in hardware. The CAN module enables power-system monitoring and control across racks. The integrated op-amps condition current-sense signals, reducing bill-of-material count versus discrete designs. Using the extended-temperature -E grade allows placement near hot rectifier stages in enclosed power supplies where +85C ambient limits are routinely exceeded.
Recommended
Industrial Automation Nodes
For factory automation controllers, the DSPIC33EP64MC506-E/MR combines a CAN interface for fieldbus connectivity, multiple UARTs for RS-485 style links, and 51 I/O lines for sensor and actuator interfacing. The 60 MIPS core handles protocol stacks alongside real-time control tasks, and the DSP engine accelerates filtering of noisy sensor data (FIR/IIR on ADC streams). The QEI input reads encoder feedback from conveyors and positioning stages. Its -40C to +125C rating withstands panel-mounted environments with limited ventilation, and the 3.0V to 3.6V supply integrates directly with standard 3.3V industrial logic rails.
Recommended
Sensor Signal Conditioning
The three integrated operational amplifiers of the DSPIC33EP64MC506-E/MR allow on-chip amplification of low-level sensor signals - thermocouples, strain gauges, and current shunts - before digitization, eliminating external op-amp ICs and board area. The four comparators support window detection and threshold alarms in hardware. The 12-bit ADC pipeline (per family datasheet) samples conditioned signals while the DSP core applies digital filtering at 60 MIPS. The extended temperature range supports sensors mounted on machinery, engines, and outdoor equipment where -40C cold starts and +125C hot spots occur within the same duty cycle.
Recommended
Automotive-Adjacent Embedded Control
The -E extended temperature grade (-40C to +125C) of the DSPIC33EP64MC506-E/MR makes it suitable for severe-environment embedded control in off-highway, agricultural, and heavy equipment applications where full AEC-Q100 documentation may not be mandated but thermal robustness is essential. CAN connectivity supports J1939-style vehicle networks, the MCPWM drives actuators and pump motors, and QEI reads position feedback from hydraulic and steering encoders. The 60 MIPS DSP core runs control loops for electronic throttle, fan speed, and pump pressure regulation within one 64-VQFN package.
Recommended
Robotics and Motion Control
In multi-axis robotics, the DSPIC33EP64MC506-E/MR serves as a per-axis motion controller: the QEI tracks encoder position, MCPWM stages command motor phase voltage, and the 60 MIPS DSP core executes cascaded position/velocity/current loops in real time. Three op-amps condition per-phase current feedback for torque control, and comparators gate PWM outputs on fault detection to protect power stages. On-chip CAN or UART links report status to a central robot controller. The 64-VQFN's 9x9 mm footprint fits dense multi-axis driver boards, and the -E grade tolerates heat soak inside enclosed robot arms.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64MC506-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64MC506-I/MR | DSPIC33EP128MC506-I/MR | DSPIC33EP256MC506-I/MR | DSPIC33EP64MC206-E/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| FLASH Memory | 64KB (22K x 24) | 64KB (22K x 24) | 128KB | 256KB | 64KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Lifecycle Status | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
Key Differentiators
- Extended temperature range for hot environments (vs DSPIC33EP64MC506-I/MR)
- Right-sized memory at lowest cost point (vs DSPIC33EP128MC506-I/MR)
- Full analog integration (3 op-amps, 4 comparators) (vs DSPIC33EP64MC206-E/MR)
Design Notes
The 64-VQFN MR package has a center exposed pad that must be soldered to a ground pour. Use an array of thermal vias (typically 5x5 grid of 0.3 mm vias) under the pad to tie it to internal ground planes. This provides both heat dissipation for the extended -E temperature range and a low-inductance ground return. Follow Microchip QFN assembly guidelines for stencil aperture design - approximately 50-70% paste coverage on the pad avoids voiding and solder beading around the perimeter pins.
Supply the device from a clean 3.3V rail within the 3.0V to 3.6V specification. Place a 0.1uF ceramic decoupling capacitor at every VDD/VDDCORE pin pair, as close to the package as possible, plus at least one 10uF bulk capacitor per rail. The dsPIC33E core can exhibit brown-out anomalies if the rail sags during flash programming - enable the internal brown-out reset (BOR) and set the threshold appropriately for your regulator's droop characteristics during in-circuit programming.
Route PWM outputs to the gate drivers with short, matched traces and series resistors (typically 10-33 ohm) to damp ringing at the 60 MIPS-era edge rates. Keep the QEI encoder inputs away from PWM and CAN routing; use differential receivers for encoder signals longer than about 20 cm. For CAN, terminate the bus at both ends with 120 ohm and place the transceiver within 3 cm of the MCU CAN pins to minimize stub reflections.
The -E extended grade is rated to +125C ambient, but verify your full thermal budget: junction temperature limits still apply and internal power dissipation at 60 MIPS adds to ambient. Do not substitute the -I grade (-40C to +85C) into an -E design without thermal margin analysis. Also confirm that the peripheral set you use (op-amps, comparators, CAN) is present in the specific MC50x variant - pin-compatible family members may differ in analog resource count.
Compliance Information
Compliance status not explicitly stated in provided web data; verify RoHS/REACH status on the Microchip official product page or Microchip environmental documentation.
