DSPIC33EP128GP506-I/MR - 16-bit 70 MIPS DSC 128KB | Microchip
MPN: DSPIC33EP128GP506-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.75 | $4.75 |
| 10 | $4.28 | $42.80 |
| 100 | $3.85 | $385.00 |
| 500 | $3.6 | $1,800.00 |
| 1,000 | $3.42 | $3,420.00 |
DSPIC33EP128GP506-I/MR Overview
A digital signal controller combines the computational horsepower of a digital signal processor with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, DSCs sit between general-purpose MCUs and dedicated DSPs, making them the controller of choice for digital power conversion, motor control, and precision sensing systems that require fast multiply-accumulate (MAC) and DSP-style instructions.
Key features of the dsPIC33EP128GP506 include the 70 MIPS dsPIC33E core, high-speed PWM peripherals, integrated operational amplifiers, analog comparators, a Peripheral Trigger Generator (PTG), and enhanced CAN communication. The advanced analog front end and CTMU (Charge Time Measurement Unit) support precise timing and touch-sensing functions. According to the Microchip product page, the family is positioned as 16-Bit DSC, Hi-Speed PWM, Op Amps, Advanced Analog.
The dsPIC33EP core executes DSP multiply-accumulate instructions in a single cycle with dual operand fetch, enabling digital filter algorithms and high-speed precision control loops. On-chip features include In-Circuit and In-Application Programming (ICSP/IAP), two program and two complex data breakpoints, and IEEE 1149.2-compatible (JTAG) boundary scan, trace, and run-time watch for debug.
Typical applications include digital power supplies (PFC, LLC), brushless DC and PMSM motor control, solar inverters, UPS systems, and industrial sensing where the integrated op amps reduce external component count. The industrial temperature grade (-I suffix) covers -40C to +85C operation.
When designing with this device, all VDD and VSS pins must be connected, and programming requires a matched PGECx/PGEDx pair; if one pin of the pair is not connected, ICSP programming may fail, per Microchip documentation.
This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128GP506-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GP506-I/MR (same form factor and footprint) — differing in Package, Operating Temperature, Core, Packaging, Communication Interfaces.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP128GP506-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GM306-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33EP128MC506-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK128MP506-E/MR
✅ Drop-In✓ In Stock
$4.42 / Unit
View Datasheet →DSPIC33EP128GP506-I/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E (16-bit DSC) |
| Performance | 70 MIPS |
| Core Clock Frequency | 60 MHz |
| Program Memory (Flash) | 128KB (43K x 24) |
| RAM | 16KB |
| Package | 64-VQFN (9x9 mm), exposed pad |
| Pin Count | 64 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Integrated Peripherals | High-Speed PWM, Op Amps, Comparators, PTG, CAN, CTMU |
| Communication Interfaces | CAN, UART, SPI, I2C |
| Debug / Boundary Scan | IEEE 1149.2 Compatible (JTAG) |
| Programming | In-Circuit and In-Application Programming (ICSP/IAP) |
| Breakpoints | 2 program and 2 complex data breakpoints |
| Lifecycle Status | In Production |
| Packaging | Tube (per distributor data) |
DSPIC33EP128GP506-I/MR 64-vqfn (9x9 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP128GP506-I/MR (64-vqfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GP506-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GP506-I/MR is suitable for 6 applications: Digital Power Supplies, Motor Control Drives, Industrial Sensing and Data Acquisition, Solar Inverters and UPS, Automotive-Adjacent Body and Comfort Systems, Audio and Signal Processing Equipment.
Digital Power Supplies
In digitally controlled AC-DC and DC-DC power supplies (PFC stages, LLC converters, telecom rectifiers), the DSPIC33EP128GP506-I/MR executes fast voltage- and current-loop control at 70 MIPS with single-cycle DSP MAC instructions, allowing loop bandwidths that discrete analog control struggles to match. The high-speed PWM module supplies fine duty-cycle resolution for soft-switching topologies, while integrated op amps and comparators handle current-sense amplification and cycle-by-cycle overcurrent protection with minimal external parts. The CAN interface enables digital-power bus management, and In-Application Programming allows firmware-based feature upgrades in the field.
Recommended
Motor Control Drives
For sensorless BLDC and PMSM drives, the DSPIC33EP128GP506-I/MR combines a 70 MIPS core with high-speed PWM outputs suited to three-phase inverter gating. Its integrated op amps condition shunt-resistor current feedback for field-oriented control, and the comparators provide fast overcurrent trips independent of CPU load. Although the GP variant lacks the MC-family fault-protected PWM, it still serves fan, pump, and light industrial drive applications. The 128KB Flash accommodates FOC algorithms with parameter estimation, and the 16-bit DSP instruction set executes the Clarke/Park transforms efficiently within tight control-loop deadlines.
Recommended
Industrial Sensing and Data Acquisition
The advanced analog peripherals of the DSPIC33EP128GP506-I/MR - integrated op amps, comparators, CTMU, and high-resolution ADC - make it a compact front end for industrial sensing nodes such as pressure transmitters, load cells, and process monitors. The CTMU supports precise time-domain measurements and capacitive sensing, while the Peripheral Trigger Generator (PTG) automates ADC sampling sequences without CPU intervention, improving determinism. The CAN and UART interfaces connect the node to factory networks, and the industrial -40C to +85C grade matches typical factory-floor environmental specifications for reliable continuous operation.
Recommended
Solar Inverters and UPS
Solar micro-inverters, string optimizers, and UPS systems require simultaneous fast current loops, grid synchronization, and safety supervision - a mix the DSPIC33EP128GP506-I/MR addresses with its 70 MIPS core, high-resolution PWM, and independent comparators. The DSP engine runs PLL grid-lock and MPPT algorithms efficiently, while the multiple communication interfaces report telemetry. The 128KB Flash retains logged diagnostics across brownouts, and In-Application Programming allows grid-code firmware updates without re-flashing the production line, reducing certification friction across regional variants of the same hardware platform.
Recommended
Automotive-Adjacent Body and Comfort Systems
While the -I grade is not AEC-Q100 qualified, the DSPIC33EP128GP506-I/MR is widely used in off-road, agricultural, and industrial-vehicle body electronics such as lighting controllers, wiper modules, and gauge clusters. The CAN interface integrates with vehicle networks, the high-drive-capable GPIOs control lamps and relays, and the 16-bit core handles dash diagnostics. The 64-pin VQFN 9x9 package offers a compact footprint with exposed-pad thermal relief for sealed enclosures, and the extended-temperature -E/MR variant covers engine-bay or sun-exposed mounting locations up to +125C ambient.
Recommended
Audio and Signal Processing Equipment
The single-cycle MAC and dual-operand fetch of the dsPIC33E DSP core make the DSPIC33EP128GP506-I/MR effective for real-time audio processing: active crossover filters, dynamic range compression, and acoustic echo cancellation in conferencing and PA systems. The 128KB Flash holds filter coefficient sets for multiple tuning profiles, switchable in production. Integrated op amps provide analog front-end buffering for microphone or line-level inputs, reducing bill-of-material cost, while UART/SPI links handle volume-control and host communication. The 70 MIPS throughput sustains tens of biquad filter sections at 48 kHz sampling with margin for control tasks.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GP506-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128GP506-E/MR | DSPIC33EP256GP506-I/MR | DSPIC33EP64GP506-I/MR | DSPIC33EP128MC506-I/MR | DSPIC33CK128MP506-E/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Performance (MIPS) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 100 MIPS |
| Flash Memory | 128KB (43K x 24) | 128KB | 256KB | 64KB | 128KB | 128KB |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C |
| Peripheral Emphasis | GP: Hi-Speed PWM, Op Amps, CAN, PTG | GP (same peripheral set) | GP (same, larger Flash) | GP (same, smaller Flash) | MC: motor-control PWM | CK: 100MIPS core, refreshed ADC |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production | In Production |
Key Differentiators
- Industrial vs extended temperature trade-off (vs DSPIC33EP128GP506-E/MR)
- GP analog richness vs MC motor PWM (vs DSPIC33EP128MC506-I/MR)
- Flash headroom growth path (vs DSPIC33EP256GP506-I/MR)
- Proven EP ecosystem vs newer CK core (vs DSPIC33CK128MP506-E/MR)
Design Notes
Connect ALL VDD and VSS pins on the 64-VQFN package, even if electrical operation appears fine with one pin floating - per Microchip documentation, leaving any VDD/VSS unconnected can cause ICSP programming to fail. Solder the exposed pad to a solid ground plane with an array of thermal vias; this is both the primary heat-removal path and the main ground return for the ADC and PWM drivers.
Programming requires a matched PGECx/PGEDx pair: if PGEC2 is used for ICSPCLK, ICSPDAT must connect to PGED2. Mixing pins from different pairs causes intermittent or failed programming. When laying out the programming header, pick one pair, route it short and direct, and document it in the schematic - retrofitting a different pair on an assembled board is difficult.
Estimated: dsPIC33EP core current at 70 MIPS is on the order of tens of mA per Microchip family data, so power dissipation in the VQFN is small (<0.5 W), and the exposed pad via array is adequate for most applications. Decouple each VDD pin with 100 nF placed within 2 mm, plus one 4.7-10 uF bulk capacitor near the package. Keep VDDCORE decoupling per datasheet requirements for the internal regulator.
For high-speed PWM outputs driving gate drivers, keep PWM traces short and series-terminate 22-33 ohms if trace lengths exceed ~10 cm to control ringing. Route analog sensing (op amp/comparator inputs) away from PWM and CAN lines, and use the CTMU/op-amp pins with guard traces in high-impedance circuits to minimize leakage and crosstalk.
Compliance Information
RoHS/lead-free status inferred from Microchip standard product policy for current-production dsPIC33EP devices; the -I grade is industrial, not AEC-Q100 automotive qualified. Confirm REACH and conflict-mineral declarations on the Microchip product page.
