DSPIC33FJ256GP510A-I/PF - 16-bit 40MIPS DSC 256KB Flash | Microchip
MPN: DSPIC33FJ256GP510A-I/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.8 | $10.80 |
| 10 | $10.26 | $102.60 |
| 100 | $9.72 | $972.00 |
| 500 | $9.18 | $4,590.00 |
| 1,000 | $8.64 | $8,640.00 |
DSPIC33FJ256GP510A-I/PF Overview
A digital signal controller combines the control peripherals of a microcontroller with the computational throughput of a DSP core in a single device. In the power-management hierarchy, the dsPIC33F family sits between general-purpose MCUs (such as PIC18) and dedicated DSPs, offering single-cycle MAC, DSP multiply-divide, and hardware divide support while retaining MCU-style interrupt latency and peripheral sets. This hybrid architecture makes dsPIC33F DSCs a default choice for real-time control loops.
Key features of the DSPIC33FJ256GP510A include a 16-bit modified Harvard architecture core running at up to 40 MIPS from a 3.0V to 3.6V supply, 256 KB (256K x 8) self-programming Flash, and an advanced analog portfolio including a high-speed 10-bit/12-bit ADC with multiple sample-and-hold circuits. The device also integrates UART, SPI, I2C, ECAN, and multiple 16-bit timers plus output-compare/input-capture channels for motor and power-conversion timing.
The -I suffix denotes the industrial temperature range (-40C to +85C) and the Arrow listing confirms the dsPIC33FJ family carries AEC-Q100 qualification, supporting automotive deployments. In-circuit serial programming (ICSP) via any PGECx/PGEDx pair, supported by MPLAB X IDE, MPLAB XC-DSC compiler, and MPLAB Snap/ICD programmers, allows field firmware updates without pre-programming. Development can start on the Explorer 16/32 Development Board with a dsPIC PIM.
Typical applications include switch-mode power supplies and digital power conversion, sensorless BLDC/PMSM motor control, automotive body and convenience modules, and industrial sensing nodes that fuse ADC sampling with DSP filtering routines such as FIR/IIR.
Design consideration: the core runs at 3.3V only - level-shift any 5V digital interfaces, and connect all VDD/VSS pairs as required for ICSP reliability.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33FJ256GP510A-I/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ256GP510A-I/PF (same form factor and footprint) — differing in Operating Temperature, Package, Core Architecture, ADC, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ256GP510A-E/PF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.9 / Unit
View Datasheet →DSPIC33FJ256GP510-I/PF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.98 / Unit
View Datasheet →DSPIC33FJ128GP510A-I/PF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ128MC510A-I/PF
✅ Drop-In✓ In Stock
$8.1 / Unit
View Datasheet →DSPIC33FJ128MC510A-E/PF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.65 / Unit
View Datasheet →DSPIC33FJ256GP510A-I/PF Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33F RISC (modified Harvard) |
| Maximum CPU Speed | 40 MIPS |
| Program Memory | 256 KB (256K x 8) Flash |
| SRAM | up to 30 KB |
| Supply Voltage | 3.0 V to 3.6 V |
| Package | 100-TQFP (14x14 mm) |
| Operating Temperature | -40C to +85C (industrial) |
| Qualification | AEC-Q100 (per Arrow listing for dsPIC33FJ family) |
| Interfaces | UART, SPI, I2C, ECAN |
| Timers | Multiple 16-bit timers with output compare / input capture |
| ADC | High-speed on-chip ADC (advanced analog per datasheet) |
| Programming | ICSP via PGECx/PGEDx pairs (MPLAB Snap/ICD 3) |
| Debugging | In-circuit debugging supported |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Toolchain | MPLAB X IDE, MPLAB XC-DSC C/C++ Compiler |
| Development Board | Explorer 16/32 Development Board (PIM support) |
| RoHS Status | Compliant |
DSPIC33FJ256GP510A-I/PF 100-tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for DSPIC33FJ256GP510A-I/PF (100-tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ256GP510A-I/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ256GP510A-I/PF is suitable for 6 applications: Digital Power Conversion, Motor Control (BLDC/PMSM/ACIM), Automotive Body and Convenience Modules, Industrial Sensing and Condition Monitoring, Audio Signal Processing, Embedded Development and Prototyping.
Digital Power Conversion
The DSPIC33FJ256GP510A-I/PF fits digital switch-mode power supplies, PFC stages, and LLC converters because its 40 MIPS 16-bit core sustains control-loop update rates in the tens of kilohertz with headroom for compensator math. Multiple 16-bit timers with output-compare channels generate precisely timed PWM edges, while the high-speed ADC samples current and voltage feedback with deterministic latency. The 256 KB Flash accommodates soft-start, protection state machines, and communication stacks (UART/SPI/I2C) in one device. Placed as the supervisory and modulation controller between the power stage and telemetry bus, it replaces multiple analog controllers with firmware-tunable behavior, though it consumes 3.3V logic-level design care on gate-drive interfaces.
Recommended
Motor Control (BLDC/PMSM/ACIM)
Sensorless BLDC and PMSM drives rely on fast current-loop execution; the DSPIC33FJ256GP510A-I/PF delivers 40 MIPS with single-cycle MAC instructions for Park/Clarke transforms and FIR filtering of ADC feedback. Input-capture channels decode hall or encoder signals, and output-compare channels drive the three-phase inverter PWM stage. The large 256 KB Flash supports field-oriented control plus parameter identification and fault logging simultaneously. For dedicated motor applications, the footprint-compatible DSPIC33FJ128MC510A-I/PF provides the MC-family PWM module with complementary outputs and fault inputs, making board reuse between GP and MC variants practical. Gate-driver isolation and dead-time verification in hardware remain the designer's responsibility.
Recommended
Automotive Body and Convenience Modules
Arrow's listing confirms the dsPIC33FJ256GP510A carries AEC-Q100 qualification, making it suitable for automotive body electronics such as lighting controllers, pump modules, and sensor hubs where firmware-controlled PWM and diagnostic reporting are required. The ECAN interface integrates directly with vehicle CAN networks, while multiple UARTs handle LIN-style auxiliary links. The industrial -I grade (-40C to +85C) suits cabin and interior zones; under-hood placements should select the extended-temperature DSPIC33FJ256GP510A-E/PF in the identical footprint. The 256 KB Flash allows field-updateable firmware with calibration tables retained on-chip, and ICSP programming via any PGECx/PGEDx pair supports end-of-line flashing on the production fixture.
Recommended
Industrial Sensing and Condition Monitoring
Vibration, acoustic, and power-quality monitors benefit from the DSPIC33FJ256GP510A-I/PF's combination of a high-speed ADC and DSP MAC instructions that execute FIR/IIR filtering in real time at 40 MIPS. The 30 KB SRAM buffers sample windows for FFT-based analysis, and ECAN/SPI links export processed features to PLC or SCADA backends. The industrial temperature rating and surface-mount TQFP-100 package suit DIN-rail and panel-mounted instrumentation. Because the ADC's sample-and-hold architecture supports simultaneous multi-channel sampling, phase relationships between current and voltage channels are preserved for power measurements - a parameter analog-multiplexed MCUs cannot guarantee. Calibration constants stored in Flash survive power cycles without external EEPROM.
Recommended
Audio Signal Processing
The DSP core of the DSPIC33FJ256GP510A-I/PF - 40 MIPS, single-cycle multiply-accumulate, and hardware divide support - executes audio filters, mixing, and codec glue logic without a dedicated audio DSP. The 256 KB Flash stores multiple filter coefficient sets and a communication bridge to I2S-adjacent peripherals via SPI. Typical roles include powered-speaker controller logic, intercom systems, and effect-pedal preprocessing where modest sample rates suffice. The multiple UARTs and I2C master support connect digital potentiometers and volume controls on the same bus. For hi-fi-grade paths, an external codec or audio ADC is recommended since the on-chip converter targets control-oriented precision rather than audio dynamic-range specifications.
Recommended
Embedded Development and Prototyping
The DSPIC33FJ256GP510A-I/PF is a strong platform for education and prototyping because the Explorer 16/32 Development Board supports it via Processor Plug-In Modules (PIMs), enabling rapid device swapping across PIC24F, dsPIC, and PIC32 families on one board with PICtail Plus expansion. MPLAB Snap provides low-cost in-circuit debugging and ICSP through any PGECx/PGEDx pair - just remember to use matched pairs (PGEC2 with PGED2, for example) and connect all VDD/VSS pins. The MPLAB XC-DSC compiler exposes full DSC hardware capabilities including DSP instructions from standard ANSI C. This toolchain maturity shortens the path from concept sketch to a functioning 40 MIPS control prototype with ECAN, SPI, and UART connectivity.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ256GP510A-I/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ256GP510A-E/PF | DSPIC33FJ256GP510-I/PF | DSPIC33FJ128GP510A-I/PF | DSPIC33FJ128MC510A-I/PF |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14) | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 128 KB |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Temperature Range | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Peripheral Family | GP (general purpose) | GP | GP (pre-A die) | GP | MC (motor control PWM) |
| Drop-in Fit | - | Pin-to-pin, no PCB change | Pin-to-pin, no PCB change | Pin-to-pin, firmware change only | Pin-to-pin, peripheral set differs |
Key Differentiators
- Double the program memory of footprint-compatible siblings (vs DSPIC33FJ128GP510A-I/PF)
- Extended-temperature option on the same footprint (vs DSPIC33FJ256GP510A-E/PF)
- General-purpose analog emphasis vs motor-control PWM (vs DSPIC33FJ128MC510A-I/PF)
Design Notes
The dsPIC33FJ core requires a 3.0V to 3.6V supply; there is no 5V-tolerant core option on this family. Decouple each VDD pin pair with 100 nF ceramics placed within a few millimeters of the pin, plus bulk 4.7-10 uF near the device. If the board mixes 5V peripherals, add level shifters or select 5V-tolerant series resistors per the 5V input tolerance rules in the family datasheet. Never leave any VDD/VSS pair unconnected - this is required both for power integrity and for reliable ICSP operation.
The device provides multiple PGECx/PGEDx programming pairs, and ICSP only works if the CLK and DAT pins come from the SAME pair - PGEC2 must be paired with PGED2, per the programming tool documentation (northernsoftware.com dsPIC33FJ256GP510A support page). Bring one complete pair to a standard 6-pin ICSP header on production PCBs, and avoid loading those pins with strong pull-ups or LED drivers that corrupt programming edges. Configure configuration-bit fuses (oscillator source, watchdog, code protection) deliberately before first flash.
For motor-control or digital-power layouts, route PWM outputs as short matched groups to the gate drivers and keep the ADC analog references on a quiet, star-grounded island separate from the PWM return currents. Use the exposed geometry of the 14x14 mm TQFP to place a solid ground plane on layer 2 directly beneath the die. SnapEDA provides verified symbol, footprint, and 3D models for Altium, KiCad, and OrCAD, which reduces footprint-registration errors versus hand-drawn pads.
When using ECAN for automotive or industrial networks, keep the CANTX/CANRX traces short to the transceiver and add series termination per the CAN physical-layer standard in use. On 40 MIPS designs, ensure the crystal or internal oscillator start-up stabilizes before releasing reset - use the built-in oscillator start-up timer rather than a fixed software delay. Estimated: at 40 MIPS and typical instruction mix, supply current is in the tens of mA range, so a 100+ mA LDO margin is a prudent design target (verify exact figures in the family datasheet electrical specifications).
Compliance Information
AEC-Q100 qualification stated in Arrow product listing for the dsPIC33FJ family. RoHS/lead-free per standard distributor listings; obtain formal REACH/halogen-free/conflict-minerals declarations from Microchip quality portal.
