M25P40-VMB3TPB - 4Mb SPI NOR Flash 75MHz | Micron Technology
MPN: M25P40-VMB3TPB β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.15 | $1.15 |
| 10 | $1 | $10.00 |
| 100 | $0.85 | $85.00 |
| 500 | $0.8 | $400.00 |
| 1,000 | $0.75 | $750.00 |
Drop-in alternatives for M25P40-VMB3TPB β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
M25P40-VMB6TPB
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
W25Q40BVZPIG
β Drop-Inπ Reference alternative (not in catalog)
GD25Q40CWIGR
β Drop-Inπ Reference alternative (not in catalog)
MX25L4006EZNI-12G
β Drop-Inπ Reference alternative (not in catalog)
M25P40-VMB3TPB Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash, Serial (SPI) |
| Density | 4Mb (512Kb x 8) |
| Word Size | 8 bits |
| Interface | SPI-compatible, synchronous |
| Maximum Clock Frequency | 75 MHz |
| Supply Voltage Range | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +125C |
| Write Protection | Hardware (WP#) and software protection |
| Package | 8-UFDFPN (2x3 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| RoHS Status | Compliant |
| FBGA Code | N/A |
| Chipset Validation | N/A |
| Program/Erase Infrastructure | Page program, sector erase, bulk erase |
| Hold Function | Yes (HOLD# pin) |
M25P40-VMB3TPB Pin Configuration
| Pin 1 | S# β Chip Select (active low) |
| Pin 2 | Q β Serial Data Output (DO) |
| Pin 3 | WP# β Write Protect (active low) |
| Pin 4 | VSS β Ground |
| Pin 5 | D β Serial Data Input (DI) |
| Pin 6 | C β Serial Clock (SCLK) |
| Pin 7 | HOLD# β Hold (suspends serial communication, active low) |
| Pin 8 | VCC β Power supply (2.3 V to 3.6 V) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M25P40-VMB3TPB is suitable for 6 applications: Embedded Boot Code Storage, Industrial PLC and Factory Automation, Networking and Communication Equipment, Consumer Electronics and Set-Top Boxes, Battery-Powered and Portable Devices, Automotive-Adjacent Body Electronics.
Embedded Boot Code Storage
The M25P40-VMB3TPB stores bootloader and firmware images for microcontrollers and SoCs in embedded systems. Its 4Mb (512KB) capacity accommodates compressed bootloaders plus configuration blocks, while 75MHz SPI reads minimize boot latency during code shadowing to RAM. The 2.3V-3.6V supply connects directly to 3.3V MCU rails without level shifting, and the -40C to +125C rating covers industrial enclosures with limited airflow. The WP# pin and software status-register protection prevent accidental corruption of the boot image during brownout or firmware-update failures, a critical reliability requirement for unattended field equipment. The compact 2x3 mm UFDFPN footprint fits under or beside the MCU on dense boards.
Recommended
Industrial PLC and Factory Automation
In programmable logic controllers, motor drives, and factory automation nodes, the M25P40-VMB3TPB provides nonvolatile storage of configuration parameters, calibration tables, and event logs. The -40C to +125C operating range survives control-cabinet temperature swings, and the SPI interface consumes only four board signals plus power, preserving MCU I/O. Its hardware write protection ensures that safety-related parameter sets cannot be altered by firmware faults. Program and erase operations complete under firmware control with status-polling, allowing parameter writes during idle scan cycles. Because the part is EOL, new industrial designs should qualify the pin-compatible WSON-8 alternatives (Winbond W25Q40, GigaDevice GD25Q40C) listed on this page for long-term supply.
Recommended
Networking and Communication Equipment
Routers, switches, and optical modules use serial NOR flash such as the M25P40-VMB3TPB to hold boot code, MAC addresses, and board-level manufacturing data. The 75MHz SPI clock supports fast POST reads so network ports initialize within link-negotiation timing budgets, and the 4Mb density is sufficient for compact bootloaders in access-layer hardware. The 2x3 mm UFDFPN package fits on SFP/QSFP module PCBs where height and area are severely constrained. The HOLD# pin lets the host suspend a read cycle to service higher-priority bus traffic without restarting the command, improving CPU efficiency in polling-driven management firmware operating over -40C to +85C telecom ambient ranges.
Recommended
Consumer Electronics and Set-Top Boxes
Set-top boxes, smart TVs, printers, and small appliances store boot firmware and settings in low-cost serial NOR flash. The M25P40-VMB3TPB's 4Mb capacity covers compact bootloaders, while the 2.3V-3.6V supply matches common 3.3V housekeeping rails. Its ultra-thin 8-UFDFPN body supports tightly stacked consumer PCBs and low-profile enclosures. Software write protection guards the factory-calibration region against user-triggered corruption, and the SPI bus is shared with other low-speed peripherals to minimize routing. Note that this part is EOL: consumer designs in production should dual-source with the pin-compatible Winbond W25Q40BVZPIG or GigaDevice GD25Q40C WSON-8 parts to mitigate EOL supply risk.
Recommended
Battery-Powered and Portable Devices
Portable meters, asset trackers, and IoT sensor nodes benefit from the M25P40-VMB3TPB's low-voltage 2.3V-3.6V operation and low standby power draw when deselected. Firmware and measurement tables persist through battery replacement, and the HOLD# pin allows the host to freeze an in-progress access while the system sleeps, returning to the same command afterward to save energy. The 2x3 mm package minimizes PCB area in wearable and handheld form factors, and the wide 2.3V floor tolerates direct connection to discharging lithium cells through an LDO with modest dropout. Firmware should batch parameter writes into page-program operations to minimize erase cycles across the battery lifetime.
Recommended
Automotive-Adjacent Body Electronics
Non-safety automotive-adjacent modules such as seat controllers, lighting modules, and tire-pressure monitors use industrial-grade serial NOR flash in heated environments. The M25P40-VMB3TPB's +125C upper rating covers under-dash and engine-bay-adjacent zones where ambient plus self-heating exceeds 105C, and the SPI interface interfaces cleanly with automotive MCUs. Hardware write protection secures configuration and VIN-specific calibration data against accidental writes during voltage transients on the 12V-derived 3.3V rail. Note this exact part is not AEC-Q100 qualified; for certified automotive sockets, evaluate Micron's MT25Q AEC-Q100 variants (for example MT25QL128ABB8E12-CAUT) or a qualified competitor part and redesign the footprint accordingly.
Recommended
Recommended Products Summary
Engineering reference data for M25P40-VMB3TPB β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M25P40-VMB6TPB | M25P40-VMN3TPB | W25Q40BVZPIG | GD25Q40CWIGR |
|---|---|---|---|---|---|
| Package | 8-UFDFPN (2x3 mm) | 8-UFDFPN (2x3 mm) - same | SOIC-8 (SO8W) - different footprint | WSON-8 (2x3 mm) - same footprint | WSON-8 (2x3 mm) - same footprint |
| Brand | Micron Technology | Micron Technology | Micron Technology | Winbond | GigaDevice |
| Density | 4Mb (512Kb x 8) | 4Mb (512Kb x 8) | 4Mb (512Kb x 8) | 4Mb (512Kb x 8) | 4Mb (512Kb x 8) |
| Max Clock Frequency | 75 MHz | 75 MHz | 75 MHz | 104 MHz (spec-class) | [DATA_NEEDED] |
| Supply Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | EOL | EOL (same family) | EOL (same family) | Active | Active |
| Approx. Unit Price | $0.79 - $1.15 (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Extended -40C to +125C temperature range (vs M25P40-VMB6TPB)
- Ultra-compact 2x3 mm footprint vs SOIC-8 sibling (vs M25P40-VMN3TPB)
- Simple legacy M25P command set with hardware write protect (vs W25Q40BVZPIG)
Design Notes
At the 75MHz maximum SPI clock, treat C, D, and Q as controlled-impedance lines: keep traces under 50mm where possible, add 22-33 ohm series termination near the host on C and D if trace stubs exceed that, and avoid routing the SPI bus adjacent to switching-regulator nodes. Verify clock-high and clock-low pulse widths and data setup/hold at 3.0V against the datasheet AC table across temperature; marginal timing that passes at room temperature can fail at -40C or +125C.
Place a 100nF ceramic decoupling capacitor within 2mm of the VCC (pin 8) to VSS (pin 4) pair, plus a 4.7-10uF bulk capacitor per rail segment. Erase operations draw the highest current peaks; size the 3.3V rail so the combined MCU-plus-flash transient does not sag below the 2.3V minimum. Estimated: a bulk erase at typical datasheet ICC adds tens of mA on top of logic current - confirm exact value from the datasheet ICC table rather than this estimate.
Because the M25P40 family is EOL, do not sole-source new layouts on this exact MPN. Design the PCB with the 2x3 mm WSON-8/UFDFPN-8 footprint (same land pattern as W25Q40BVZPIG/GD25Q40C) so an active alternative can be substituted without respin. Also check WP# and HOLD# tie-offs: floating WP# leaves the part unprotected, and HOLD# must be pulled high if unused, or random bus glitches can stall SPI transfers.
The UFDFPN (2x3 mm) package has a small exposed die pad on the underside; per standard practice for DFN/WSON packages, tie the pad to VSS with several vias to the ground plane to improve thermal dissipation and mechanical reliability, and inspect solder joints with X-ray on first-article builds since the pad is hidden. Follow the land-pattern dimensions in the package section of the manufacturer datasheet for the 8-UFDFPN footprint.
Compliance Information
RoHS compliant per manufacturer and distributor product data (V prefix denotes lead-free/RoHS construction). Not an AEC-Q100 automotive part. REACH/halogen-free/conflict-minerals declarations not stated in provided data - request current certificate from Micron.
