EP1AGX20CF780I6 - Arria GX FPGA, 20K LE, 341 I/O | Intel
MPN: EP1AGX20CF780I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265 | $2,650.00 |
| 100 | $240 | $24,000.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for EP1AGX20CF780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX20CF780I6N
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EP1AGX20CF780C6N
✅ Drop-In✓ In Stock
$38.95 / Unit
View Datasheet →EP1AGX20CF780C6
✅ Drop-In✓ In Stock
$175.4 / Unit
View Datasheet →EP1AGX20CF780C5N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP1AGX20CF780I6 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements (LE) | 21,580 |
| Number of LABs/CLBs | 1,079 |
| Total Embedded Memory | 1,229,184 bits |
| User I/O Pins | 341 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Package Type | 780-pin FC-FBGA (Fine-pitch Flip-chip BGA) |
| Operating Temperature | -40 C to +100 C (Industrial) |
| Speed Grade | I6 |
| Number of Transceivers | Up to 4 |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| Configuration Modes | PS, FPP, JTAG |
| Mounting Type | Surface Mount |
EP1AGX20CF780I6 780-pin fc-fbga (fine-pitch flip-chip bga) Pin Configuration Guide
Complete pinout information for EP1AGX20CF780I6 (780-pin fc-fbga (fine-pitch flip-chip bga) package) with 341 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF780I6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 341 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF780I6 is suitable for 6 applications: Telecommunications Line Cards, PCI Express Endpoint Cards, Industrial Video Processing, Medical Imaging Systems, Military and Aerospace Signal Processing, Protocol Bridging and Custom High-Speed I/O.
Telecommunications Line Cards
The EP1AGX20CF780I6 is well suited to telecommunications line cards that require mid-range logic density combined with multi-gigabit serial links. The four embedded transceivers support data rates from 600 Mbps to 3.125 Gbps, enabling protocols such as Gigabit Ethernet, Serial RapidIO, and SerialLite II directly on-chip, which removes the need for external PHY devices. With 21,580 logic elements and 1,229,184 bits of embedded RAM, designers can implement framing, packet processing, and traffic management alongside physical-layer functions. The 780-pin FC-FBGA package exposes 341 user I/O pins, providing ample parallel connectivity for backplane interfaces, control plane processors, and clock distribution. Industrial temperature grade allows deployment in unconditioned outdoor telecom cabinets.
Recommended
PCI Express Endpoint Cards
The EP1AGX20CF780I6 supports PCI Express Gen1 operation at 2.5 Gbps per lane through its integrated transceivers, with up to four channels enabling x4 link widths. The hard IP for PCI Express PIPE interface simplifies PHY integration, while the embedded transceivers provide the required serializer/deserializer and clock-data recovery functions. With 21,580 logic elements, designers can implement endpoint controllers, DMA engines, and application logic on a single device. The 780-pin FC-FBGA footprint delivers 341 user I/O pins for memory expansion, board management controllers, and high-speed parallel peripherals. Industrial temperature grade supports deployment in server rooms and edge compute appliances.
Recommended
Industrial Video Processing
Industrial video processing systems benefit from the EP1AGX20CF780I6 combination of DSP blocks, embedded memory, and high-speed serial transceivers. The 21,580 logic elements support multiple video pipelines running in parallel, while the dedicated multiplier blocks accelerate operations such as scaling, color-space conversion, and motion estimation. The 1,229,184 bits of embedded RAM provide line buffers and frame storage for high-definition streams. Transceivers operating up to 3.125 Gbps can carry uncompressed SDI or serialized Camera Link payloads, eliminating external serializer chips. The 780-pin FC-FBGA package supports 341 user I/O for DDR memory interfaces, video DACs, and control plane connectivity. Industrial temperature grade enables factory floor and outdoor surveillance deployments.
Recommended
Medical Imaging Systems
Medical imaging equipment such as ultrasound scanners, endoscopy processors, and patient monitoring displays leverages the EP1AGX20CF780I6 for real-time image processing pipelines. The DSP blocks and hardware multipliers accelerate beamforming, FFTs, and image-filtering operations that are central to ultrasound signal paths. Embedded memory holds scanline data and intermediate frame buffers, reducing external memory pressure and lowering latency. The integrated transceivers at up to 3.125 Gbps transport digitized probe data and serialized display streams reliably across shielded cables. With 341 user I/O available on the 780-pin FC-FBGA package, the device interfaces to analog front ends, DDR memories, and embedded processors. Industrial temperature range suits operating-room equipment and ambulatory carts.
Recommended
Military and Aerospace Signal Processing
Defense signal processing applications including radar front ends, electronic warfare subsystems, and avionics data concentrators take advantage of the EP1AGX20CF780I6 industrial temperature grade and high-density logic. The four transceivers enable multi-channel digital receiver and exciter interfaces, while the DSP and multiplier blocks deliver real-time FFT, pulse compression, and digital beamforming at high sample rates. Embedded memory supports fast access to coefficient tables and intermediate sample storage in pipelined architectures. The 780-pin FC-FBGA package provides 341 user I/O pins to interface with high-speed ADCs, DACs, and DDR memories used in radar capture chains. Industrial temperature grade enables deployment in airborne and shipboard environments where commercial-grade parts are unsuitable.
Recommended
Protocol Bridging and Custom High-Speed I/O
Custom protocol bridge designs such as Serial RapidIO to Gigabit Ethernet converters, custom backplane concentrators, and proprietary high-speed links benefit from the EP1AGX20CF780I6 transceiver flexibility. Each of the four transceivers operates independently between 600 Mbps and 3.125 Gbps, allowing mixed protocol fan-out and clock-domain isolation within one device. The 21,580 logic elements and DSP blocks implement transport-layer processing, error correction, and rate adaptation. Embedded memory buffers data between asynchronous clock domains, simplifying protocol stack implementation. With 341 user I/O exposed on the 780-pin FC-FBGA package, designers can add LVDS and HSTL parallel side-channels for legacy interfaces without extra bridge chips. Industrial temperature grade supports outdoor and industrial cabinet installation.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF780I6N | EP1AGX20CF780C6N | EP1AGX20CF780C6 | EP1AGX20CF780C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-pin FC-FBGA | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 |
| Embedded Memory | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) |
| Speed Grade | I6 | I6 | C6 | C6 | C5 (one bin slower) |
| Pb-free Reflow (N suffix) | No | Yes | Yes | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade at the same Arria GX silicon (vs EP1AGX20CF780C6N)
- One-bin faster speed grade over the C5N alternative (vs EP1AGX20CF780C5N)
- Pb-free reflow designation in the I6N sibling (vs EP1AGX20CF780I6N)
Design Notes
The Arria GX core runs from a 1.2 V supply that must deliver the inrush current required during configuration plus steady-state operating current. Estimated: at 100% logic utilization with all four transceivers active, the 1.2 V rail can demand 2.5-3.5 A on the EP1AGX20CF780I6. Use a buck regulator with at least 5 A peak capability and place four 22 uF ceramic + two 470 uF bulk capacitors within 25 mm of the package. Provide separate analog supply domains for each transceiver PLL, isolated with ferrite beads and filtered with 10 uF + 0.1 uF caps, because PLL supply noise directly degrades jitter performance.
The 780-pin FC-FBGA package demands an 8- or 10-layer stack-up with a continuous ground plane beneath the BGA footprint. Transceiver channels require 90 ohm differential controlled impedance (100 ohm for PCIe), and intra-pair skew must be held below 1 ps per cm of mismatch. Via-in-pad with epoxy-filled and planarized plating is recommended for BGA breakouts to maintain the return path. Match differential pair lengths to within 0.127 mm (5 mil) on the same layer, and route over an unbroken reference plane with no signal layer transitions crossing splits.
Do not reuse a 780-pin FC-FBGA footprint for the 484-pin variant without verifying the land pattern - the two packages have different ball pitches and total pad counts, and forcing the smaller part into the larger footprint creates unrecoverable solder defects. Estimated: reflow profile should follow JEDEC J-STD-020 MSL-3 handling for FC-BGA with peak temperature below 245 C for Pb-free variants. Always program the configuration bitstream with a unique AES-128 key before deployment to prevent cloning, and validate the bitstream against the Quartus II 7.2 / 9.0 device support files that target this silicon revision.
Compliance Information
RoHS / REACH compliance data was not present in the Verified Web Data for EP1AGX20CF780I6 - the Pb-free N-suffix variants (EP1AGX20CF780I6N) are more likely to be RoHS compliant than the non-N suffix parts, but this should be verified against the manufacturer declaration before use in RoHS-restricted regions. AEC-Q100 does not apply to FPGAs of this class.
