EDB1332BDBH-1DAUT-F-R - 1Gbit LPDDR2 SDRAM 533MHz | Micron
MPN: EDB1332BDBH-1DAUT-F-R β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.95 | $4.95 |
| 10 | $4.55 | $45.50 |
| 100 | $4.1 | $410.00 |
| 500 | $3.75 | $1,875.00 |
| 1,000 | $3.4 | $3,400.00 |
Drop-in alternatives for EDB1332BDBH-1DAUT-F-R β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EDB1332BDBH-1DAAT-F-R
β Drop-Inπ Reference alternative (not in catalog)
EDB1332BDBH-1DAUT-F-D
β Drop-Inβ In Stock
$2.16 / Unit
View Datasheet βEDB1332BDBH-1DAAT-F-D
β Drop-Inπ Reference alternative (not in catalog)
EDB1332BDBH-1DAUT-F-D
β Drop-Inβ In Stock
$2.16 / Unit
View Datasheet βEDB1332BDBH-1DAUT-F-R Maximum Ratings & Electrical Characteristics
| Memory Type | SDRAM Mobile - LPDDR2 |
| Memory Size | 1 Gbit |
| Organization | 32M x 32 |
| Data Bus Width | 32 bit |
| Clock Frequency | 533 MHz |
| Interface | Parallel |
| Supply Voltage - Min | 1.14 V |
| Supply Voltage - Typ | 1.2 V |
| Operating Temperature - Min | -40 C |
| Operating Temperature - Max | +125 C |
| Package | 134-VFBGA (10 mm x 11.5 mm) |
| JEDEC Package Code | R-PBGA-B134 |
| Mounting Style | SMD/SMT |
| Factory Pack Quantity | 1000 |
| Packaging | Tape & Reel (-R suffix) |
| Technology | CMOS |
| RoHS Status | Compliant |
EDB1332BDBH-1DAUT-F-R r-pbga-b134 Pin Configuration Guide
Complete pinout information for EDB1332BDBH-1DAUT-F-R (r-pbga-b134 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EDB1332BDBH-1DAUT-F-R.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EDB1332BDBH-1DAUT-F-R is suitable for 6 applications: Embedded Linux Single-Board Computers, Industrial HMI Panels and Operator Terminals, Telematics and Fleet Data Loggers, Portable Battery-Powered Instruments, IoT Gateways and Edge Aggregation Nodes, Medical Diagnostic Handhelds and Monitors.
Embedded Linux Single-Board Computers
The EDB1332BDBH-1DAUT-F-R provides 1 Gbit of LPDDR2 (32M x 32) that matches SoCs such as the NXP i.MX 6Solo/6DualLite, which boot embedded Linux from a 32-bit-wide LPDDR2 bus at up to 533 MHz. In this role the DRAM carries the kernel, root filesystem cache, and application working set, so the 533 MHz clock on a 32-bit bus delivers the bandwidth those processors need for HMI rendering and networking stacks. The 134-VFBGA footprint keeps routing short for DQS/DQ fly-by timing. Use 10k-ohm pull references and follow the datasheet ZQ calibration and reset-sequencing requirements in the bootloader's DCD table to guarantee first-boot reliability.
Recommended
Industrial HMI Panels and Operator Terminals
Industrial touch panels require memory that survives -40C cold starts and 85C cabinet temperatures; the EDB1332BDBH-1DAUT-F-R's -40C to +125C range gives substantial margin. Its 1 Gbit density supports graphics frame buffers for 800x480 or 1024x600 LCDs driven by LPDDR2-capable SoCs, while the LPDDR2 self-refresh mode lets the panel suspend between touch events to meet low idle-power targets. The 32M x 32 organization simplifies layout because a single package completes the 32-bit bus, avoiding the timing skew of two 16-bit parts in parallel. Place the DRAM within 40 mm of the SoC and route DQ/DQS as length-matched groups per Micron's LPDDR2 layout guidelines.
Recommended
Telematics and Fleet Data Loggers
Vehicle telematics units buffer GPS, CAN, and cellular data before upload; the EDB1332BDBH-1DAUT-F-R supplies the RAM working set for an LPDDR2 SoC while its extended temperature range accommodates engine-bay-adjacent mounting points. The 533 MHz clock rate and parallel 32-bit interface sustain continuous logging with AES encryption in software. Because these devices spend long periods in low-power state, LPDDR2 self-refresh preserves buffered data at microamp-scale DRAM current while the application processor sleeps. Designers should verify power-ramp order on the always-on 1.2 V rail and add bulk capacitance to handle automotive load-dump transients upstream of the regulator.
Recommended
Portable Battery-Powered Instruments
Handheld measurement instruments benefit from the EDB1332BDBH-1DAUT-F-R's combination of density and low standby power: 1 Gbit holds calibration data, waveform buffers, and UI assets, while LPDDR2 power-down modes minimize drain between measurements. The single-package 32-bit bus at up to 533 MHz gives responsive sampling displays without the complexity of dual-chip 16-bit memory. Its 10 mm x 11.5 mm 134-VFBGA fits compact handheld PCBs. Battery-life optimization should use the datasheet self-refresh current figure and budget controller-side CKE management; deep power-down firmware policies typically dominate instrument idle current more than the DRAM itself.
Recommended
IoT Gateways and Edge Aggregation Nodes
Smart-home and industrial IoT gateways aggregate wireless nodes and run protocol stacks (MQTT, Thread border-router duties) that exceed microcontroller SRAM; pairing an LPDDR2-capable SoC with the EDB1332BDBH-1DAUT-F-R provides the 1 Gbit working memory needed for TLS sessions and message queues. The 533 MHz parallel interface keeps latency low for bursty network traffic, and the -40C to +125C grade suits unconditioned enclosures. The 32M x 32 single-package organization reduces BOM count versus stacked memory. Follow Micron's VREFCA reference-resistor (240-ohm Β±1%) layout guidance, since gateway boards often mix fast and slow signal nets near the DRAM.
Recommended
Medical Diagnostic Handhelds and Monitors
Portable medical devices such as vital-sign monitors and point-of-care analyzers need dependable memory across cold-chain transport and warm operating rooms; the EDB1332BDBH-1DAUT-F-R's -40C to +125C window covers both extremes. Its 1 Gbit LPDDR2 stores acquisition buffers and GUI assets for touchscreen interfaces, while self-refresh keeps patient-trend data in RAM during processor sleep states between measurements. The single 32M x 32 package shortens the memory bus, aiding EMC compliance in designs near RF sensing front-ends. Verify creepage and EMI segregation around the 134-VFBGA per applicable medical system standards, and confirm long-term supply via last-time-buy planning given this LPDDR2 generation's legacy status.
Recommended
Recommended Products Summary
Engineering reference data for EDB1332BDBH-1DAUT-F-R β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EDB1332BDBH-1DAAT-F-R | EDB1332BDBH-1DAUT-F-D | EDB1332BDBH-1DAAT-F-D | EDB1332BDBH-1DAUT-F |
|---|---|---|---|---|---|
| Package | 134-VFBGA (10x11.5) | 134-VFBGA - same | 134-VFBGA - same | 134-VFBGA - same | 134-VFBGA - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Size | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Organization | 32M x 32 | 32M x 32 | 32M x 32 | 32M x 32 | 32M x 32 |
| Max Clock Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Operating Temperature Max | +125 C | [DATA_NEEDED] (standard grade, below +125C) | +125 C | [DATA_NEEDED] (standard grade) | +125 C |
| Packaging Delivery | Tape & Reel (-R) | Tape & Reel (-R) | Tray (-D) | Tray (-D) | Base order code |
| Supply Voltage | 1.14 V min / 1.2 V typ | 1.14 V min / 1.2 V typ | 1.14 V min / 1.2 V typ | 1.14 V min / 1.2 V typ | 1.14 V min / 1.2 V typ |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Extended industrial temperature range (vs EDB1332BDBH-1DAAT-F-R)
- Single-package 32-bit bus (vs Dual 16-bit LPDDR2 build-up)
- Tape-and-reel automation readiness (vs EDB1332BDBH-1DAUT-F-D)
Design Notes
LPDDR2 requires a controlled 1.14 V to 1.2 V core rail and sequenced power-ramp: VDD/VDDQ must ramp before or with VDDQ_DQ and the reset (RESET_n) must remain low until supplies stabilize, per the Micron LPDDR2 datasheet initialization sequence. Estimated: ensure the PMIC's DDR LDO (e.g., a PF-series i.MX PMIC) ramps the 1.2 V rail within the datasheet-specified ramp rate; violating ramp order can latch up the die or corrupt initialization, requiring a full POR before the memory responds to MRR/MRW commands.
Route the 32-bit DQ bus with per-byte DQS strobes as length-matched groups; keep all memory traces under 40-50 mm from the 134-VFBGA to the SoC ball field. Use a solid, unbroken reference plane under the DQ/DQS/CA nets. Place the VREFCA divider (240-ohm Β±1% resistor pair) close to the ball with a dedicated 0.1 uF decoupling capacitor; reference-voltage noise directly degrades CA timing margin. Micron's LPDDR2 layout application guidance and reference-design footprints should be used verbatim for the landing pattern.
The -R suffix is packaging (tape-and-reel), not a silicon revision - verify temp grade by the -A (standard) vs -U (extended +125C) position before releasing BOMs for industrial builds; substituting an A-grade part into a +105C enclosure design is a silent failure mode. Also confirm supply continuity: this LPDDR2 generation is legacy-classified, so implement last-time-buy monitoring and consider qualifying the tray (-D) variant as a second sourcing path.
For 533 MHz operation, apply on-die-termination and drive-strength settings via Mode Register Write in the bootloader, and simulate CA net reflections if stub lengths exceed 3 mm. Estimated: with typical mobile-DRAM I/O drive at 533 MHz, unterminated CA stubs above roughly 5 mm show reflections that eat setup margin at -40C fast-corner conditions; keep CKE/CS routed with series termination per the SoC hardware design guide.
Compliance Information
RoHS compliance reported by distributor listings (AtlasChip, Win Source). Lead-free package indicated by -F suffix. REACH, halogen-free and conflict-minerals status must be confirmed from Micron's official product-compliance documents.
