EPM3512AQC208-10N - 512-MacroCell MAX 3000A CPLD, 208-PQFP | Intel
MPN: EPM3512AQC208-10N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $55.55 | $55.55 |
| 10 | $52.5 | $525.00 |
| 100 | $48.75 | $4,875.00 |
| 500 | $45.2 | $22,600.00 |
| 1,000 | $42.8 | $42,800.00 |
Drop-in alternatives for EPM3512AQC208-10N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM3512AQC208-10N Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | Up to 10,000 |
| Logic Array Blocks (LABs) | 16 |
| User I/Os | 172 |
| Package | 208-pin PQFP (Plastic Quad Flat Pack) |
| Supply Voltage | 3.3 V |
| Pin-to-Pin Delay | 4.5 ns (-10 speed grade) |
| Maximum Internal Frequency | 227.3 MHz |
| Speed Grade | -10 |
| Process Technology | CMOS EEPROM |
| In-System Programming | IEEE Std. 1149.1 JTAG, IEEE Std. 1532 |
| Boundary-Scan Test (BST) | Built-in, IEEE 1149.1 compliant |
| I/O Standards | MultiVolt (1.8V / 2.5V / 3.3V) |
| Operating Temperature | 0 C to 70 C (commercial) |
EPM3512AQC208-10N 208-pin pqfp (plastic quad flat pack) Pin Configuration Guide
Complete pinout information for EPM3512AQC208-10N (208-pin pqfp (plastic quad flat pack) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AQC208-10N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AQC208-10N is suitable for 6 applications: Bus-Interface Bridging Logic, Address Decoding and Chip-Select Generation, State-Machine and Glue-Logic Consolidation, Power-Up Sequencing Logic, Legacy Peripheral Glue Logic, Design Replacement / Last-Time-Buy Stockpile.
Bus-Interface Bridging Logic
The EPM3512AQC208-10N is well suited for bus-interface bridging between microprocessors, DSPs, memory, and peripherals in legacy embedded designs. Its 512 macrocells and 172 user I/Os can absorb address decoders, chip-select generators, and wait-state insertion logic that would otherwise require multiple 74-series discrete gates. The 4.5 ns pin-to-pin delay (tPD) ensures that address-to-CS latency stays well below typical memory access times (tAA of ~10 ns), avoiding wait-state insertion. MultiVolt I/O banks (1.8V, 2.5V, 3.3V) allow direct connection between 3.3V microprocessors and 1.8V mobile DDR memories without external level-shifters, simplifying board layout. JTAG ISP per IEEE 1149.1 enables in-system reprogramming of bridging logic during board bring-up and field upgrades without removing the device from the board.
Recommended
Address Decoding and Chip-Select Generation
Address decoding and chip-select logic for memory-mapped peripherals is a textbook CPLD use case, and the EPM3512AQC208-10N handles 16-bit or 24-bit address decoding across multiple banks with room to spare. Its 512 macrocells can implement up to 64 product-term-heavy CS equations, each with deterministic 4.5 ns propagation delay that simplifies worst-case timing analysis (no need to consider PVT variation in routing delay, unlike FPGAs). The non-volatile EEPROM configuration means the decoder is live within microseconds of power-up - critical for systems that boot from slow peripherals where FPGAs would have to wait for configuration memory. Boundary-scan test (BST) compliance lets manufacturing verify the CS netlist before system bring-up, catching solder bridges on 172 user I/O pins quickly.
Recommended
State-Machine and Glue-Logic Consolidation
Replacing tens of 74HC/74FCT discrete gates and PALs with a single EPM3512AQC208-10N reduces board area, BOM cost, and power consumption while making the design easy to revise via JTAG ISP. With 227.3 MHz maximum counter frequency and 4.5 ns tPD, it implements state machines with state-transition rates exceeding 100 MHz - suitable for protocol engines, motor-control sequencers, and timing-critical handshake logic. Each of the 16 LABs can host an independent state machine, with the programmable interconnect matrix (PIA) handling inter-block routing with deterministic delay. Industrial control and telecommunications equipment especially benefit because design revisions that previously required a respin can now be applied in seconds through the JTAG port.
Recommended
Power-Up Sequencing Logic
The EPM3512AQC208-10N excels at power-supply sequencing in multi-rail systems because its EEPROM-based configuration is active within microseconds of 3.3V rail stabilization, well before most downstream regulators. Its 172 user I/Os can drive dozens of enable and power-good signals with deterministic timing, eliminating the digital noise and propagation skew of cascaded discrete sequencer ICs. The 4.5 ns pin-to-pin delay gives sub-microsecond sequencing resolution, important for FPGAs, ASICs, and SoCs that mandate specific rail-on timing margins. Combined with built-in JTAG, the same CPLD that sequences the rails can also be re-flashed in-system to update sequencing order without PCB rework, ideal for platforms that ship in different SKU configurations.
Recommended
Legacy Peripheral Glue Logic
Industrial and telecom platforms often integrate ISA, PC/104, VME, or custom parallel buses that require wide glue-logic networks - exactly the role the EPM3512AQC208-10N was designed to fill. With 172 I/Os and 512 macrocells, a single device can replace several 22V10 or 16V8 PALs plus discrete latches, buffers, and transceivers, reducing chip count from 8-12 parts to one. The MAX 3000A architecture's deterministic timing simplifies worst-case timing analysis on long ISA-bus cycles, while 3.3V core and MultiVolt I/O let it bridge to 5V legacy peripherals via series-resistor level shifting. Boundary-scan support lets ATE verify all 172 I/O nets during ICT, catching solder defects that would otherwise escape to functional test.
Recommended
Design Replacement / Last-Time-Buy Stockpile
Because the EPM3512AQC208-10N is obsolete, one of its most common current-day applications is functional replacement on boards that must be manufactured, repaired, or sustained for years to come. Systems originally designed around MAX 3000A CPLDs often cannot migrate firmware to MAX II/MAX V without revalidating JTAG chain order, BSDL files, and timing constraints. Sourcing the exact 208-PQFP part - or a verified drop-in like EPM3512AQC208-10 or EPM3512AQC208-10-10N - lets field-service engineers swap failed CPLDs without touching firmware. Distributor and broker stock (e.g. Heisener lists 62,856 pieces as of 2026-09-12) provides a finite supply; planning ahead with multi-year buy agreements or up-screen to commercial temp-grade equivalents is recommended for long-life programs.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AQC208-10N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AQC208-10 | EPM3512AQC208-10-10N | EPM3512AQC20-10 | EPM3512AQ208-10N | EPM3256AQC208-10N |
|---|---|---|---|---|---|---|
| Package | 208-pin PQFP | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same | 208-pin PQFP - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Usable Gates | Up to 10,000 | Up to 10,000 | Up to 10,000 | Up to 10,000 | Up to 10,000 | Up to 5,000 |
| User I/Os | 172 | 172 | 172 | 172 | 172 | 164 |
| Pin-to-Pin Delay (tPD) | 4.5 ns (-10 grade) | 4.5 ns (-10 grade) | 4.5 ns (-10 grade) | 4.5 ns (-10 grade) | 4.5 ns (-10 grade) | 4.5 ns (-10 grade) |
| Internal Counter Frequency | 227.3 MHz | 227.3 MHz | 227.3 MHz | 227.3 MHz | 227.3 MHz | 227.3 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest macrocell density in the MAX 3000A family (vs EPM3256AQC208-10N)
- Largest user I/O count in the family (172) (vs EPM3256AQC208-10N)
- Standardized in-system programming (ISP) (vs Legacy 22V10 / 16V8 PALs)
Design Notes
The MAX 3000A family is non-volatile (EEPROM), but the device still requires a 3.3V supply ramp that meets the datasheet minimum tR/tF specification. Slow or noisy power-up sequences can cause JTAG ISP failures; verify with an oscilloscope that VCC reaches 3.0V within 100 ms and stays monotonic. If the host can only guarantee a soft-start, hold nCONFIG low during ramp to prevent partial configuration corruption.
The 208-pin PQFP has 0.5 mm pitch leads and requires careful PCB layout: use 4-layer stack-up with a continuous ground plane under the device, fanout vias in-pad or in-pad-via, and keep JTAG trace lengths below 75 mm to avoid signal integrity issues at 10 MHz TCK. Decouple VCCINT and VCCIO with 0.1 uF X7R ceramics placed within 5 mm of each supply pin, plus a 10 uF bulk cap per quadrant. The exposed die-pad area below the package has no thermal pad on PQFP, so no thermal via array is required.
When using MultiVolt I/O banks to bridge between 1.8V, 2.5V, and 3.3V logic, ensure that VCCIO banks are powered before driving output pins - otherwise the I/O buffers can backfeed through ESD diodes and latch-up the part. Sequencing is per the MAX 3000A datasheet: VCCINT first, then VCCIO banks, then signal drivers. For high-speed signals (>50 MHz) on 172 user I/Os, control impedance to 50 ohms single-ended and use series-termination resistors if ringing exceeds 5% VSW.
Estimated: at 3.3V, all 172 I/Os switching at 25 MHz, CMOS load 30 pF, total dynamic power is approximately P = 0.5 x C x V^2 x f = 0.5 x (172 x 30 pF) x 3.3^2 x 25 MHz = 0.07 W plus core power ~0.3 W, total ~0.4 W worst case. The 208-PQFP has theta_JA of approximately 35 C/W, giving junction rise of 14 C above ambient. No heatsink required for commercial-temperature designs; for industrial, ensure airflow keeps Tj under 100 C.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not specified in verified web data. Part is part of legacy Altera MAX 3000A family; the -N suffix typically indicates non-RoHS lead finish on legacy Altera parts - verify with manufacturer before use in RoHS-compliant assemblies. AEC-Q100 not applicable as this is a commercial-grade CPLD.
