MALD-37445 - Quad 25G/26G CDR VCSEL Driver | MACOM
MPN: MALD-37445 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
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MALD-37445 Overview
A clock-and-data recovery IC is a high-speed signal-conditioning device that extracts timing information from a serial data stream and reconstructs a clean data output. A VCSEL driver is a semiconductor interface that converts high-speed electrical data into modulation current for a vertical-cavity surface-emitting laser. Together, these functions form part of the optical communication hierarchy: optical transceiver → transmit signal chain → clock and data recovery → VCSEL driver → semiconductor.
The primary verified features of MALD-37445 are four integrated CDR/VCSEL-driver channels, two supported retiming rates of 24.33 Gbps and 25.78 Gbps, an input equalizer, reference-free CDR operation, CDR bypass capability, and 250 µm output spacing. This combination is intended to reduce transmit-path component count while supporting both standardized and legacy interfaces. The equalizer addresses channel-loss impairments before data reaches the CDR, while retiming improves signal integrity by removing accumulated timing variation.
Architecturally, the device is optimized as a complete one-chip transmit solution for optical modules. Each channel combines receive-side input conditioning with transmit-side laser drive, allowing an optical subsystem to process incoming high-speed data for re-timing and forwarding. The selectable CDR-bypass path is important when interoperability depends on legacy or non-standard data rates that the internal retiming loop should not process.
Typical uses include 25G and 26G optical-module transmit sections, quad-lane optical links, high-speed backplane or data-communication equipment, and systems requiring coordinated equalization, retiming, and VCSEL-drive functions. The output pitch directly supports compact optical-interface assembly, although the die format requires assembly-level design rather than conventional leaded or packaged-component replacement.
Designers must treat MALD-37445 as a bare-die RF and mixed-signal component. Its 3 mm × 2 mm form does not establish a pin-compatible drop-in footprint by itself. Board assembly must follow MACOM's die pad definitions, assembly process, thermal path, and high-speed layout guidance. Differential routing, impedance control, return paths, and laser-drive current settings must be validated in the complete channel rather than inferred only from aggregate data rate.
This page consolidates the verified manufacturer information, source links, packaging facts, application context, and engineering cautions. It distinguishes a complete optical transmit IC from merely similar high-speed drivers and avoids inventing electrical limits, prices, pin assignments, or replacement parts that the supplied evidence does not establish.
Drop-in alternatives for MALD-37445 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request AlternativesMALD-37445 Specifications
| Product Type | Quad CDR/VCSEL driver with input equalizer |
| Channel Count | 4 channels |
| Retiming Rate 1 | 24.33 Gbps |
| Retiming Rate 2 | 25.78 Gbps |
| Nominal Data-Rate Class | 25G/26G |
| CDR Architecture | Reference-free |
| CDR Bypass Support | Yes, for legacy or non-standard data rates |
| Input Equalization | Integrated |
| Output Spacing | 250 µm center-to-center |
| Die Dimensions | 3 mm × 2 mm |
| Available Delivery Formats | Waffle pack, whole wafer, or quartered wafer |
| Optical Interface Compatibility | Standard optical interfaces |
| Intended Circuit Role | One-chip optical transmit solution |
| Mounting Form | Bare die |
MALD-37445 standard Pin Configuration Guide
Pin configuration for MALD-37445 (standard package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for MALD-37445.
Refer to the datasheet for full pin configuration.
Typical Applications
MALD-37445 is suitable for 6 applications: 25G/26G Quad-Lane Optical Transmitters, Optical Data-Link Retiming, Legacy Optical-Interface Bridges, High-Speed Data-Communication Modules, Backplane Optical-Link Modules, High-Speed Test and Measurement Fixtures.
25G/26G Quad-Lane Optical Transmitters
MALD-37445 fits compact four-lane optical transmit blocks because it combines input equalization, reference-free CDR, and four VCSEL drivers in one 3 mm × 2 mm die. Each channel retimes at 24.33 Gbps or 25.78 Gbps, while the outputs use 250 µm center spacing for compatibility with standard optical interfaces. This integration can shorten the transmit chain and reduce board-routing complexity, but every lane still requires validated high-speed layout and an assembly process approved for the bare die.
Recommended
Optical Data-Link Retiming
The integrated CDR is suitable for transmit paths that need timing cleanup at 24.33 Gbps or 25.78 Gbps before data reaches a VCSEL. Reference-free operation removes the need to present the part as a conventional externally referenced retimer, while the input equalizer conditions the incoming stream before retiming. System-level benefit depends on the actual channel loss and jitter budget, so equalization and CDR settings must be validated with realistic sources, loads, and optical back-to-back tests.
Recommended
Legacy Optical-Interface Bridges
MALD-37445 is useful when an optical module must pass traffic at a legacy or non-standard rate that should not pass through its CDR retiming loop. The manufacturer explicitly identifies CDR bypass for this purpose, while normal retiming remains available at 24.33 Gbps and 25.78 Gbps. This mixed operating capability can simplify modules that transition between established optical interfaces, although bypass timing margins and signal-integrity limits are not provided in the verified excerpts and require application-level validation.
Recommended
High-Speed Data-Communication Modules
A communications module can use MALD-37445 to consolidate four high-speed transmit lanes without assigning equalization, retiming, and laser drive to separate devices. The 25G/26G operating class targets modern serial links, while 250 µm output pitch supports compact optical-interface construction. The design tradeoff is assembly complexity: engineers must obtain the authoritative die pad map, assembly notes, and reference layout rather than creating a footprint from the stated 3 mm × 2 mm outline.
Recommended
Backplane Optical-Link Modules
MALD-37445 may be evaluated for pluggable or embedded optical modules that carry several high-speed lanes between electronic and optical domains. Its four-channel architecture applies the same equalization, CDR, and VCSEL-drive functions across four lanes, potentially reducing discrete component count. Suitability depends on channel insertion loss, lane-to-lane skew, power delivery, thermal control, and assembly yield, none of which can be inferred from the verified data-rate and packaging information alone.
Recommended
High-Speed Test and Measurement Fixtures
MALD-37445 can support experimental transmit fixtures that exercise 24.33 Gbps or 25.78 Gbps retiming together with VCSEL drive and input equalization. Reference-free CDR operation is useful when building controlled test articles around the supported rates, while bypass permits investigation of non-standard streams. Because the verified evidence lacks supply limits, power data, thermal limits, and a public pad map, fixture design must begin with direct manufacturer support and incremental channel characterization.
Recommended
Engineering reference data for MALD-37445 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | MACOM Technology Solutions |
| Package | 3 mm × 2 mm bare die |
| Channel Count | 4 channels |
| Retiming Rate 1 | 24.33 Gbps |
| Retiming Rate 2 | 25.78 Gbps |
| Input Equalizer | Integrated |
| CDR Reference | Reference-free |
| CDR Bypass | Supported |
| Output Spacing | 250 µm centers |
| Delivery Formats | Waffle packs, whole wafers, or quartered wafers |
Key Differentiators
- Integrated four-channel transmit processing (vs A generic 25G VCSEL driver without verified CDR and equalization)
- Retiming plus bypass operating modes (vs A conventional always-retiming CDR/VCSEL-driver path)
- Optical-interface-focused output arrangement (vs A non-optical quad high-speed driver arrangement)
Design Notes
Do not create a footprint from the 3 mm × 2 mm die outline alone. Obtain the current MACOM pad map, die markings, assembly drawing, and process requirements before committing copper. The supplied evidence does not include pad numbers, dimensions, or connectivity, so any self-generated land pattern could misroute supplies, control signals, data paths, and laser outputs. Validate the assembly process and inspect electrical continuity after die attach.
Route each 24.33 Gbps or 25.78 Gbps lane as a controlled-impedance transmission line with continuous return paths and minimal branch loading. The integrated input equalizer and CDR can improve edge quality only if the preceding channel, package transition, and PCB geometry are controlled. Equalization and CDR settings must be established through end-to-end testing with realistic source, load, loss, and jitter conditions; the verified excerpts provide no amplitude, rise-time, or reach targets.
Do not treat MALD-37445A-DIE as an interchangeable MPN without confirmation from MACOM. Search results mention that suffix, but no supplied source verifies its die revision, pad map, function, or qualification. Likewise, do not infer that every quad 25G VCSEL driver is equivalent: input equalization, reference-free CDR, bypass behavior, output pitch, and bare-die interface are all required to establish meaningful compatibility.
Obtain the recommended die supply rails, bypass network, sequencing limits, and current settings from the complete manufacturer documentation before layout. The verified data identifies a four-channel CDR/VCSEL-driver assembly but gives no voltage, current, or power values, so a regulator network cannot be selected responsibly from public snippets. Evaluate power delivery at the die pads, separate sensitive paths where required, and verify temperature rise during full four-lane operation.
Compliance Information
The supplied manufacturer and search records contain no compliance declarations for MALD-37445. AEC-Q100 is marked not applicable because this is an optical communications IC rather than an automotive-qualified component in the provided data; this does not represent an automotive qualification claim.