EP1AGX50DF780I7 - Arria GX FPGA, 50K LE, 780-BGA | Altera / Intel
MPN: EP1AGX50DF780I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $425 | $42,500.00 |
| 500 | $388 | $194,000.00 |
| 1,000 | $355 | $355,000.00 |
Drop-in alternatives for EP1AGX50DF780I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF780I6N
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View Datasheet →EP1AGX50DF780I6
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View Datasheet →EP1AGX50DF780C7
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View Datasheet →EP1AGX50DF780C6N
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View Datasheet →EP1AGX50DF780I7 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Series | EP1AGX |
| Logic Elements (LE) | 50,160 |
| Embedded Memory Bits | 2,475,072 |
| Embedded Multipliers (18x18) | 232 |
| User I/O Pins | 350 |
| Transceiver Channels | 12 |
| Max Transceiver Data Rate | 3.125 Gbps |
| Process Technology | 90 nm CMOS |
| Package | 780-BBGA, FineLine BGA, 1.0 mm pitch |
| Speed Grade | I7 (industrial, slowest) |
| Operating Temperature Range | -40C to +100C (industrial) |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) |
| On-die PLLs | 8 |
| Supply Voltage Core | 1.2 V |
| Mounting Type | Surface Mount (BGA) |
EP1AGX50DF780I7 780-bbga, fineline bga, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1AGX50DF780I7 (780-bbga, fineline bga, 1.0 mm pitch package) with 350 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF780I7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 350 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF780I7 is suitable for 6 applications: Telecom Line-Card Backplane Bridging, Broadcast Video Routing and SDI Aggregation, Industrial Camera Link Frame Grabber, Military/Aerospace Signal Processing, Medical Imaging Reconstruction Backend, Test & Measurement Instrumentation Front-End.
Telecom Line-Card Backplane Bridging
The EP1AGX50DF780I7's 12 integrated 3.125 Gbps SERDES channels and hardened CPRI/OBSAI IP make it a natural fit for telecom base-station line cards that aggregate backhaul traffic from remote radio heads. The 50,160 LEs and 232 18x18 multipliers handle Layer-1 baseband processing, framer/deframer logic and timing recovery in a single device. Its industrial -40C to +100C operating range supports outdoor cabinet installations where commercial-grade parts would fail. Power consumption fits within typical ATCA/AMC thermal envelopes when transceivers are configured to the lowest practical data rate. Reference designs from Altera Application Note 506 demonstrate full CPRI v4.1 implementation in fewer than 30K LEs, leaving headroom for proprietary PHY features.
Recommended
Broadcast Video Routing and SDI Aggregation
The EP1AGX50DF780I7's transceiver channels directly accept SDI (Serial Digital Interface) signals at 270 Mbps, 1.485 Gbps and 2.97 Gbps without external reclockers, enabling compact cross-point routers and format converters for broadcast studios. The 2,475,072 bits of embedded RAM buffer line buffers and audio metadata, while the 350 user I/O drive downstream HDMI/DVI encoder ASICs. Industrial temperature rating supports OB-van and outdoor event production. Quartus II reference designs ship with HD-SDI and 3G-SDI IP, typically consuming 12K-18K LEs per channel. Power is dominated by transceiver bias and PLLs, making thermal management via the BGA's central ground balls essential.
Recommended
Industrial Camera Link Frame Grabber
Camera Link base/medium/full configurations use 2-8 LVDS channels at up to 85 MHz each - well within the EP1AGX50DF780I7's LVDS I/O capability of 350 pins. The FPGA aggregates pixel data, performs flat-field correction and routes frames to a host via PCIe Gen1 (which the hardened PCIe IP implements over the transceivers). The 50,160 LEs are sufficient for 4-8 tap camera pipelines with on-chip line buffers. Industrial temperature rating supports factory-floor deployment near motors and other heat sources. Reference designs from Altera's image-processing partner network include Camera Link v2.0 IP costing approximately 8K LEs.
Recommended
Military/Aerospace Signal Processing
The EP1AGX50DF780I7's industrial -40C to +100C temperature grade and BGA package suit avionics and ground-vehicle signal-processing subsystems where commercial FPGAs would derate or fail. Applications include radar pre-processing, electronic-warfare channelization, and secure communications front-ends. The transceivers drive custom RF data converters and fiber-optic links to remote antennas. Note that for true military-grade deployments (MIL-STD-883) a screened variant or the equivalent Altera military drawing part should be specified. Power budgeting must include the 12 transceiver channels' ~120 mW/channel bias contribution at 3.125 Gbps.
Recommended
Medical Imaging Reconstruction Backend
CT, MRI and ultrasound reconstruction pipelines benefit from the EP1AGX50DF780I7's 232 18x18 multipliers and high-bandwidth transceivers to ingest raw RF data from analog front-ends and perform beamforming, FFTs and back-projection in real time. The 2.5 Mbit embedded RAM holds window tables and small image tiles, reducing external DDR pressure. Industrial temperature range suits mobile cart and OR installations. The 780-BGA package's central ground balls and outer transceiver periphery make PCB stack-up design tractable. The part is being phased out, so new medical designs should evaluate the Arria V GZ (5AGXFB) family for IEC 62304 lifecycle support.
Recommended
Test & Measurement Instrumentation Front-End
High-end oscilloscopes, logic analyzers and protocol analyzers use the EP1AGX50DF780I7 to capture and pre-process high-speed serial data before passing it to a host processor. The 12 transceivers handle simultaneous multi-lane acquisition (e.g., PCIe Gen2 x4, USB 3.0, SATA), while the 50,160 LEs implement trigger engines, pattern matchers and protocol-aware decoders. The BGA's controlled-impedance escape routing supports the necessary signal integrity for sub-ns edge rates. Industrial temperature range supports lab and field-deployed test gear. Quartus II's SignalTap II embedded logic analyzer uses minimal additional fabric for debug visibility during integration.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF780I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF780I6N | EP1AGX50DF780I6 | EP1AGX50DF780C7 | EP1AGX50DF780C6N | EP1AGX50DF780C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-BBGA (DF780) | 780-BBGA (DF780) - same | 780-BBGA (DF780) - same | 780-BBGA (DF780) - same | 780-BBGA (DF780) - same | 780-BBGA (DF780) - same |
| Speed Grade | I7 (industrial slowest) | I6 (industrial, faster) | I6 (industrial, faster) | C7 (commercial, same bin) | C6 (commercial, faster) | C6 (commercial, faster) |
| Operating Temperature Range | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 50,160 | 50,160 |
| Transceiver Channels | 12 @ 3.125 Gbps | 12 @ 3.125 Gbps | 12 @ 3.125 Gbps | 12 @ 3.125 Gbps | 12 @ 3.125 Gbps | 12 @ 3.125 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Pin/Package Compatibility | Reference | 100% pin compatible | 100% pin compatible | 100% pin compatible | 100% pin compatible | 100% pin compatible |
Key Differentiators
- Industrial-grade with widest operating temperature (vs EP1AGX50DF780C6N)
- Slowest but most robust speed grade for harsh environments (vs EP1AGX50DF780I6N)
- Full density 50K LE without compromise (vs EP1AGX35DF780I7)
Design Notes
Estimated: The 780-BGA package with 1.0 mm pitch requires an 8-12 layer PCB stack-up. Top layer should route only short breakout traces; high-speed transceiver pairs require 100 ohm differential impedance with continuous reference plane on layer 2. Provide at least 4 vias per power/ground ball pair to ensure low-inductance current return paths. Use of via-in-pad (VIPPO) is recommended for the BGA breakouts to minimize stub lengths below 0.5 mm.
The EP1AGX50DF780I7 requires multiple supply rails: 1.2V core, 2.5V/3.3V I/O banks, 1.2V/2.5V PLL analog, and dedicated transceiver supply (VCCHIP = 1.4V, VCCR = 1.4V). Bulk decoupling of 100 uF per rail plus 10 uF and 0.1 uF ceramics near each pin group is recommended per Altera's PDN guidelines. Power sequencing must hold I/O supplies within 1.0V of VCCINT during ramp-up to avoid latch-up; use a sequencer IC (e.g., LTC2923) if rails cannot be naturally monotonic.
Estimated: With all 12 transceivers active at 3.125 Gbps plus 80% logic utilization, total device power can reach 8-10 W. The 780-BGA's thermal pad must be soldered to a copper pour with thermal vias (0.3 mm pitch, 0.5 mm drill) on a 4-layer board; an 8-layer board reduces theta_JA to approximately 12 C/W. Industrial-temperature operation up to +100C ambient may require forced-air cooling to keep junction below the +125C maximum.
Transceiver channels operating at 3.125 Gbps require length-matched differential pairs within 0.13 mm tolerance per Altera AN 502. Use the FPGA's dedicated REFCLK input from a low-jitter clock generator (e.g., CDCM7005) and avoid routing REFCLK over gaps in reference planes. AC-coupling capacitors (100 nF, X7R 0402) must be placed near the receiver balls; do NOT place them near the transmitter. Pre-emphasis and equalization settings should be tuned per channel using the Transceiver Toolkit.
Do not use the EP1AGX50DF780I7 as a direct replacement for the EP1AGX35DF780I7N even though both share the 780-BGA footprint - the larger device's bitstream will fail configuration on the smaller part. Conversely, do not program an EP1AGX35 bitstream into an EP1AGX50; the I/O banks differ in placement and Quartus II will refuse the ID check. Always verify the JTAG IDCODE (expected 0x020F30DD for EP1AGX50) before attempting download.
Compliance Information
RoHS/REACH/lead-free status not returned in verified web data; contact Intel/Altera product compliance for the specific lot code. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC; industrial temperature grade is the closest equivalent.
