DSPIC33FJ09GS302-I/TL - 16-bit DSC 40 MIPs 9KB Flash | Microchip
MPN: DSPIC33FJ09GS302-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.7 | $370.00 |
| 500 | $3.35 | $1,675.00 |
| 1,000 | $3.02 | $3,020.00 |
DSPIC33FJ09GS302-I/TL Overview
A digital signal controller combines the compute architecture of a microcontroller with the mathematical throughput of a DSP. In the power-management hierarchy, the dsPIC33F family sits between general-purpose MCUs and dedicated DSPs, offering single-cycle multiply-accumulate (MAC) and DSP-style instructions for control loops such as digital power conversion, while retaining MCU peripherals like UART, SPI, and I2C for system communication.
Key features include a 16-bit dsPIC core rated at 40 MIPs, an on-chip 8-channel 10-bit ADC, two 10-bit DACs, and multiple communication interfaces (I2C, SPI, UART). The industrial temperature rating of -40C to +85C (the -I suffix) supports deployment in harsh environments, and 5V-tolerant I/O pins simplify interfacing with legacy 5V logic.
Technically, the GS302 belongs to Microchip's SMPS-focused dsPIC33FJ GS family, which integrates a high-speed PWM module purpose-built for switching power supplies. This makes the device well suited to closed-loop converter control where the ADC samples feedback and the PWM module adjusts duty cycles at high rates. In-circuit and in-application programming (ICP/IAP), plus a Class B safety library and IEEE 1149.2-compatible JTAG boundary scan on family members, support functional-safety-oriented designs.
Typical applications include interleaved power factor correction (PFC) - Microchip publishes a 350W interleaved PFC reference design around this family - digital AC/DC and DC/DC power supplies, battery chargers, lighting ballasts, and motor control front ends.
When designing with this device, budget the 3.3V supply rail and plan decoupling on all VDD/VDDCORE pins per the datasheet connection diagram, since the 36-pin VTLA thermal pad also serves as the VSS ground return.
This page synthesizes distributor pricing, family cross-reference data, and practical design guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33FJ09GS302-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ09GS302-I/TL (same form factor and footprint) — differing in Package, DAC, Supply Voltage, Comparators, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ09GS302-E/TL
✅ Drop-In✓ In Stock
$2.85 / Unit
View Datasheet →DSPIC33FJ09GS302-I/TL Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33F (16-bit) |
| Max Speed | 40 MIPs |
| Program Memory Size | 9KB (3K x 24) Flash |
| RAM Size | 1KB |
| Supply Voltage | 3.3 V (1.8V-class core per FindIC listing) |
| ADC Resolution | 10-bit, 8 channels |
| DAC | 2 x 10-bit |
| Communication Interfaces | I2C, SPI, UART |
| Operating Temperature | -40C to +85C (TA) |
| Package | 36-VTLA (5x5 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Packaging | Tube |
| Series | dsPIC 33F (GS family, SMPS-focused) |
| I/O Sink/Source Current | 18 mA on 8 pins and 6 mA on 13 pins (family spec) |
| 5V Tolerant I/O | Yes (family feature) |
| Programming | ICSP / In-Application Programming |
| Debug | 2 breakpoints, IEEE 1149.2-compatible JTAG boundary scan (family feature) |
| Safety | Class B Safety Library available (family feature) |
| Lifecycle Status | In Production (per Microchip product page) |
DSPIC33FJ09GS302-I/TL 36-vtla (5x5 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33FJ09GS302-I/TL (36-vtla (5x5 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ09GS302-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ09GS302-I/TL is suitable for 6 applications: Interleaved Power Factor Correction (PFC), Digital AC/DC and DC/DC Power Supplies, Battery Chargers, Digital Lighting Ballasts and LED Drivers, Motor Control Front Ends, Solar Micro-Inverter and Renewable Energy Conversion.
Interleaved Power Factor Correction (PFC)
The DSPIC33FJ09GS302-I/TL is a natural fit for interleaved PFC because its GS-family high-speed PWM module generates multiple phase-shifted drive outputs while the 8-channel 10-bit ADC samples input current, bus voltage, and temperature for closed-loop control at 40 MIPs. Microchip's official Interleaved PFC reference design uses this controller family with a universal AC input to produce a single high-voltage DC output up to 350W. The dual 10-bit DACs provide on-chip comparators with reference thresholds for cycle-by-cycle current limiting without external components. Placed as the supervisory controller between the rectified input stage and the boost switches, the DSC implements average-current-mode control with duty-cycle updates each switching period, achieving high power factor and low THD while retaining firmware-based protection flexibility that analog controllers cannot match.
Recommended
Digital AC/DC and DC/DC Power Supplies
In switched-mode power supplies, the DSPIC33FJ09GS302-I/TL replaces dedicated analog PWM controllers with a programmable solution: the 40 MIPs dsPIC core executes voltage-mode or current-mode compensation loops while the dedicated high-speed PWM module sets switching frequency, dead time, and complementary outputs. The 8-channel 10-bit ADC reads output voltage, current sense, and input feed-forward signals, and the two 10-bit DACs feed on-chip comparators for fast overcurrent protection paths that bypass software latency. Because control parameters live in firmware, one hardware platform can serve multiple output ratings, easing product families and field tuning. The 9KB Flash is sufficient for a complete control loop plus housekeeping, communication via UART for PMBus-like telemetry, and a boot loader for in-field firmware updates through in-application programming.
Recommended
Battery Chargers
Smart battery charging benefits directly from the DSPIC33FJ09GS302-I/TL's blend of DSP throughput and MCU peripherals. The controller implements CC/CV charging profiles, taper detection, and temperature-qualified charging using the 10-bit ADC to monitor battery current and voltage, while the high-speed PWM drives the buck or flyback power stage. The 10-bit DACs and comparators provide hardware-based overvoltage and overcurrent trip points independent of software, meeting safety expectations for lithium chemistries. At 40 MIPs, the core has ample headroom to run coulomb counting, charge-state estimation, and fault logging simultaneously. The 36-pin VTLA package provides enough I/O for LED status indicators, button input, and I2C communication to a fuel gauge or host system, all within a compact 5x5 mm footprint suitable for charger PCBs.
Recommended
Digital Lighting Ballasts and LED Drivers
Electronic ballasts and high-power LED drivers require precise, phase-controlled switching with dimming resolution - tasks the GS302's high-speed PWM module handles natively with fine duty-cycle and phase control. The 10-bit ADC samples lamp or LED string current for closed-loop regulation, sustaining constant-current output despite input variation, while the 40 MIPs core executes compensation and DALI/UART-style communication concurrently. The dual 10-bit DAC comparator path delivers sub-microsecond overcurrent shutdown, protecting expensive LED strings during transients. Firmware control also enables soft-start, lamp-end-of-life detection, and adaptive dimming curves that are costly to implement in pure analog designs. With the 36-pin VTLA exposed-pad package providing good thermal coupling to the PCB, the controller suits sealed LED driver housings operating at -40C to +85C ambient.
Recommended
Motor Control Front Ends
The DSPIC33FJ09GS302-I/TL serves as the digital controller for small motor drives such as fan, pump, and compressor inverters. Its high-speed PWM generates three-phase or single-phase complementary outputs with programmable dead time, and the 8-channel 10-bit ADC can time-sample DC bus current and back-EMF feedback for sensorless control schemes at 40 MIPs - enough to execute field-oriented or block-commutation loops with fast inner current regulation. The dual 10-bit DAC comparators implement hardware overcurrent trips to protect power MOSFETs or IGBTs during rotor-locked or stall events. The UART enables host communication for speed commands and diagnostics, while in-application programming allows firmware field updates. The -40C to +85C industrial rating covers unventilated appliance environments where ambient temperatures approach the upper industrial limit.
Recommended
Solar Micro-Inverter and Renewable Energy Conversion
Grid-tied and off-grid renewable conversion stages use the DSPIC33FJ09GS302-I/TL for maximum-power-point tracking (MPPT) and inverter modulation. The 40 MIPs core runs MPPT perturb-and-observe algorithms while the high-speed PWM drives boost and DC-AC stages with precisely phase-shifted outputs. The 10-bit ADC samples panel voltage/current and grid waveforms for synchronization, and the DAC-comparator hardware path protects against overcurrent during grid transients. Microchip's SMPS-focused GS family documentation, including the 350W interleaved PFC reference design, transfers directly to solar input stages sharing the same boost topology. The 9KB Flash accommodates MPPT, grid monitoring, anti-islanding logic hooks, and a UART telemetry link in one device, reducing BOM count compared to separate controller and supervisor ICs in the power stage.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ09GS302-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ09GS302-E/TL |
|---|---|---|
| Package | 36-VTLA (5x5 mm) Exposed Pad | 36-VTLA (5x5 mm) Exposed Pad - same |
| Brand | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33F, 40 MIPs | dsPIC33F, 40 MIPs |
| Flash / RAM | 9KB (3K x 24) / 1KB | 9KB (3K x 24) / 1KB |
| ADC | 8 x 10-bit | 8 x 10-bit |
| DAC | 2 x 10-bit | 2 x 10-bit |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) |
| Packaging / Lifecycle | Tube, In Production | Tube, In Production |
Key Differentiators
- Identical die with wider temperature window (vs DSPIC33FJ09GS302-E/TL)
- SMPS-dedicated PWM with dual 10-bit DAC comparators (vs DSPIC33FJ06GS202)
- Honest limitation - no cross-brand drop-in exists (vs Any competitor DSC)
Design Notes
The exposed pad on the 36-pin VTLA (5x5 mm) package is not optional thermal relief - on dsPIC33F GS devices it connects to VSS. Create a grounded land pattern under the package with an array of thermal vias (typically 3x3 or 4x4, 0.3 mm drill) stitching to internal ground planes. Follow the minimal pin-connection set described in the getting-started section of the Microchip datasheet (DS-75018B): decouple every VDD pin with 0.1 uF ceramics placed within 2 mm of the pin, and connect VDDCORE per the datasheet diagram. Skipping the exposed-pad solder often causes intermittent ground returns that appear as ADC noise or PWM glitches.
Plan for inrush and sequencing on the 3.3V rail. The dsPIC33F family operates from a 3.0V to 3.6V supply with a 1.8V-class internal core regulator; hold the MCLR pin low until the supply is stable, or use a supervisor, to guarantee a clean reset. Estimated: with roughly 20 digital I/O at 6-18 mA family drive capability, worst-case pin currents plus core consumption should be budgeted against your 3.3V regulator's thermal margin - a 250 mA load is a reasonable starting estimate for fully loaded I/O plus core activity.
Do not assume 5V-tolerant I/O means 5V-powered: the GS302 runs at 3.3V and only the specified pins tolerate 5V logic levels - check the datasheet pin table before interfacing legacy 5V buses. Second, the SMPS PWM module has hardware limits on dead-time resolution; verify the minimum dead time against your gate-driver propagation delays to avoid shoot-through in half-bridge stages. Finally, when using in-application programming, reserve the required Flash pages for your boot loader so field updates cannot overwrite the compensation tables or calibration constants stored in the 9KB program memory.
Compliance Information
Family data (LCSC listing for DSPIC33FJ09GS302-I/SP) references an AEC-Q100 REVG Grade 1 plan for the GS family; the -I/TL ordering code itself is rated -40C to +85C and its individual RoHS/REACH status was not stated in the provided data. Verify compliance certificates with Microchip before automotive or regulated-market use.
