DSPIC33EV32GM006T-I/MR - 16-bit 70 MIPS 32KB DSC | Microchip
MPN: DSPIC33EV32GM006T-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.42 | $4.42 |
| 10 | $3.98 | $39.80 |
| 100 | $3.54 | $354.00 |
| 500 | $3.16 | $1,580.00 |
| 1,000 | $2.82 | $2,820.00 |
DSPIC33EV32GM006T-I/MR Overview
A digital signal controller combines the compute architecture of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP: it executes control loops and signal-processing algorithms in a single chip. The dsPIC33EV family is Microchip's 5V-tolerant DSC line, targeted at harsh-environment industrial, appliance, and automotive applications where 5V I/O interfaces remain standard.
Key features of the DSPIC33EV32GM006T-I/MR include a 16-bit dsPIC DSC core clocked up to 70 MIPS, 32KB self-programming Flash, 4KB RAM, 4 DMA channels for data movement without CPU overhead, and 7 timers. The device supports Functional Safety (FuSa) documentation packages, making it suitable for safety-oriented designs. The 5V operating rating eliminates level-shifting in legacy industrial buses and sensor interfaces.
Architecturally, the dsPIC33EV core uses a modified Harvard bus structure with separate program and data paths, DSP multiply-accumulate (MAC) instructions, and division support, enabling efficient execution of filters, transforms, and closed-loop control algorithms at full 70 MIPS throughput.
Typical applications include motor control (BLDC, PMSM, ACIM), digital power supplies and lighting, automotive body and comfort modules, and industrial appliances that must interface directly to 5V sensors and actuators.
Design consideration: at 70 MIPS the core runs from a PLL-multiplied internal oscillator; budget PCB space for a stable 3.3V core regulator supply (on-chip regulator requires a recommended external capacitor) and follow Microchip's decoupling guidelines for the 64-VQFN exposed pad.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet. Pricing shown is as of 2026-09-26.
Drop-in alternatives for DSPIC33EV32GM006T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV32GM006T-I/MR (same form factor and footprint) — differing in Package, Operating Temperature, Supply Voltage, Core Architecture, Product Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV256GM106T-I/MR
✅ Drop-In✓ In Stock
$3.72 / Unit
View Datasheet →DSPIC33EV256GM006-I/MR
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33EV128GM106T-I/PT
✅ Drop-In✓ In Stock
$3.86 / Unit
View Datasheet →DSPIC33EV32GM006-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV64GM006-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.95 / Unit
View Datasheet →DSPIC33EV16GM006-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV32GM006T-I/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EV 16-bit DSC core |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 32KB (11K x 24) Flash |
| RAM Size | 4KB |
| Supply Voltage | 5V (single supply) |
| DMA Channels | 4 |
| Timers | 7 |
| Package | 64-VQFN (9x9 mm), exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Functional Safety | FuSa support package available |
| Packaging | Tape & Reel (T suffix) |
| Product Family | dsPIC33EV Digital Signal Controllers |
DSPIC33EV32GM006T-I/MR 64-vqfn (9x9 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV32GM006T-I/MR (64-vqfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV32GM006T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV32GM006T-I/MR is suitable for 6 applications: BLDC/PMSM Motor Control, Digital Power Supplies, Automotive Body and Comfort Modules, Industrial Appliances, Sensor Signal Conditioning and Data Acquisition, LED Lighting and Electronic Ballasts.
BLDC/PMSM Motor Control
The DSPIC33EV32GM006T-I/MR fits motor control because its 70 MIPS 16-bit DSP core executes field-oriented control (FOC) inner loops in the tens-of-microseconds range, using hardware multiply-accumulate and division support. The 4-channel DMA streams ADC current-sense samples to RAM without CPU intervention, keeping loop jitter low, while 7 timers and the dedicated PWM peripherals generate complementary, dead-time-controlled drive signals for three-phase inverters. In a typical topology the DSC reads phase currents and bus voltage through its ADC, runs Clark/Park transforms and a PI current loop every PWM cycle, and drives gate drivers directly thanks to the 5V I/O rating that removes level-shifting stages. Trade-off: 32KB Flash holds a complete single-motor FOC stack, but complex multi-axis or sensorless observer-heavy firmware may require the 256KB family members.
Recommended
Digital Power Supplies
In digitally controlled AC/DC and DC/DC converters, the DSPIC33EV32GM006T-I/MR closes voltage and current loops at switching frequencies of 100 kHz to several hundred kHz. Its 70 MIPS throughput allows a full compensation-loop iteration per switching period, and DMA-coupled ADC sampling aligns current-mode sensing precisely with the PWM trigger. The 5V core supply matches the bias rails of standard gate drivers and optocoupler feedback stages common in industrial power supplies, reducing component count and improving noise immunity in high dv/dt environments. A software phase-locked loop and housekeeping tasks (fault logging, PMBus-style communication) run in the same 32KB program space for moderate feature sets. Designers should budget Flash carefully: adding nonvolatile fault logs and communication stacks typically pushes designs toward the 64KB or 256KB variants of the same 64-VQFN footprint.
Recommended
Automotive Body and Comfort Modules
The dsPIC33EV family is explicitly targeted by Microchip at automotive applications, and the DSPIC33EV32GM006T-I/MR serves body electronics, lighting control, pump and fan controllers, and sensor conditioning nodes. The wide -40C to +85C industrial grade and 5V I/O tolerate the load-dump-adjacent rail environments of 12V automotive systems after a front-end protection stage. Its 7 timers handle multiplexed LED stepping, LIN-style timed UART communication, and relay/actuator scheduling concurrently, while 4 DMA channels keep sensor sampling deterministic. The Functional Safety (FuSa) documentation support helps teams building modules with functional-safety workflows. Note that the standard 'I' grade part is not itself AEC-Q100 qualified; for temperature-qualified automotive sockets, evaluate the '-E' (extended temperature) family variants and confirm qualification status with Microchip before design-in.
Recommended
Industrial Appliances
Microchip positions the dsPIC33EV family for harsh appliance environments: washing machines, dishwashers, induction cooktops, and compressors. The DSPIC33EV32GM006T-I/MR contributes the motor-control DSP throughput described above plus 5V I/O that connects directly to legacy appliance sensors (NTC dividers, door switches, hall sensors) and 5V user interfaces, eliminating translation logic and improving ESD/noise margin. A single 32KB image typically covers the state machine, the motor/drive loop, and a UART-based user-interface link. The 64-VQFN package provides enough I/O for multiple actuator drivers and encoder inputs, while the exposed thermal pad aids heat spreading inside sealed appliance enclosures with limited airflow. Firmware over-the-air or service updates should reserve a bootloader sector - if the bootloader plus application exceeds roughly 24-28KB, step up to the 64KB or 256KB same-pinout variants.
Recommended
Sensor Signal Conditioning and Data Acquisition
The DSPIC33EV32GM006T-I/MR acts as an integrated signal-conditioning controller: its DSP core applies digital filters (IIR/FIR), RMS calculations, and calibration math to sampled sensor data, while the DMA channels move ADC results to memory buffers without service latency. The 5V analog front-end domain simplifies interfacing with strain-gauge bridges, pressure sensors, and industrial 0-5V or 4-20mA-conditioned signals after basic anti-alias filtering. With 70 MIPS available, real-time notch filtering at multi-kilohertz sample rates leaves ample CPU margin for threshold alarms and a serial telemetry link. In distributed factory nodes, the 64-pin QFN supplies enough GPIO for multiplexer control and per-channel diagnostics. For channels requiring high-resolution conversion, pair the DSC with an external precision ADC over SPI; the DMA engine can service the SPI stream end-to-end.
Recommended
LED Lighting and Electronic Ballasts
Digital lighting power stages - dimmable LED drivers, HID ballasts, and high-brightness industrial luminaires - benefit from the DSPIC33EV32GM006T-I/MR's combination of high-resolution PWM generation, fast ADC feedback, and 5V gate-drive compatibility. The DSC closes current loops per switching cycle at 70 MIPS, implements dimming curves, DALI/DMX-style protocol handling on UART, and protection state machines (open-LED, over-current, over-temperature) within the 32KB Flash envelope. DMA-based sampling keeps the control loop timing deterministic even while communication and fault logging execute concurrently. The 5V I/O levels drive standard MOSFET gate transformers and drivers commonly used at industrial lighting power levels, and the -40C to +85C grade suits enclosed outdoor fixtures. Designs integrating wireless connectivity should move up the same-footprint family to 128KB/256KB parts to accommodate the protocol stack.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV32GM006T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM106T-I/MR | DSPIC33EV256GM006-I/MR | DSPIC33EV64GM006-I/MR | DSPIC33EV128GM106T-I/PT |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | TQFP-64 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Program Memory | 32KB (11K x 24) | 256KB | 256KB | 64KB | 128KB |
| Supply Voltage | 5V | 5V | 5V | 5V | 5V |
| DMA Channels | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- 5V single-supply operation (vs DSPIC33EV256GM106T-I/MR)
- Lowest-cost entry with full 70 MIPS DSP core (vs DSPIC33EV256GM006-I/MR)
- Memory-scalability within one footprint (vs DSPIC33EV64GM006-I/MR)
Design Notes
The dsPIC33EV operates from a single 5V supply but generates an internal 3.3V core rail via an on-chip regulator. Per Microchip's family datasheet power section, a low-ESR capacitor must be connected to the VDDCORE/VCAP pin close to the package - do not omit it or the core may brown out at 70 MIPS operation. Decouple each VDD/VSS pair with 0.1uF ceramics plus one bulk 4.7-10uF capacitor. Estimated: total core + I/O current at 70 MIPS is typically tens of mA, so a 500 mA 5V LDO stage is generally sufficient for the DSC alone.
The exposed pad on the 64-VQFN (9x9) is the primary thermal and ground return path. Solder it to a grounded copper pour with an array of thermal vias (e.g., 5x5 grid of 0.3 mm vias) rather than leaving it floating; this reduces junction-to-ambient resistance significantly and improves ground integrity for the ADC and PWM peripherals. Estimated: with a solid 25x25 mm pour on a 2-layer board, theta_JA typically drops by several tens of C/W versus a floating pad, per Microchip thermal app note guidance.
Do not mix up package variants when sourcing: the /MR suffix is the 64-VQFN, while /PT, /P8, /ML, /M5 denote different packages with different footprints - they are not interchangeable without a respin. Also verify Flash density before finalizing the bootloader: with 32KB total, reserve at least one erase page for the bootloader and keep application code under roughly 24-28KB to leave room for a firmware update image. Configure configuration-word settings (oscillator, watchdog, code protection) carefully, as incorrect configuration bits are a leading cause of non-starting dsPIC boards.
Compliance Information
Distributor listings confirm standard Microchip lead-free packaging, but explicit RoHS/REACH certificates were not present in the retrieved web data - verify on the Microchip product page. The standard 'I' grade part is not AEC-Q100 qualified per available data; Microchip offers dsPIC33EV automotive variants for qualified sockets.
