EP20K100CF324C7ES - 100K APEX-20K FPGA 4160 LEs 246 I/O | Intel
MPN: EP20K100CF324C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64 | $6,400.00 |
| 250 | $58.5 | $14,625.00 |
| 500 | $52.75 | $26,375.00 |
Drop-in alternatives for EP20K100CF324C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP20K100CF324C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$27.8 / Unit
View Datasheet →EP20K100CF324C7ES Maximum Ratings & Electrical Characteristics
| Family | APEX-20K |
| Logic Elements / Cells | 4160 |
| Total System Gates | 263000 |
| Number of I/O | 246 |
| Number of Logic Elements/Cells | 4160 |
| Total RAM Bits | 53248 |
| Number of Embedded System Blocks (ESBs) | 16 |
| Number of PLLs | 4 |
| Voltage - Supply | 2.375 V to 2.625 V |
| Operating Temperature | 0C to +85C |
| Speed Grade | C7 |
| Mounting Type | Surface Mount |
| Package / Case | 324-FBGA (19x19 mm) |
| Supplier Device Package | 324-FBGA (19x19) |
| Process Technology | 0.22 micrometer CMOS |
| RoHS Status | unknown |
EP20K100CF324C7ES 324-fbga (19x19) Pin Configuration Guide
Complete pinout information for EP20K100CF324C7ES (324-fbga (19x19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100CF324C7ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100CF324C7ES is suitable for 6 applications: PCI Bus Bridge and Interface Controller, Custom Peripheral Controller for Industrial Backplanes, Telecom Line-Card Glue Logic, DSP Co-Processing Front-End, Legacy POS Terminal and Printer Controller, High-Channel Data Acquisition Front-End.
PCI Bus Bridge and Interface Controller
The EP20K100CF324C7ES is well-suited for PCI 2.2/3.0 bridge applications thanks to its 246 user I/O count, 3.3V PCI-compatible I/O standard support, and 4,160 logic elements. The APEX-20K LUT fabric and embedded system blocks allow a single chip to implement a target or master PCI core plus custom peripheral glue logic. With 4 PLLs available, the device can derive 33 MHz PCI clocks internally while still exposing an asynchronous local bus for the host CPU. Compared with discrete TTL bridge designs, the FPGA reduces board area and BOM cost while allowing in-system reconfiguration when bridge revision updates are required.
Recommended
Custom Peripheral Controller for Industrial Backplanes
Industrial backplanes need glue logic to interface legacy parallel buses (VME, ISA, PC/104) to modern processors. The EP20K100CF324C7ES delivers 246 I/O and 53,248 bits of embedded RAM, which is enough to build parallel bus arbiters, address decoders, FIFOs, and interrupt controllers in a single device. The 2.5V core and I/O banks programmable to 3.3V or 5V TTL simplify interfacing to mixed-voltage backplane signals. The C7 speed grade keeps power dissipation manageable in sealed industrial enclosures without active cooling, while Quartus II allows in-field firmware updates for new peripherals.
Recommended
Telecom Line-Card Glue Logic
Telecom line cards rely on FPGAs to bridge framers, serializers, and network processors to TDM/Ethernet backplanes. The EP20K100CF324C7ES provides 4,160 LEs and 246 I/O sufficient for HDLC controllers, framer interfaces, and clock-data recovery glue logic. Its 4 PLLs allow hitless reference switching between primary and secondary timing sources, a key telecom requirement. The C7 speed grade is fast enough for 155 MHz Utopia or POS-PHY interfaces while keeping power low enough for sealed line-card slots.
Recommended
DSP Co-Processing Front-End
The EP20K100CF324C7ES works as a co-processor front-end that conditions and routes data to a downstream DSP. With 16 embedded system blocks, the device can hold FIFO queues, coefficient tables, and bit-reversal buffers without consuming logic resources. The 4 PLLs allow the FPGA to derive different sample-rate clocks from a single reference, eliminating external clock-generator ICs. Its 246 I/O pins accommodate parallel ADC/DAC buses, while the LUT-based fabric can implement FIR filters, decimators, and address generators in a single chip.
Recommended
Legacy POS Terminal and Printer Controller
POS terminals and industrial printers combine display drivers, keyboard scanners, motor controllers, and serial port glue in a single chassis. The EP20K100CF324C7ES with 246 I/O and embedded RAM can host all these peripherals while exposing a single fast interface to the main CPU. The C7 speed grade keeps the BOM cost low for cost-sensitive commercial designs. Because the part is widely supported by MAX+PLUS II and Quartus II, long-lifecycle commercial OEMs can continue maintenance releases without retraining engineering staff.
Recommended
High-Channel Data Acquisition Front-End
Multi-channel data acquisition systems need to sample and buffer many analog signals simultaneously. The EP20K100CF324C7ES exposes 246 I/O suitable for parallel LVCMOS ADC interfaces and provides 53,248 bits of embedded RAM that can be configured as dual-port FIFOs between the ADC bus and a downstream DMA controller. Four PLLs allow per-channel sample-rate generation, and the LUT fabric can host on-chip FIR decimation filters. Designers migrating from discrete TTL logic save board area and gain the ability to update the FIR coefficients in-system for different measurement campaigns.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100CF324C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100CF324C7 |
|---|---|---|
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) - same |
| Brand | Intel | Intel - same |
| Logic Elements | 4160 | 4160 |
| System Gates | 263000 | 263000 |
| Number of I/O | 246 | 246 |
| Embedded RAM Bits | 53248 | 53248 |
| Speed Grade | C7 | C7 |
| Core Voltage | 2.375V to 2.625V | 2.375V to 2.625V |
Key Differentiators
- Highest I/O count in the APEX-20K family at this speed grade (vs EP20K100CF144C8)
- Embedded system blocks (ESBs) provide distributed dual-port memory (vs EP20K100FC324-2X)
- Integrated PLLs reduce external clock-generator BOM cost (vs Discrete PLLs + EPF10K30A)
Design Notes
The EP20K100CF324C7ES core operates from a 2.375V to 2.625V supply with separate VCCIO rails per I/O bank. Decouple each VCC and VCCIO pin with a 0.1uF X7R ceramic capacitor placed as close as physically possible to the package ball, plus a bulk 10uF tantalum per bank. Estimated: a typical APEX-20K design with 60% utilization draws 0.8A to 1.2A from the 2.5V rail, so budget 1.5A headroom on the regulator. Use a low-noise LDO such as the TPS7A4701 family if analog performance matters.
The 324-FBGA package has a 1.0mm ball pitch, so escape routing must use 4 mil traces and 0.4mm via pads to break out the inner balls. Plan a 6-layer stackup with two inner solid ground planes under the BGA; via-in-pad is recommended for inner-row balls. Estimated: a single fanout of the 19x19 grid needs approximately 1.0 cm of board area, plus 1.0 mm clearance to adjacent components for rework. Match the high-speed signals and place series termination resistors within 3 mm of the FPGA balls.
Configuration is volatile — without a serial configuration device (EPC2/EPC4/EPC8/EPC16) the FPGA does not boot on power-up. The CONF_DONE pin must be monitored during boot, and JTAG signals must be brought to a header for in-system programming. Estimated: configuration time for a fully loaded EP20K100 is 60-150 ms via passive serial mode. Do not enable multi-device JTAG chains without isolating TMS and TCK with bus drivers, otherwise contention during configuration can corrupt the bitstream.
Estimate: an APEX-20K device at 60% utilization, 100 MHz internal clock, and 50% I/O toggling dissipates approximately 1.0W to 1.5W. The 324-FBGA package has a theta_JA around 15 C/W with a 6-layer board and sufficient copper pour, so junction temperature stays below 100C without an explicit heatsink. Add thermal vias under the central BGA balls to spread heat into inner ground planes if the device sits in a sealed enclosure with no airflow.
Mixing 3.3V PCI and 5V TTL signals on the same I/O bank is not allowed — each bank shares one VCCIO rail. Drive clocks through dedicated CLK pins and PLL inputs to keep skew below 200 ps. Estimated: long (>5 cm) LVTTL traces above 50 MHz require source-series termination (33 ohm) to control ringing. Use HyperLynx or Quartus II signal integrity analysis for backplane interfaces.
Compliance Information
RoHS/REACH compliance not stated in distributor listings. APEX-20K family uses lead-bearing BGA balls in some variants; request manufacturer's material declaration before assuming lead-free compliance. AEC-Q100 not applicable — part targets commercial/industrial, not automotive.
