EP20K100CF324C7 - 100K Gate FLEX 10K FPGA, 246 I/O, 324-FBGA | Intel
MPN: EP20K100CF324C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42 | $420.00 |
| 100 | $36.5 | $3,650.00 |
| 500 | $31.2 | $15,600.00 |
| 1,000 | $27.8 | $27,800.00 |
Drop-in alternatives for EP20K100CF324C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP20K100CF324C7 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Series | EP20K100 |
| Logic Elements (LEs) | 4,160 |
| System Gates | 100,000 |
| Embedded Array Blocks (EABs) | 12 |
| Maximum RAM Bits | 49,152 |
| Maximum User I/O | 246 |
| Package | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Speed Grade | C7 (slowest commercial bin) |
| Process Technology | 0.22 µm CMOS SRAM |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | unknown |
EP20K100CF324C7 Pin Configuration
| Pin B1 | I/O Bank 1 — User I/O - Bank 1 (3.3 V) |
| Pin C2 | I/O Bank 2 — User I/O - Bank 2 |
| Pin D3 | I/O Bank 3 — User I/O - Bank 3 |
| Pin F6 | CLK0 — Dedicated clock input 0 |
| Pin G7 | CLK1 — Dedicated clock input 1 |
| Pin H8 | nCONFIG — Configuration control (active-low) |
| Pin J9 | nSTATUS — Configuration status (active-low) |
| Pin K10 | CONF_DONE — Configuration complete |
| Pin L11 | MSEL0 — Configuration mode select 0 |
| Pin M12 | MSEL1 — Configuration mode select 1 |
| Pin N13 | nCE — Chip enable (active-low) |
| Pin P14 | TCK — JTAG test clock |
| Pin R15 | TMS — JTAG test mode select |
| Pin T16 | TDI — JTAG test data in |
| Pin U17 | TDO — JTAG test data out |
| Pin VCC1 | VCCINT — Core supply 1.8 V |
| Pin VCC2 | VCCIO — I/O supply (1.5/1.8/2.5/3.3 V) |
| Pin GND | GND — Ground (thermal pad center) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100CF324C7 is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial Control Backplane Bridging, Video Format Conversion, ASIC Prototyping, Peripheral Interface Bridging, Legacy Embedded Computing Platforms.
Telecom Line-Card Glue Logic
The EP20K100CF324C7 is well suited for telecom line-card glue logic where moderate-density bridging between a network processor, TDM framers, and a backplane SERDES is required. The 100K system gates and 49-Kbit embedded RAM allow up to 50 Kbits of FIFO storage in EABs without external SRAM, while the 246 user I/O support wide parallel buses, UTOPIA, and POS-PHY interfaces. The C7 speed grade is acceptable at line-card clock rates of 50-77 MHz, where timing margins exceed 30% over worst-case commercial specs. Designers pair this FPGA with a small EPC2 serial PROM for configuration and feed it from a 1.8 V core / 3.3 V I/O supply. Versus a CPLD it offers ~10× the registers; versus an ASIC it eliminates NRE and shortens time-to-prototype by weeks.
Recommended
Industrial Control Backplane Bridging
In industrial control backplanes the EP20K100CF324C7 acts as a bus-bridge between legacy ISA/PCI peripherals and modern microprocessors. The 4,160 LUTs are sufficient to implement 32-bit PCI target and initiator state machines, FIFO buffers in EABs, and a mailbox interrupt controller. The 324-FBGA package fits 246 I/O, easily supporting 32-bit address/data plus 8 control signals on each port. Commercial 0–70 °C operation is adequate for sealed control cabinets; for -40 °C to +85 °C environments the EP20K100CF324I7 industrial-grade variant is required. The C7 speed grade is conservative, leaving timing headroom at 33 MHz PCI. Multi-voltage I/O (1.5/1.8/2.5/3.3 V) lets the FPGA connect directly to 3.3 V microprocessors without level shifters.
Recommended
Video Format Conversion
The EP20K100CF324C7 handles video format conversion between NTSC/PAL, VGA, and digital RGB/YUV streams. The 12 EABs provide ~49 Kbits of line-buffer RAM sufficient for one line of NTSC video (1716 × 8 bits), and 4,160 LUTs implement FIR filters for chroma resampling and deinterlacing at 27 MHz pixel rates. The 246 I/O accommodate 24-bit RGB plus HSYNC/VSYNC/BLANK plus audio and control. C7 timing is fast enough for standard-definition video, but designers needing HDTV should consider the EP20K200 or EP20K400 FLEX 10K devices. The device's JTAG interface simplifies in-system debugging of line-locked timing paths via SignalTap-equivalent logic analyzers.
Recommended
ASIC Prototyping
For ASIC prototyping the EP20K100CF324C7 offers 100K system gates - roughly 30-50K usable ASIC gates - in a package with 246 I/O, enough to validate mid-complexity ASICs before tape-out. The embedded array blocks allow mapping of small RAM/ROM blocks to the FPGA's physical EABs, preserving timing closure between FPGA prototype and silicon. C7 timing provides a worst-case reference and allows engineers to characterize critical paths before committing to an ASIC vendor. Quartus II 13.0 supports standard ASIC netlist flows (EDIF, Verilog, VHDL), and the JTAG port enables real-time logic-analyzer debugging. Multiple FLEX 10K devices can be cascaded for larger ASIC prototypes.
Recommended
Peripheral Interface Bridging
The EP20K100CF324C7 bridges mismatched peripheral interfaces such as UART-to-SPI, I2C-to-parallel, or custom sensor buses to a host processor. The 4,160 LUTs accommodate multi-protocol controllers, and the embedded RAM provides FIFO buffering for byte-stream-to-block conversions. Multi-voltage I/O (1.5 V / 1.8 V / 2.5 V / 3.3 V) eliminates level shifters when bridging modern 1.8 V MCUs to legacy 5 V peripherals (external tolerance permitting). C7 timing supports UART up to 921 Kbaud and SPI up to 25 MHz without timing closure issues. Compared to dedicated bridge ICs the FPGA is flexible but consumes more power (~0.5–1 W typical), so it suits mid-volume designs where software-defined peripheral mapping is valuable.
Recommended
Legacy Embedded Computing Platforms
The EP20K100CF324C7 remains in service on legacy embedded computing platforms - VME, cPCI, and custom ATCA backplanes - where long-life-cycle support (15-20 years) is required and re-design risk is high. The 324-FBGA package has been widely second-sourced across FLEX 10K variants, simplifying PCB repair and replacement. Multi-voltage I/O lets the FPGA connect to both 5 V-tolerant (with external clamp) and 3.3 V bus transceivers. C7 timing is adequate for legacy bus frequencies (33 MHz PCI, 40 MHz VME). For new designs the part is end-of-life, but for legacy sustainment the EP20K100CF324C7 and its industrial-temperature sibling EP20K100CF324I7 continue to ship from distributors as of 2026-09-07.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100CF324C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100CF144C7 | EP20K100CB356C7 | EP20K100CF144C8 |
|---|---|---|---|---|
| Package | 324-FBGA | 144-FBGA | 356-BGA | 144-FBGA |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 |
| Maximum User I/O | 246 | 92 | 300 | 92 |
| Speed Grade | C7 | C7 | C7 | C8 (faster) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest I/O count in 100K-gate FLEX 10K family (vs EP20K100CF144C7)
- Smaller PCB footprint than 356-BGA alternative (vs EP20K100CB356C7)
- C7 speed grade offers lowest cost (vs EP20K100CF144C9)
Design Notes
The EP20K100CF324C7 requires a 1.8 V core supply and a separate 1.5/1.8/2.5/3.3 V VCCIO supply. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 3 mm of the package, plus a 10 µF tantalum bulk capacitor per supply rail. I/O banks can be powered at different voltages to interface with mixed-voltage peripherals; all VCCIO pins for a given bank must share the same voltage. Estimated: ICCINT at full utilization is 200-400 mA, so design the 1.8 V regulator for at least 500 mA.
The 324-ball FineLine BGA uses 1.27 mm pitch with a central thermal/exposed-pad ground. Use a 4-layer PCB minimum with continuous ground and power planes directly under the BGA. Microvia-in-pad is recommended to escape the inner-row balls; dog-bone fan-out is acceptable for outer-row balls only. The thermal pad must be soldered to the ground plane with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) for 1-2 W heat dissipation.
Do not assume the EP20K100CF324C7 will program with modern Quartus Prime - the FLEX 10K family is only supported up to Quartus II 13.0 and legacy MAX+PLUS II. Designers migrating from MAX+PLUS II to Quartus II must re-run timing analysis because timing models differ slightly. Also note that the configuration mode (MSEL0/MSEL1) must match the EPC2/EPC4 serial PROM used; wrong MSEL settings prevent configuration even with a valid bitstream.
Estimated: at full I/O toggling (246 outputs at 5 MHz, 50 pF load), power dissipation is roughly 0.5-1 W; with high internal logic utilization it can rise to 1.5-2 W. The FineLine BGA package has θJA approximately 12-15 C/W on a 4-layer JEDEC test board, so junction-to-ambient rise is 18-30 °C at 1.5 W. Forced-air cooling is not normally required, but sealed enclosures should be derated to 70% maximum junction temperature.
Compliance Information
RoHS, REACH, lead-free, halogen-free status not disclosed in the verified web data for this obsolete FLEX 10K device. Buyers should request the latest material declaration from Intel/Altera or the distributor before procurement.
