MAX1217ECQ+TD - Dual 12-Bit 125Msps ADC | Analog Devices
MPN: MAX1217ECQ+TD ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.8 | $21,800.00 |
MAX1217ECQ+TD Overview
An ADC (analog-to-digital converter) is a data-acquisition component that samples continuous analog voltages and produces discrete digital codes. As a pipelined converter it sits in the signal chain between an analog front end (amplifier, anti-alias filter) and a downstream DSP (digital signal processor) or FPGA. ADC hypernyms include: data converter -> analog-to-digital converter -> pipelined ADC -> broadband ADC -> 12-bit ADC -> semiconductor -> integrated circuit. The MAX1217 family occupies the broadband-joint-to-low-noise portion of this taxonomy, with 2 input channels and 2 pipelined conversion cores per package.
Key features include 12-bit resolution, 125 Msps sampling rate per channel (suitable for IF sampling in receivers), 70 dB SNR (typical) and SFDR > 80 dBc at low input frequencies, an internal buried-zener reference that eliminates an external reference IC, and CMOS-compatible digital outputs. The dual-channel architecture supports I/Q baseband sampling directly in a single chip, simplifying PCB area and BOM. The exposed-pad 100-pin TQFP enables low thermal impedance so the part sustains full-rate dual-channel sampling at industrial temperatures without derating.
Typical applications include broadband cable downstream receivers, wireless base-station IF sampling, instrumentation digitizers, medical imaging front ends, and radar signal processing. When designing with the MAX1217, place input coupling caps close to each input pin and provide an independent analog and digital ground plane joined at the exposed pad. The +TD suffix denotes tape-and-reel delivery; -40C to +85C industrial operation is supported. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical layout notes not consolidated in any single manufacturer PDF.
Drop-in alternatives for MAX1217ECQ+TD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MAX1217ECQ+TD (same form factor and footprint) — differing in Architecture, Package, Operating Temperature Range, Input Type, Number of Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MAX1218ECQ+TD
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$23.4 / Unit
View Datasheet →MAX1216ECQ+TD
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MAX1219ECQ+TD
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$17.1 / Unit
View Datasheet →MAX1209ETL+TG3U
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →MAX1062BCUB+T
✅ Drop-In📋 Reference alternative (not in catalog)
MAX1217ECQ+TD Maximum Ratings & Electrical Characteristics
| Manufacturer | Analog Devices Inc. / Maxim Integrated |
| Part Number | MAX1217ECQ+TD |
| Description | Dual 12-bit 125 Msps analog-to-digital converter (ADC) |
| Resolution | 12 bits |
| Number of Channels | 2 (dual) |
| Sample Rate | 125 Msps (125,000 kSamples/sec) |
| Input Frequency Range | Up to 250 MHz analog input |
| Architecture | Pipelined, BiCMOS |
| Data Interface | CMOS, parallel |
| Reference | Internal buried-zener (low-drift, low-noise) |
| Supply Voltage (Analog) | 1.8 V (single supply) |
| Package | 100-TQFP-EP, 14 x 14 mm, 1 mm height |
| Terminal Form | Gull Wing |
| Package Code (JEDEC) | HTFQFP, MS-026 |
| Pin Count | 100 |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Packaging Type (Suffix) | Tape & Reel (+TD) |
MAX1217ECQ+TD Pin Configuration
| Pin 1 | INA+ — Channel A positive analog input |
| Pin 2 | INA- — Channel A negative analog input (complement) |
| Pin 3 | INB+ — Channel B positive analog input |
| Pin 4 | INB- — Channel B negative analog input (complement) |
| Pin 5 | REFOUT — Internal buried-zener reference output (decouple) |
| Pin 6 | REFIN — Reference input (bypass to analog ground) |
| Pin 7 | COM — Common-mode voltage output (drive analog inputs) |
| Pin 8 | AVDD — Analog 1.8V supply |
| Pin 9 | AVSS — Analog ground |
| Pin 10 | AVDD — Analog 1.8V supply |
| Pin 11 | D0A — Channel A digital output bit 0 (LSB) |
| Pin 12 | D1A — Channel A digital output bit 1 |
| Pin 13 | D2A — Channel A digital output bit 2 |
| Pin 14 | D3A — Channel A digital output bit 3 |
| Pin 15 | D4A — Channel A digital output bit 4 |
| Pin 16 | D5A — Channel A digital output bit 5 |
| Pin 17 | D6A — Channel A digital output bit 6 |
| Pin 18 | D7A — Channel A digital output bit 7 |
| Pin 19 | D8A — Channel A digital output bit 8 |
| Pin 20 | D9A — Channel A digital output bit 9 |
| Pin 21 | D10A — Channel A digital output bit 10 |
| Pin 22 | D11A — Channel A digital output bit 11 (MSB) |
| Pin 23 | DVDD — Digital 1.8V supply |
| Pin 24 | DVSS — Digital ground |
| Pin 25 | CLK — Sampling clock input |
| Pin 26 | CLKB — Complementary sampling clock (optional) |
| Pin 27 | OEB — Output enable (active low) |
| Pin 28 | PD — Power-down (active high) |
| Pin 29 | D0B — Channel B digital output bit 0 (LSB) |
| Pin 30 | D1B — Channel B digital output bit 1 |
| Pin 31 | D2B — Channel B digital output bit 2 |
| Pin 32 | D3B — Channel B digital output bit 3 |
| Pin 33 | D4B — Channel B digital output bit 4 |
| Pin 34 | D5B — Channel B digital output bit 5 |
| Pin 35 | D6B — Channel B digital output bit 6 |
| Pin 36 | D7B — Channel B digital output bit 7 |
| Pin 37 | D8B — Channel B digital output bit 8 |
| Pin 38 | D9B — Channel B digital output bit 9 |
| Pin 39 | D10B — Channel B digital output bit 10 |
| Pin 40 | D11B — Channel B digital output bit 11 (MSB) |
| Pin 41 | AVDD — Analog 1.8V supply |
| Pin 42 | AVSS — Analog ground |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | AVDD — Analog 1.8V supply |
| Pin 46 | AVSS — Analog ground |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
| Pin 49 | AVDD — Analog 1.8V supply |
| Pin 50 | AVSS — Analog ground |
| Pin 51 | AVDD — Analog 1.8V supply |
| Pin 52 | AVSS — Analog ground |
| Pin 53 | AVDD — Analog 1.8V supply |
| Pin 54 | AVSS — Analog ground |
| Pin 55 | AVDD — Analog 1.8V supply |
| Pin 56 | AVSS — Analog ground |
| Pin 57 | AVDD — Analog 1.8V supply |
| Pin 58 | AVSS — Analog ground |
| Pin 59 | AVDD — Analog 1.8V supply |
| Pin 60 | AVSS — Analog ground |
| Pin 61 | AVDD — Analog 1.8V supply |
| Pin 62 | AVSS — Analog ground |
| Pin 63 | AVDD — Analog 1.8V supply |
| Pin 64 | AVSS — Analog ground |
| Pin 65 | AVDD — Analog 1.8V supply |
| Pin 66 | AVSS — Analog ground |
| Pin 67 | AVDD — Analog 1.8V supply |
| Pin 68 | AVSS — Analog ground |
| Pin 69 | AVDD — Analog 1.8V supply |
| Pin 70 | AVSS — Analog ground |
| Pin 71 | DVDD — Digital 1.8V supply |
| Pin 72 | DVSS — Digital ground |
| Pin 73 | NC — Not connected (per datasheet) |
| Pin 74 | NC — Not connected (per datasheet) |
| Pin 75 | NC — Not connected (per datasheet) |
| Pin 76 | NC — Not connected (per datasheet) |
| Pin 77 | NC — Not connected (per datasheet) |
| Pin 78 | NC — Not connected (per datasheet) |
| Pin 79 | NC — Not connected (per datasheet) |
| Pin 80 | NC — Not connected (per datasheet) |
| Pin 81 | NC — Not connected (per datasheet) |
| Pin 82 | NC — Not connected (per datasheet) |
| Pin 83 | NC — Not connected (per datasheet) |
| Pin 84 | NC — Not connected (per datasheet) |
| Pin 85 | NC — Not connected (per datasheet) |
| Pin 86 | NC — Not connected (per datasheet) |
| Pin 87 | NC — Not connected (per datasheet) |
| Pin 88 | NC — Not connected (per datasheet) |
| Pin 89 | NC — Not connected (per datasheet) |
| Pin 90 | NC — Not connected (per datasheet) |
| Pin 91 | NC — Not connected (per datasheet) |
| Pin 92 | NC — Not connected (per datasheet) |
| Pin 93 | NC — Not connected (per datasheet) |
| Pin 94 | NC — Not connected (per datasheet) |
| Pin 95 | NC — Not connected (per datasheet) |
| Pin 96 | NC — Not connected (per datasheet) |
| Pin 97 | NC — Not connected (per datasheet) |
| Pin 98 | NC — Not connected (per datasheet) |
| Pin 99 | NC — Not connected (per datasheet) |
| Pin 100 | EP — Exposed thermal pad - solder to PCB ground for thermal dissipation |
Typical Applications
MAX1217ECQ+TD is suitable for 6 applications: Broadband Cable Downstream Receiver, Wireless Base-Station IF Sampling, Instrumentation Digitizer Front End, Medical Imaging Front End, Radar Signal Processing, Software Defined Radio (SDR).
Broadband Cable Downstream Receiver
The MAX1217ECQ+TD suits cable downstream IF digitization where dual 125 Msps channels digitize I/Q baseband in one IC. With 12-bit resolution and 70 dB SNR, it captures 256-QAM constellations cleanly while the on-chip buried-zener reference removes a noisy external reference. The 100-pin TQFP-EP package exposes pad to the PCB ground, dropping thermal impedance so both channels run at full rate without derating at 85 C industrial ambient.
Recommended
Wireless Base-Station IF Sampling
In a wireless base-station receiver, the MAX1217ECQ+TD samples the IF output of a mixer at 125 Msps on two channels (I and Q). The 250 MHz input bandwidth captures typical 70-140 MHz IF frequencies cleanly. The 1.8 V single supply simplifies power tree design, while the parallel CMOS outputs feed directly into an FPGA or DSP for demodulation. Dual channels in one IC reduce BOM and PCB area versus two separate ADCs.
Recommended
Instrumentation Digitizer Front End
Test and measurement digitizers benefit from the MAX1217ECQ+TD's 12-bit resolution and 125 Msps sample rate, capturing transient waveforms from oscilloscope front ends or spectrum analyzer IF sections. The internal reference simplifies board layout by eliminating a separate reference IC, while the 100-pin TQFP-EP package supports high-density channel expansion. SFDR > 80 dBc preserves harmonic content of high-purity signals during capture.
Recommended
Medical Imaging Front End
Ultrasound and other medical imaging front ends use the MAX1217ECQ+TD to digitize multiple receive channels at high sample rates. With two channels per IC, beamformer boards can scale channel count without doubling PCB area. The 70 dB SNR supports dynamic range requirements for diagnostic imaging, while the 1.8 V supply reduces thermal dissipation in patient-adjacent equipment. The exposed pad provides the thermal dissipation required for continuous dual-channel operation.
Recommended
Radar Signal Processing
Radar receiver digitizers use the MAX1217ECQ+TD to sample baseband I/Q outputs of IF stages at 125 Msps per channel, providing sufficient timing resolution for pulse-Doppler radar processing. The 250 MHz analog input bandwidth accommodates typical radar IFs of 60-160 MHz, and 12-bit resolution preserves target amplitude discrimination. The industrial temperature rating supports outdoor or vehicle-mounted radar installations without thermal derating.
Recommended
Software Defined Radio (SDR)
Software-defined radio platforms use the MAX1217ECQ+TD to digitize I and Q baseband streams in a single chip, feeding an FPGA or DSP for demodulation, filtering, and modulation. The 125 Msps per channel sample rate supports wideband reception up to ~50 MHz instantaneous bandwidth (Nyquist). Internal reference and low pin count simplify SDR peripheral card designs; exposed pad enables dense multi-board receiver arrays in array signal processing.
Recommended
Recommended Products Summary
Engineering reference data for MAX1217ECQ+TD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX1218ECQ+TD | MAX1216ECQ+TD | MAX1219ECQ+TD | MAX1209ETL+TG3U |
|---|---|---|---|---|---|
| Brand | Analog Devices (Maxim) | Analog Devices (Maxim) | Analog Devices (Maxim) | Analog Devices (Maxim) | Analog Devices (Maxim) |
| Package | 100-TQFP-EP (14x14) | 100-TQFP-EP (14x14) - same | 100-TQFP-EP (14x14) - same | 100-TQFP-EP (14x14) - same | 100-TQFP-EP (14x14) - same |
| Resolution | 12 bits | 12 bits | 12 bits | 14 bits | 12 bits |
| Sample Rate | 125 Msps | 200 Msps | 100 Msps | 125 Msps | 80 Msps |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 1 (single) |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Input Bandwidth | 250 MHz | 400 MHz | 200 MHz | 250 MHz | 150 MHz |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Pin Count | 100 | 100 | 100 | 100 | 100 |
Key Differentiators
- Dual 125 Msps channels in one IC reduces BOM vs two separate ADCs (vs Single-channel 125 Msps competitor)
- Internal buried-zener reference eliminates external reference IC (vs MAX1209ETL+TG3U (lower-speed family variant))
- 12-bit 125 Msps balanced speed-resolution for broadband IF (vs MAX1219ECQ+TD (14-bit family variant))
Design Notes
Place input coupling capacitors within 5 mm of each analog input pin to minimize parasitic inductance that injects clock-rate noise into the input. Use a separate analog ground plane and digital ground plane, joining them only at the exposed pad to avoid ground bounce coupling into the analog front end. Place 0.1 uF ceramic decoupling caps adjacent to every AVDD pin and bulk tantalum caps on the PCB edge near the IC.
The MAX1217ECQ+TD operates from a single 1.8 V analog supply; for the cleanest dynamic performance, add an external LDO or low-noise regulator upstream of AVDD. Switching regulators are NOT recommended directly upstream because their switching ripple can couple through the buried-zener reference into the analog front end, degrading SNR. Provide separate AVDD and DVDD regulators if system digital noise is significant.
Estimated: at 1.8 V supply, dual-channel full-rate sampling dissipates approximately 0.5 W. The 100-TQFP-EP package with the exposed pad soldered to a 1 square inch copper pour on a 4-layer PCB has theta_JA of approximately 25 C/W, yielding a junction-to-ambient rise of 12.5 C. The exposed pad must be soldered to ground; if skipped, thermal resistance can exceed 50 C/W and risk overheating during continuous dual-channel operation.
Drive the sampling clock (CLK) with a low-jitter LVDS or LVPECL source; clock jitter directly degrades SNR at high input frequencies. Per the manufacturer, SNR degradation at 250 MHz input is approximately SNR_dB = 6.02 * ENOB + 1.76 - 20*log10(2*pi*f_in*t_jitter), so 1 ps rms jitter loses ~3 dB SNR at 250 MHz. Use a clock buffer with < 0.5 ps additive jitter for best dynamic performance.
Compliance Information
RoHS compliance indicated by '+' in '+TD' suffix per Maxim part-numbering convention. Industrial temperature grade only - not AEC-Q100 qualified for automotive. Conflict-free per Maxim/Analog Devices policy.
