DSPIC33EV128GM106T-I/MR - 16-bit 70 MIPS 5V DSC 128KB Flash | Microchip
MPN: DSPIC33EV128GM106T-I/MR ✓ Active| Qty | Unit Price | Extended |
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DSPIC33EV128GM106T-I/MR Overview
A digital signal controller combines the compute throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power management hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33EV family a single-chip solution for motor control, digital power conversion, and sensing systems that require both math throughput and robust industrial I/O.
Key features of the DSPIC33EV128GM106T-I/MR include 5V operation (4.5V to 5.5V supply range), which provides superior noise immunity in harsh electrical environments compared to 3.3V controllers, and Error-Correcting Code (ECC) Flash that protects program memory integrity. The part carries Functional Safety (FuSa) support documentation per Microchip, easing certification-oriented designs. The 64-VQFN 9x9 mm package with exposed pad offers compact surface-mount mounting with good thermal and ground performance.
Architecturally, the dsPIC33EV core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, DMA, and multiple timers, enabling deterministic real-time control loops such as field-oriented motor control and digital power supplies without external signal-processing devices.
Typical applications span appliance motor control, industrial drives, power supplies, and automotive subsystems, all environments where Microchip explicitly positions the 5V 70 MIPS dsPIC33EV family.
Design consideration: at 70 MIPS the core executes at full speed from the 4.5V to 5.5V rail, so decouple the exposed pad ground return carefully and confirm thermal dissipation in the 9x9 mm footprint for heavily loaded I/O.
This page synthesizes distributor listings, family cross-references, and drop-in alternative analysis not found on any single distributor page. Pricing shown reflects distributor data as of 2026-09-26.
Drop-in alternatives for DSPIC33EV128GM106T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV128GM106T-I/MR (same form factor and footprint) — differing in Operating Temperature, Package, RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV128GM106T-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV128GM206T-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV64GM106T-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV256GM106T-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.72 / Unit
View Datasheet →DSPIC33EV128GM106T-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EV DSC core |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (Flash) | 128 KB (43K x 24) with ECC |
| RAM | 8 KB (8K x 8) |
| Supply Voltage Range | 4.5 V to 5.5 V |
| I/O Pins | 53 |
| DMA Channels | 4 |
| Timers | 7 |
| Package | 64-VQFN (9x9 mm), exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial, I suffix) |
| Functional Safety Support | Yes (FuSa variant documentation) |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EV128GM106T-I/MR 64-vqfn (9x9 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV128GM106T-I/MR (64-vqfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV128GM106T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV128GM106T-I/MR is suitable for 6 applications: Appliance Motor Control, Industrial Drives and Automation, Digital Power Supplies, Automotive Subsystems, Sensing and Measurement Equipment, Battery-Powered and Handheld Industrial Tools.
Appliance Motor Control
The DSPIC33EV128GM106T-I/MR fits appliance motor control because its 70 MIPS 16-bit DSP core executes field-oriented control (FOC) loops fast enough for washing machines, fans, and compressors, while the native 4.5V to 5.5V supply withstands the electrically noisy environment inside major appliances. With 53 I/O pins, 7 timers, and 4 DMA channels, a single DSC can generate complementary PWM pairs, sample current-shunt feedback, and handle user-interface I/O without external glue logic. The 128 KB ECC Flash holds sensorless startup and protection algorithms with headroom for OTA-updatable firmware, and ECC protects code integrity against the voltage dips and EMI common in appliance line-power environments. Implementation typically places the DSC between the rectified mains rail's isolated gate-driver stage and Hall/current sensors; unlike a plain MCU, the DSP multiply-accumulate engine keeps the current-loop period short, reducing torque ripple and acoustic noise.
Recommended
Industrial Drives and Automation
In industrial drives and factory automation, the DSPIC33EV128GM106T-I/MR provides the deterministic real-time performance of a DSC with the ruggedness of 5V CMOS I/O. Microchip explicitly targets the dsPIC33EV family at industrial applications, and the part's 70 MIPS throughput supports closed-loop velocity and position control for conveyors, pumps, and servo axes. The 128 KB ECC Flash stores commutation, profiling, and communication stacks, while 8 KB RAM buffers sensor data moved by the 4-channel DMA, keeping CPU cycles free for the control loop. The 64-VQFN 9x9 mm exposed-pad package gives a compact, thermally robust footprint for dense drive boards, and the industrial -40C to +85C rating covers cabinet-mounted electronics. The 5V I/O directly interfaces legacy industrial sensors and optocoupled signals common on 24V systems via simple resistor networks, reducing BOM complexity versus 3.3V controllers that require level translation.
Recommended
Digital Power Supplies
The DSPIC33EV128GM106T-I/MR suits digitally controlled AC-DC and DC-DC power supplies because the 70 MIPS dsPIC33EV core closes voltage- and current-mode feedback loops with DSP-grade math, implementing nonlinear control laws that analog compensators cannot. The 7 timers generate high-resolution PWM with phase-shifted or interleaved topologies, and the 4 DMA channels stream ADC samples into RAM without CPU intervention, keeping loop latency predictable. The 5V supply range (4.5V to 5.5V) is an advantage in power-supply environments where auxiliary rails are noisy and where 5V logic interfaces directly to gate drivers and housekeeping ICs. The 128 KB ECC Flash allows feature-rich firmware including PMBus-style telemetry and fault logging with code-integrity protection. Designers should budget CPU time so the control ISR completes well within the switching period; the exposed-pad VQFN provides a low-inductance ground return critical for clean ADC readings near switching circuitry.
Recommended
Automotive Subsystems
Microchip positions the dsPIC33EV family, including functional-safety (FuSa) supported parts like the DSPIC33EV128GM106T-I/MR, for automotive applications. The 5V operating range matches the 5V sensor and LIN-style signaling common in vehicles, and the wide-temperature industrial grade plus FuSa documentation support body electronics, pump control, and actuator designs that must eventually pass functional-safety assessment. The 70 MIPS core handles sensor fusion such as throttle-position and current feedback processing, while 53 I/O pins drive relays, H-bridges via pre-drivers, and indicator loads. The 128 KB ECC Flash directly addresses the bit-flip robustness expected in automotive program memory, and 8 KB RAM supports diagnostic buffers. For production automotive programs, select the AEC-Q-qualified ordering variants of the same die; the FuSa collateral available for this family reduces documentation overhead when integrating the DSC into safety-related subsystems with ASIL-rated software architectures.
Recommended
Sensing and Measurement Equipment
The DSPIC33EV128GM106T-I/MR is a strong fit for embedded sensing and bench measurement products that need DSP post-processing at the point of capture. The 70 MIPS pipeline computes FFTs, RMS windows, and digital filtering on-stream, while DMA moves ADC data to the 8 KB RAM buffer without core stalls, enabling continuous monitoring rather than burst sampling. The 53 I/O pins handle multiplexer control, relay switching, and communication front-ends, and the 5V I/O directly drives LED annunciators and optocouplers used in isolated measurement front-ends. The 128 KB ECC Flash stores calibration tables and compensation firmware with code-integrity assurance appropriate for instruments whose readings feed compliance processes. In a typical implementation the DSC sits behind an analog front end, digitizing at fixed rate and returning processed values over UART/SPI to a host; the exposed-pad VQFN ground keeps analog return paths short, improving effective noise-free resolution.
Recommended
Battery-Powered and Handheld Industrial Tools
For cordless industrial tools and handheld test devices, the DSPIC33EV128GM106T-I/MR provides one-chip control of brushed or brushless motors plus user interface, supported by its 7 timers for PWM and 53 I/O for switches, LEDs, and displays. Although the core itself is not ultra-low-power, dsPIC33EV devices offer low-power modes that help with standby current between operations, and the 4.5V to 5.5V supply range suits 4-cell NiMH or regulator-buffered battery stacks commonly found in professional tools. The 70 MIPS DSP core enables sensorless motor startup and load-adaptive torque control that improves runtime per charge, while the 128 KB ECC Flash supports field-updatable firmware with protection against corruption during battery removal. The compact 64-VQFN 9x9 mm footprint fits the dense trigger-and-display PCBs typical of handheld form factors; designers should verify thermal spreading through the exposed pad given the enclosed, low-airflow housing of such tools.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV128GM106T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV128GM106T-E/MR | DSPIC33EV128GM206T-I/MR | DSPIC33EV64GM106T-I/MR | DSPIC33EV256GM106T-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm), exposed pad | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128 KB (ECC) | 128 KB (ECC) | 256 KB (ECC) | 64 KB (ECC) | 256 KB (ECC) |
| RAM | 8 KB | 8 KB | 16 KB | 8 KB | 16 KB |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Temperature Range | -40C to +85C (I) | Extended (-E grade) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| DMA Channels | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Native 5V operation for harsh environments (vs STM32F3 series)
- ECC Flash for code integrity (vs DSPIC33EV64GM106T-I/MR)
- Extended-temperature pin-compatible upgrade path (vs DSPIC33EV128GM106T-E/MR)
Design Notes
Power the DSPIC33EV128GM106T-I/MR from a regulated 5V rail held within 4.5V to 5.5V at 70 MIPS. Place 0.1 uF ceramic decoupling capacitors at each VDD pin plus one bulk 4.7-10 uF capacitor near the device; keep decoupling loops short to the VQFN's exposed pad, which should be soldered to a solid ground plane for both thermal relief and low-inductance ground return. Verify brown-out behavior: the ECC Flash protects code, but a decaying 5V rail during mains dip should be caught by the brown-out/reset module so control outputs fail safely.
The 64-VQFN 9x9 mm exposed-pad footprint requires an matching PCB land pattern with via array under the pad (typically 4x4 or 5x5 grid of 0.3 mm vias) to solder the thermal/ground pad reliably. Use 0.5 mm pitch for the perimeter lands and follow Microchip's QFN landing-pattern recommendation in the family datasheet. For rework, note QFN packages are harder to inspect - design test points on the 53 I/O signals you actually use, since hidden perimeter joints cannot be probed visually after assembly.
Do not confuse ordering suffixes: T = Tape & Reel, I = -40C to +85C industrial, E = extended temperature, MR = 64-VQFN 9x9 package. Firmware is portable across the dsPIC33EV128GM106 family regardless of packaging option, but the -E part may behave differently at hot extremes of your test matrix only in specification margin, not functionality. When migrating between GM106 and GM206/GM64 parts on the same footprint, re-check the RAM linker script since RAM sizes differ (8 KB vs 16 KB) and DMA buffer overflows can fail silently.
Compliance Information
RoHS/REACH/lead-free declarations were not captured in the retrieved source data for this exact ordering code; obtain compliance certificates from Microchip's product page or distributor compliance documents. FuSa (Functional Safety) support documentation is noted in DigiKey's listing.
