LXES02TAA1-145 - 5.5V 0.35pF WLCSP ESD TVS Diode | Murata
MPN: LXES02TAA1-145 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.06 | $0.06 |
| 10 | $0.045 | $0.45 |
| 100 | $0.034 | $3.40 |
| 500 | $0.026 | $13.00 |
| 1,000 | $0.021 | $21.00 |
LXES02TAA1-145 Overview
What is a TVS diode? A Transient Voltage Suppression (TVS) diode is a semiconductor device designed to clamp transient overvoltage events (such as electrostatic discharge) to safe levels, protecting downstream integrated circuits. Within the protection taxonomy, TVS diodes belong to the broader family of ESD protection devices, which also includes varistors and Zener diodes; this category sits under circuit protection, which is part of power management and signal-conditioning in the broader electronics stack. TVS diodes are characterized by their fast response time (sub-nanosecond), low clamping voltage, and low leakage under normal operation.
Key features include an extremely low capacitance of 0.35 pF, which preserves signal integrity on high-speed data lines including USB 3.x, HDMI, and high-frequency antenna feeds where capacitance directly degrades eye-diagram margins. The 8 kV IEC 61000-4-2 contact discharge rating provides robust protection against human-body-model discharge events commonly encountered at consumer device connectors. The 5.5V working voltage covers standard 3.3V and 5V logic rails while the 7V breakdown ensures clamping only during fault conditions. The WLCSP-2 package measures only 0.40 x 0.20 mm, enabling protection placement directly adjacent to exposed I/O pads without consuming PCB area.
The LXES02TAA1-145 uses a silicon avalanche-breakdown TVS cell, which triggers when the line voltage exceeds VBR, shunting transient current to ground in less than 1 ns. This is markedly faster than varistor or polymer-based protection devices and ensures minimal let-through energy reaches the protected IC. The datasheet also confirms a 1-channel configuration with a single line-to-ground protection path, ideal for uni-directional protection of an individual signal pin.
Typical applications include USB 3.x data line protection, HDMI/MHL interface protection, mobile RF antenna line clamping, SIM/UIM card interface protection, and audio jack ESD protection on smartphones, tablets, and wearables. Recommended companion components are Murata LXES0xTAA series variants for multi-line ESD arrays or chip beads for EMI filtering.
Design considerations require that the device be placed as close as possible to the ESD entry point (typically the connector pin) with a low-inductance ground via, since series inductance to ground directly increases residual clamping voltage. When comparing with larger SOT-23 or SOD-123 parts, the LXES02TAA1-145 trades package size for lower parasitic inductance and capacitance, enabling cleaner high-speed signal transmission.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineers with a consolidated reference for the LXES02TAA1-145.
Drop-in alternatives for LXES02TAA1-145 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LXES02TAA1-146
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LXES03TAA1-145
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LXES02TAA1-147
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LXES02TAA1-148
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LXES01TAA1-145
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LXES02TAA1-145 Maximum Ratings & Electrical Characteristics
| Manufacturer | Murata Manufacturing |
| Series | LXESxxT (T Series) |
| Device Type | ESD Protection TVS Diode |
| Number of Channels | 1 channel |
| Reverse Stand-off Voltage (Vrwm) | 5.5 V |
| Breakdown Voltage (VBR) | 7 V |
| Capacitance | 0.35 pF |
| IEC 61000-4-2 Contact Discharge | 8 kV |
| Package / Case | WLCSP-2 (0.40 x 0.20 mm), also called CSP0402 |
| Mounting Type | Surface Mount |
| Polarity | Uni-directional |
| Operating Temperature | -40 C to +85 C |
| Recommended Applications | Consumer equipment, mobile devices, high-speed data lines |
| RoHS Status | Compliant |
| Lead Free | Yes |
LXES02TAA1-145 Pin Configuration
| Pin 1 | LINE (Anode) — Protected line / signal pin to be clamped to ground during ESD events |
| Pin 2 | GND (Cathode) — Ground return; must connect via a low-inductance via to the system ground plane |
Typical Applications
LXES02TAA1-145 is suitable for 6 applications: USB 3.x Data Line Protection, HDMI / MHL Interface Protection, Mobile RF Antenna ESD Clamping, SIM / UIM Card Interface Protection, Audio Jack ESD Protection, Wearable / IoT Device Connector Protection.
USB 3.x Data Line Protection
The LXES02TAA1-145 protects USB 3.x SuperSpeed differential pairs from ESD events at the connector. With 0.35 pF channel capacitance per the Murata datasheet, it preserves the 5 Gbps signal eye diagram while the 8 kV IEC 61000-4-2 contact rating meets USB-IF ESD requirements. Place the diode within 3 mm of the connector pin and use a dedicated low-inductance ground via for best clamping performance.
Recommended
HDMI / MHL Interface Protection
The LXES02TAA1-145 is well-suited to HDMI and MHL TMDS data lines carrying multi-GHz transitions. The 0.35 pF capacitance cited on the Murata product page is essential at HDMI 2.0 / MHL speeds, where parasitic capacitance directly reduces transition margin. Using a diode-only 2-pin WLCSP saves PCB area versus multi-channel array packages, enabling placement at each TMDS pin individually.
Recommended
Mobile RF Antenna ESD Clamping
Mobile RF antenna lines operate with sub-nH loop inductance and tolerate only minimal parasitic loading, making the LXES02TAA1-145 ideal for antenna-to-RF-front-end clamping. The 0.35 pF capacitance per the Murata datasheet minimally degrades impedance matching on 4G/5G bands, while 8 kV IEC 61000-4-2 contact rating meets reliability targets for handheld devices prone to user-contact discharge.
Recommended
SIM / UIM Card Interface Protection
The LXES02TAA1-145 protects SIM card data and clock lines in smartphones and embedded devices. Its 5.5V stand-off rating accommodates both 1.8V and 3.0V SIM card signalling per Murata datasheet, and the 0.35 pF capacitance has negligible impact on the relatively slow SIM clock (a few MHz). Placing this diode near the SIM socket minimizes ESD strike propagation into the modem baseband IC.
Recommended
Audio Jack ESD Protection
Headphone and microphone jacks on consumer devices are frequent ESD entry points through user contact. The LXES02TAA1-145 with 8 kV IEC 61000-4-2 contact rating per the Murata product page offers robust protection for the audio codec ADC inputs, while the 0.35 pF capacitance has no impact on the 20 Hz to 20 kHz audio band. Place the diode on the analog audio trace adjacent to the jack.
Recommended
Wearable / IoT Device Connector Protection
Wearables and IoT edge devices use ultra-compact WLCSP-only PCB layouts where a SOD-323 TVS diode would consume unacceptable space. The LXES02TAA1-145 at 0.40 x 0.20 mm per the Murata datasheet fits inside connector keepouts and at the same time delivers 8 kV IEC 61000-4-2 contact rating. Use it to protect BLE antenna pads, sensor I/O, and exposed debug pins.
Recommended
Recommended Products Summary
Engineering reference data for LXES02TAA1-145 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LXES02TAA1-146 | LXES03TAA1-145 | LXES02TAA1-147 | LXES01TAA1-145 |
|---|---|---|---|---|---|
| Package | WLCSP-2 (0.40 x 0.20 mm) | WLCSP-2 (0.40 x 0.20 mm) - same | WLCSP-2 (0.40 x 0.20 mm) - same | WLCSP-2 (0.40 x 0.20 mm) - same | WLCSP-2 (0.40 x 0.20 mm) - same |
| Brand | Murata Manufacturing | Murata Manufacturing | Murata Manufacturing | Murata Manufacturing | Murata Manufacturing |
| Reverse Stand-off Voltage (Vrwm) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Capacitance | 0.35 pF | 0.35 pF class | 0.35 pF class | 0.35 pF class | 0.35 pF class |
| IEC 61000-4-2 Contact | 8 kV | 8 kV class | 8 kV class | 8 kV class | 8 kV class |
| Number of Channels | 1 | 1 | 1 | 1 | 1 |
| Mounting Type | Surface Mount WLCSP | Surface Mount WLCSP | Surface Mount WLCSP | Surface Mount WLCSP | Surface Mount WLCSP |
Key Differentiators
- Ultra-low 0.35 pF capacitance (vs SOD-323 package TVS parts (e.g. PESD5V0L1BA typically ~1 pF))
- World-class 0.40 x 0.20 mm footprint (vs Larger WLCSP or discrete-package TVS diodes)
- 8 kV IEC 61000-4-2 contact rating (vs Generic 4 kV-rated WLCSP ESD clamps)
Design Notes
Place the LXES02TAA1-145 within 3 mm of the connector pin that is the ESD entry point. The ground pin must connect to the system ground plane through a dedicated via placed adjacent to the package - any series inductance here directly increases residual clamping voltage. Estimated: every 1 nH of via+trace inductance adds approximately 1 V of overshoot per amp of ESD current; keep total ground return loop under 1 nH.
Maintain 50 ohm controlled-impedance routing on the protected signal trace through and after the diode placement. The 0.35 pF package capacitance adds a small but measurable discontinuity; avoid stubs by placing the diode inline with the signal path rather than on a branch. Reference manufacturer application layouts for HDMI and USB 3.x when possible.
Estimated: never share a single ground via between multiple LXES02TAA1-145 diodes or between the ESD clamp and other high-current return paths; shared ground inductance will allow simultaneous ESD events to lift the local ground and defeat the clamp. Each protected line must use its own low-impedance via. Also, do not place the diode on the far side of a series ferrite or resistor from the connector, since the inductor will block the ESD current path to the clamp.
Although 0.35 pF is small, at 5 GHz this still presents roughly 90 ohm of capacitive reactance, so a small shunt L-match network may be required at the diode footprint to maintain S11 below -10 dB. Reference design patterns for USB 3.x and HDMI 2.0 from Murata's application notes typically include this matching detail.
Compliance Information
RoHS compliance confirmed via Murata product page. Part is not AEC-Q100 qualified as it is targeted at consumer equipment; halogen-free status not explicitly published in the provided data.
