EP1AGX50DF780I6 - Arria GX FPGA 50K LE 780-FBGA | Altera | Intel
MPN: EP1AGX50DF780I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
Drop-in alternatives for EP1AGX50DF780I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF780I6N
✅ Drop-In✓ In Stock
$255 / Unit
View Datasheet →EP1AGX50DF780C6
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$205 / Unit
View Datasheet →EP1AGX35DF780I6
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$175 / Unit
View Datasheet →EP1AGX35DF780I6N
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$171 / Unit
View Datasheet →EP1AGX50DF780C7
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$195 / Unit
View Datasheet →EP1AGX50DF780C6N
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$327.76 / Unit
View Datasheet →EP1AGX50DF780I6 Maximum Ratings & Electrical Characteristics
| Series | Arria GX |
| Family | Arria GX |
| Manufacturer | Altera (Intel) |
| Number of Logic Elements (LE) | 50,160 |
| Number of LABs/CLBs | 2,508 |
| Total RAM Bits | 2,475,072 |
| Number of I/O | 350 |
| Number of Transceivers | 4 (up to 3.125 Gbps) |
| Core Voltage | 1.15 V to 1.25 V |
| Process Technology | 90 nm |
| Package / Case | 780-BBGA, FCBGA (29x29 mm) |
| Supplier Device Package | 780-FBGA |
| Operating Temperature | -40C to +100C (TJ) |
| Mounting Type | Surface Mount |
| RoHS Status | Unknown - verify with manufacturer |
EP1AGX50DF780I6 780-fbga Pin Configuration Guide
Complete pinout information for EP1AGX50DF780I6 (780-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF780I6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF780I6 is suitable for 6 applications: Wireless Baseband Processing, PCI Express Endpoint Card, Serial RapidIO Bridge, Industrial Video Processing, Telecom Backplane Aggregation, Military/Aerospace Protocol Converter.
Wireless Baseband Processing
The EP1AGX50DF780I6 fits wireless baseband processing because its 50,160 logic elements and embedded DSP blocks deliver the parallel arithmetic throughput required for PHY-layer baseband algorithms, while the 4 transceiver channels at 3.125 Gbps natively interface CPRI links to remote radio heads. The 780-FBGA package provides the I/O density needed for CPRI data, antenna data, and backhaul aggregation. With 2,475,072 bits of embedded RAM, the device buffers pre/post-FFT samples on-chip, reducing external memory accesses. Designers typically instantiate Nios II embedded processors alongside custom DSP datapaths. Power consumption is in the 1.5 W to 4 W range at full utilization, manageable with the FC-FBGA thermal envelope.
Recommended
PCI Express Endpoint Card
The EP1AGX50DF780I6 is well suited for PCI Express endpoint cards because the integrated transceivers support PCIe Gen1 x1 hard IP without external PHY chips, reducing BOM cost and board area. The 50,160 LE fabric accommodates protocol stack logic, DMA engines, and application accelerators simultaneously. Designers implement the PIPE interface to external clocking and use the 780-FBGA's 350 I/Os for endpoint-side local bus, DDR2 memory interface, and GPIO. The I6 industrial speed grade guarantees timing closure for 250 MHz internal operation. Quartus II provides the PCIe Compiler wizard to generate TLP/DLLP handling, MSI/MSI-X interrupt logic, and verification testbench in minutes.
Recommended
Serial RapidIO Bridge
The EP1AGX50DF780I6 supports Serial RapidIO (SRIO) bridging applications through its 3.125 Gbps transceivers, which are hard-IP compatible with the SRIO physical layer. The device can bridge between SRIO endpoints and local fabric (e.g., DSP chains, ASICs, or processors) using its 50,160 logic elements and 432 Kbits of distributed RAM for protocol packet buffers. Block RAM (M4K) supports 32-bit ECC for SRIO payload integrity. Typical designs use the device in DSP farm aggregation cards for wireless infrastructure or military radar signal processing, where deterministic low-latency fabric interconnect is critical.
Recommended
Industrial Video Processing
The EP1AGX50DF780I6 supports industrial video processing tasks such as multi-channel HD-SDI aggregation, video format conversion, and real-time image preprocessing. The 50,160 logic elements implement line buffers, scaling engines, and color space converters, while 4 transceiver channels accept HD/3G-SDI input at up to 2.97 Gbps. The 350 user I/Os in the 780-FBGA package accommodate parallel video buses (BT.1120, BT.656), DDR2/DDR3 frame buffers, and control interfaces. Industrial temperature grade (-40C to +100C TJ) allows deployment in factory-floor vision systems without additional thermal management.
Recommended
Telecom Backplane Aggregation
In telecom backplane aggregation systems, the EP1AGX50DF780I6 acts as a serial-interface concentrator, aggregating multiple low-rate TDM or Ethernet links into a higher-speed uplink using its 4 transceiver channels. The 90 nm process and 1.15-1.25 V core supply deliver static power in the 1.5 W range, suitable for fanless line cards. The 780-FBGA package's 350 user I/Os expose local bus interfaces to backplane ASICs, timing clocks from Stratum-3 sources, and redundancy control. Designers use the embedded PLLs (up to 8 per device) for jitter-cleaning clock distribution across aggregated links.
Recommended
Military/Aerospace Protocol Converter
The EP1AGX50DF780I6 fits military and aerospace protocol converter applications where multiple serial standards (MIL-STD-1553, ARINC 429, Fibre Channel, custom serial) must be bridged. The 4 transceivers at 3.125 Gbps accommodate Fibre Channel 1 Gbps links, while the logic fabric implements 1553/ARINC controllers with the soft IP libraries available in Quartus II. The industrial temperature range (-40C to +100C TJ) covers most MIL-STD-810 environmental requirements. The 780-FBGA package's 1.0 mm ball pitch requires standard PCB manufacturing (not HDI), simplifying MIL-spec board fabrication.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF780I6N | EP1AGX50DF780C6 | EP1AGX35DF780I6 | EP1AGX35DF780I6N | EP1AGX50DF780C7 |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 50,160 | 50,160 | 50,160 | 33,880 | 33,880 | 50,160 |
| Embedded RAM (bits) | 2,475,072 | 2,475,072 | 2,475,072 | 1,346,112 | 1,346,112 | 2,475,072 |
| Transceivers | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps |
| User I/O | 350 | 350 | 350 | 350 | 350 | 350 |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to 85C TJ) | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to 85C TJ) |
| Speed Grade | I6 (mid-tier) | I6 (mid-tier) | C6 (mid-tier) | I6 (mid-tier) | I6 (mid-tier) | C7 (faster) |
Key Differentiators
- Highest logic density in the 780-FBGA Arria GX package (vs EP1AGX35DF780I6)
- Industrial temperature grade with same die as commercial variant (vs EP1AGX50DF780C6)
- Lead-free finish option available for RoHS compliance (vs EP1AGX50DF780I6 (non-N))
Design Notes
The 780-FBGA uses a 1.0 mm ball pitch and requires 4-6 layer PCB stackup with controlled-impedance differential routing for the transceiver channels. Per the Altera Arria GX board design guidelines, place the MGT (Multi-Gigabit Transceiver) decoupling capacitors within 50 mils of the MGT power pins, and use a continuous ground plane beneath the BGA with thermal vias (10-12 per BGA quadrant) to reduce junction-to-ambient thermal resistance. Estimate: for a 3 W dissipation design, junction-to-ambient thermal resistance must be below 20 C/W to stay within industrial temperature limits at 70 C ambient.
The Arria GX core requires a 1.15 V to 1.25 V supply with tight regulation (3% tolerance) and peak current up to 4-6 A depending on logic utilization. Per the Arria GX datasheet, use a dedicated switching regulator (e.g., Altera Enpirion EN5339QI for 3 A continuous) with 100 uF of bulk ceramic decoupling on the VCCINT plane. Estimated: at 50% logic utilization and 200 MHz internal clock, expect approximately 2.5 A core current; enable Smart Voltage ID (SVID) if supported on the host regulator. Separate the VCCPD (3.3 V) rail from VCCIO rails with a ferrite bead to prevent I/O noise injection into the PLL analog supply.
Transceiver channel routing requires 100-ohm differential impedance with intra-pair length matching to within 5 mils and pair-to-pair matching to within 20 mils per the Altera Arria GX PCB Design Guidelines. Use a high-speed PCB material such as FR4-5 (loss tangent 0.018) for channels up to 8 inches, or move to Megtron 6 for longer reach. The reference clock input requires 50-ohm termination at the FPGA pin with no stub taps - clock jitter must be below 100 fs RMS for 3.125 Gbps link compliance. Estimate: an 8-inch Megtron 6 differential pair at 3.125 Gbps exhibits approximately 1.5 dB insertion loss, well within the Arria GX receiver equalization budget.
Compliance Information
RoHS/lead-free compliance not explicitly stated in verified web data. The N-suffixed variant (EP1AGX50DF780I6N) is the RoHS/lead-free option per Altera part-number convention. AEC-Q100 is not applicable for FPGAs (this is a commercial/industrial programmable logic device, not an automotive-grade qualified IC).
