M321R4GA3BB6-CQK - 32GB DDR5-4800 ECC RDIMM | Samsung
MPN: M321R4GA3BB6-CQK ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1828.125 | $1,828.13 |
| 10 | $1320.3125 | $13,203.13 |
| 100 | $1167.9688 | $116,796.88 |
| 500 | $1117.1875 | $558,593.75 |
| 1,000 | $1066.4063 | $1,066,406.30 |
M321R4GA3BB6-CQK Overview
An RDIMM (Registered DIMM) is a server-class memory module that buffers clock, command, and address signals through a register, reducing electrical load on the memory controller and enabling higher module counts per channel than unbuffered UDIMMs. RDIMMs sit within the memory hierarchy of DDR5 SDRAM technology, the fifth generation of double data rate synchronous DRAM standardized by JEDEC, and are the dominant memory form in enterprise servers and workstations.
Key features of the M321R4GA3BB6-CQK include on-module error correction via added 8-bit parity signals, a register for enhancing clock, command, and control signal integrity, support for x4/x8 organization with up to 2 ranks per DIMM, and on-die ECC inherent to DDR5 DRAM. The module is built from 20 FBGA-packaged 2Gx8 DDR5 DRAM components.
Architecturally, DDR5 doubles the bank groups and burst length versus DDR4, splits the module power supply so the PMIC moves onto the DIMM, and runs at a lower 1.1 V core voltage, cutting per-bit power consumption while raising data rates to 4800 Mbps. The registered interface ensures stable signaling across the 288-pin edge connector even in multi-DIMM, multi-channel server platforms.
Typical applications include HPE ProLiant DL325/DL345/DL360/DL380 Gen11 servers (OEM cross-reference HPE P43330-0A1), Dell PowerEdge platforms, virtualization hosts, and database or analytics workstations where validated ECC memory capacity is mandatory.
Design consideration: RDIMMs are electrically incompatible with desktop boards that require UDIMMs; always verify the platform QVL and mixing rules (same speed, rank, and capacity per channel) before deployment.
This page synthesizes distributor listings, OEM cross-references, and compatible replacement options not found in the Samsung datasheet.
Drop-in alternatives for M321R4GA3BB6-CQK — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with M321R4GA3BB6-CQK (same form factor and footprint) — differing in Data Rate, ECC, Form Factor, JEDEC Compliance, Module Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M321R4GA3BB0-CQK
📋 Reference alternative (not in catalog)
M321R4GA3BB6-CQKET
📋 Reference alternative (not in catalog)
M324R4GA3BB0-CQK
📋 Reference alternative (not in catalog)
M321R4GA3BB6-CQK-ATC
📋 Reference alternative (not in catalog)
OWC 32GB DDR5-4800 RDIMM
📋 Reference alternative (not in catalog)
NEMIX 32GB DDR5-4800 RDIMM
📋 Reference alternative (not in catalog)
M321R4GA3BB6-CQK Maximum Ratings & Electrical Characteristics
| Capacity | 32 GB |
| Memory Type | DDR5 SDRAM |
| Module Type | ECC Registered DIMM (RDIMM) |
| Data Rate | 4800 Mbps (PC5-38400) |
| Clock Speed | 4800 MHz |
| CAS Latency | CL40 |
| Form Factor | 288-pin DIMM |
| Organization | 4Gx72 (2Rx8, dual rank x8) |
| Ranks | 2 |
| DRAM Configuration | 20 FBGA 2Gx8 DDR5 DRAM |
| Operating Voltage | 1.1 V |
| ECC | Yes (8-bit parity signals + DDR5 on-die ECC) |
| Register | Yes (buffers clock, command and control signals) |
| Application | PC / Server |
| Configuration Support | x4 / x8 organization, up to 2 ranks per DIMM, 3DPC |
| JEDEC Compliance | JEDEC-standard DDR5 RDIMM |
M321R4GA3BB6-CQK standard Pin Configuration Guide
Pin configuration for M321R4GA3BB6-CQK (standard package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M321R4GA3BB6-CQK.
Refer to the datasheet for full pin configuration.
Typical Applications
M321R4GA3BB6-CQK is suitable for 6 applications: HPE ProLiant Gen11 Servers, Virtualization and Cloud Hosts, Database and Analytics Servers, Dell PowerEdge DDR5 Platforms, Workstation Memory Upgrades, Memory Replacement and Service Spares.
HPE ProLiant Gen11 Servers
The M321R4GA3BB6-CQK is OEM-validated for HPE ProLiant DL325 Gen11, DL345 Gen11, DL360 Gen11, and DL380 Gen11 platforms through HPE cross-reference P43330-0A1, per RamQuote compatibility data. Its 32 GB DDR5-4800 2Rx8 configuration with ECC registering delivers validated capacity and bandwidth for virtualization hosts running VMware ESXi or Windows Server. The register buffering of clock, command, and control signals allows high per-channel DIMM populations without signal-integrity degradation, and the 8-bit parity plus DDR5 on-die ECC protects against memory errors in always-on enterprise workloads. Populate identical modules per channel to maximize validated multi-channel performance.
Recommended
Virtualization and Cloud Hosts
Virtualization hosts benefit directly from the M321R4GA3BB6-CQK's 32 GB density at DDR5-4800 bandwidth (PC5-38400), because hypervisor overhead and per-VM memory footprints scale with installed capacity. At CL40 latency and 1.1 V, the module balances throughput against power draw, important when 16-24 DIMMs are populated per 2P server. ECC registered architecture prevents uncorrected memory errors from corrupting multiple tenant workloads, while dual-rank x8 organization improves effective bandwidth via interleaved rank access. Deploy modules in balanced sets per NUMA node to keep memory channels symmetric and avoid performance asymmetry between virtual machine placements.
Recommended
Database and Analytics Servers
In-memory databases such as SAP HANA, Oracle, and PostgreSQL analytics clusters demand both capacity and error protection, both delivered by the M321R4GA3BB6-CQK: 32 GB per module, DDR5-4800 bandwidth, and layered ECC (8-bit parity plus on-die ECC). Dual-rank 4Gx72 organization improves row-hit locality for sequential scans and columnar queries versus single-rank modules. Samsung's 20-die FBGA 2Gx8 DRAM construction provides mature thermal behavior at 1.1 V in dense chassis. For scale-out database nodes, use identical Samsung SKUs across all nodes so memory revision mixing does not complicate firmware validation or OEM support contracts.
Recommended
Dell PowerEdge DDR5 Platforms
Dell PowerEdge 16G/17G servers accepting DDR5 RDIMMs are directly compatible with the M321R4GA3BB6-CQK's JEDEC-standard 32 GB DDR5-4800 2Rx8 ECC registered specification, as noted by CoreWaveLabs compatibility data for Dell platforms. The 288-pin registered interface and 1.1 V operation match Dell's validated memory population rules, and the module's register offloads the CPU memory controller, enabling full 8-16 DIMM-per-CPU configurations. Administrators should follow Dell's mixing rules (identical speed, rank, and capacity per channel) and prefer single-SKU deployments like this Samsung part to keep memory training consistent across reboots and BIOS updates.
Recommended
Workstation Memory Upgrades
Engineering workstations built on AMD Threadripper PRO or Intel Xeon W platforms with RDIMM support can use the M321R4GA3BB6-CQK as a 32 GB DDR5-4800 upgrade; the ECC registered design is required on these platforms, where consumer UDIMMs will not train. Dual-rank x8 topology improves bandwidth for CAD rendering, simulation, and AI dataset staging, while 1.1 V operation keeps acoustic and thermal budgets low in tower chassis. The JEDEC CL40 timing guarantees plug-and-play training without profile tuning. Verify the workstation QVL lists DDR5-4800 RDIMM before purchase, since some desktop-class boards accept only UDIMMs.
Recommended
Memory Replacement and Service Spares
Field service organizations stocking spares for mixed server fleets can standardize on the M321R4GA3BB6-CQK because validated third-party replacements (A-Tech M321R4GA3BB6-CQK-ATC, OWC, and NEMIX RAM modules) are purpose-built to its 32 GB PC5-38400R 2Rx8 1.1V specification, according to Newegg, Amazon, and NemixRAM listings. This means a single spare SKU covers Samsung, A-Tech, OWC, and NEMIX interchange scenarios on HPE Gen11 and Dell platforms. Keep at least one spare per eight populated servers to meet SLA repair windows; swap failed DIMMs channel-by-slot and re-run memory training after replacement.
Recommended
Recommended Products Summary
Engineering reference data for M321R4GA3BB6-CQK — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M321R4GA3BB0-CQK | M321R4GA3BB6-CQKET | M321R4GA3BB6-CQK-ATC | OWC 32GB DDR5-4800 RDIMM (replaces M321R4GA3BB6-CQK) |
|---|---|---|---|---|---|
| Package | 288-pin DIMM | 288-pin DIMM - same | 288-pin DIMM - same | 288-pin DIMM - same | 288-pin DIMM - same |
| Brand | Samsung | Samsung | Samsung | A-Tech (3rd-party replacement) | OWC (3rd-party replacement) |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB |
| Data Rate | 4800 Mbps (PC5-38400) | 4800 Mbps | 4800 Mbps | 4800 Mbps | 4800 Mbps |
| Rank / Organization | 2Rx8 (4Gx72) | 2Rx8 | 2Rx8 | 2Rx8 | 2Rx8 |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V (listing shows 1.2 V at Server Supply) | 1.1 V | 1.1 V |
| ECC | Yes (Registered + parity + on-die ECC) | Yes (RDIMM) | Yes (RDIMM) | Yes (ECC Registered) | Yes (ECC Registered) |
Key Differentiators
- OEM-validated cross-reference for HPE Gen11 (vs M321R4GA3BB6-CQK-ATC)
- Dual-rank x8 for higher effective bandwidth (vs M321R4GA3BB0-CQK)
- Cost-validated third-party fallback exists (vs M324R4GA3BB0-CQK)
Design Notes
RDIMMs such as the M321R4GA3BB6-CQK are NOT interchangeable with unbuffered DDR5 UDIMMs, and DDR5 is not backward compatible with DDR4 slots. The 288-pin DDR5 connector has a different notch position than DDR4, preventing wrong insertion, but purchasing errors are common. Verify the platform QVL accepts DDR5-4800 2Rx8 RDIMM before ordering, and never mix UDIMM and RDIMM in the same channel - virtually no server platform supports mixed population.
For maximum validated performance, populate identical modules (same Samsung SKU, speed, rank, and capacity) per memory channel. Mixing die revisions such as M321R4GA3BB6-CQK with M324R4GA3BB0-CQK usually works at JEDEC 4800 Mbps but may cause the BIOS to train all channels to the slowest common denominator, and can complicate OEM warranty support. Follow HPE/Dell population order tables: fill white slots first (typically channels furthest from the CPU).
DDR5-4800 RDIMMs at 1.1 V dissipate modest power (roughly 3-5 W per module under load, depending on utilization - estimate, not a datasheet figure). In dense 2U chassis with 24+ DIMMs, ensure chassis airflow crosses the DIMM bank; many Gen11 servers offer optional DIMM heatsinks or air baffles. Monitor DIMM temperatures via IPMI/Redfish; sustained temperatures above the JEDEC operating limit trigger throttling before shutdown, degrading bandwidth predictably.
Compliance Information
OWC third-party replacement listings explicitly state JEDEC-standard and RoHS compliance; RoHS compliance for the Samsung original follows standard Samsung module policy but was not stated verbatim in the verified data.
