MT40A1G8SA-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron
MPN: MT40A1G8SA-062E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.87 | $6.87 |
| 10 | $6.5 | $65.00 |
| 100 | $6.1 | $610.00 |
| 500 | $5.8 | $2,900.00 |
| 1,000 | $5.5 | $5,500.00 |
Drop-in alternatives for MT40A1G8SA-062E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT40A1G8AG-062E
✅ Drop-In📋 Reference alternative (not in catalog)
MT40A512M16TB-062E:R
✅ Drop-In✓ 99,999 In Stock
$60 / Unit
View Datasheet →K4A8G085WB-BIWE
✅ Drop-In✓ 99,999 In Stock
$6.5 / Unit
View Datasheet →H5AN8G6NDJR-XNC
✅ Drop-In✓ 99,999 In Stock
$34.6 / Unit
View Datasheet →NT5AD512M16C4-JR
✅ Drop-In✓ 99,999 In Stock
$73.75 / Unit
View Datasheet →MT40A1G8SA-062E Maximum Ratings & Electrical Characteristics
| Memory Type | SDRAM - DDR4 |
| Memory Size | 8 Gbit |
| Organization | 1G x 8 |
| Data Rate | 3200 MT/s |
| Clock Frequency | 1.6 GHz |
| Access Time | 19 ns |
| Supply Voltage (VDD/VDDQ) | 1.2V ±60mV |
| VPP Supply | 2.5V (-125mV, +250mV) |
| Operating Temperature Range | 0°C to +95°C (standard), -40°C to +95°C (industrial) |
| Refresh Time | 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C |
| Number of Banks | 16 (4 bank groups of 4) |
| CAS Latency | 22 (CL22) |
| Package | 78-FBGA (7.5x11 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
MT40A1G8SA-062E Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply (1.2V) |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin A13 | VDD — Power supply (1.2V) |
| Pin B1 | VPP — Wordline boost supply (2.5V) |
| Pin B2 | VSS — Ground |
| Pin B3 | VDDQ — I/O power supply (1.2V) |
| Pin B4 | VSS — Ground |
| Pin B5 | VDDQ — I/O power supply (1.2V) |
| Pin B6 | VSS — Ground |
| Pin B7 | VDDQ — I/O power supply (1.2V) |
| Pin B8 | VSS — Ground |
| Pin B9 | VDDQ — I/O power supply (1.2V) |
| Pin B10 | VSS — Ground |
| Pin B11 | VDDQ — I/O power supply (1.2V) |
| Pin B12 | VSS — Ground |
| Pin B13 | VPP — Wordline boost supply (2.5V) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT40A1G8SA-062E is suitable for 6 applications: Server Memory Modules, Networking Equipment, Data Center Accelerators, Embedded Systems, High-Performance Computing, Consumer Electronics.
Server Memory Modules
The MT40A1G8SA-062E is ideal for server DIMMs (e.g., RDIMMs, LRDIMMs) where high density and bandwidth are critical. Its 8Gb density and x8 organization allow building 16GB or 32GB modules with 3200 MT/s speed, meeting the demands of cloud computing and enterprise data centers. The 1.2V operation reduces power consumption, and the 78-ball FBGA package ensures compatibility with standard DIMM layouts. With 16 internal banks and advanced features like on-die termination and write leveling, it maintains signal integrity at high speeds, essential for reliable server operation.
Recommended
Networking Equipment
In networking switches and routers, the MT40A1G8SA-062E provides high-speed packet buffering and forwarding tables. Its 3200 MT/s data rate supports line-rate processing, while the 8Gb capacity handles large routing tables and QoS queues. The industrial temperature variant (IT) is suitable for outdoor or harsh environments. The device's low power consumption (1.2V) is beneficial for power-over-Ethernet (PoE) designs. The 78-ball FBGA package fits compact line cards, and the on-die termination reduces signal reflections, ensuring reliable operation in high-speed backplanes.
Recommended
Data Center Accelerators
For AI and machine learning accelerators, the MT40A1G8SA-062E offers high bandwidth for model weights and activations. Its 8Gb density and x8 interface allow multiple devices to be cascaded for larger memory pools. The 3200 MT/s speed matches the requirements of high-performance computing (HPC) workloads. The device's low latency (19ns access time) is critical for real-time inference. The 1.2V supply reduces thermal load in dense accelerator cards. The 78-ball FBGA package is compatible with standard PCB layouts, and the ZQ calibration feature ensures consistent drive strength across devices.
Recommended
Embedded Systems
In embedded systems like industrial PCs and medical devices, the MT40A1G8SA-062E provides reliable, high-speed memory. Its industrial temperature range (-40°C to +95°C) is suitable for harsh environments. The 8Gb capacity supports complex applications like real-time control and image processing. The 1.2V operation is compatible with low-power embedded processors. The 78-ball FBGA package is easy to route on compact PCBs. The device's auto self-refresh and write leveling features simplify system design, ensuring data integrity without external intervention.
Recommended
High-Performance Computing
For HPC clusters, the MT40A1G8SA-062E delivers the bandwidth needed for scientific simulations and big data analytics. Its 3200 MT/s data rate and 8Gb density enable large memory footprints in compute nodes. The device's low power consumption (1.2V) is critical for energy-efficient supercomputers. The 16 internal banks reduce row conflicts, improving random access performance. The 78-ball FBGA package supports high-density PCB layouts, and the CRC function detects data corruption, enhancing reliability in long-running computations.
Recommended
Consumer Electronics
In high-end consumer devices like gaming consoles and 4K TVs, the MT40A1G8SA-062E provides fast memory for graphics and multimedia. Its 8Gb capacity supports large frame buffers and streaming data. The 3200 MT/s speed ensures smooth 4K video playback and responsive gaming. The 1.2V operation is suitable for battery-powered devices, and the 78-ball FBGA package is compact for slim designs. The device's low latency improves user experience, and the on-die termination reduces signal integrity issues in high-speed interfaces.
Recommended
Recommended Products Summary
Engineering reference data for MT40A1G8SA-062E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT40A1G8AG-062E | MT40A512M16TB-062E:R | K4A8G085WB-BIWE | H5AN8G6NDJR-XNC |
|---|---|---|---|---|---|
| Package | 78-FBGA (7.5x11) | 78-FBGA (7.5x11) | 78-FBGA (7.5x11) | 78-FBGA (7.5x11) | 78-FBGA (7.5x11) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics | SK Hynix |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 1G x 8 | 1G x 8 | 512M x 16 | 1G x 8 | 1G x 8 |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| CAS Latency | 22 | 22 | 22 | 22 | 22 |
Key Differentiators
- Higher density per package (vs MT40A512M16TB-062E:R)
- Industrial temperature option (vs K4A8G085WB-BIWE)
- Proven reliability and supply chain (vs H5AN8G6NDJR-XNC)
Design Notes
Ensure stable 1.2V VDD and VDDQ supplies with low noise. Use 0.1uF ceramic capacitors close to each VDD/VDDQ pin and a bulk capacitor (e.g., 10uF) per supply rail. The VPP supply (2.5V) must also be decoupled with 0.1uF capacitors. Follow Micron's power distribution guidelines to minimize voltage droop during high-speed switching.
Route DDR4 signals with controlled impedance (typically 40-50 ohms single-ended, 80-100 ohms differential). Maintain equal trace lengths for DQ, DQS, and address/command signals to meet timing requirements. Use ground planes under the FBGA package to reduce noise. Refer to Micron's DDR4 PCB design guide for layout recommendations.
The MT40A1G8SA-062E dissipates power based on operating frequency and load. Ensure adequate airflow or heatsinking in high-temperature environments. The industrial temperature variant (IT) is rated for -40°C to +95°C, but thermal management is still necessary to keep the junction temperature within limits. Monitor the case temperature during operation.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for DRAM. REACH compliance assumed based on Micron's environmental policy.
