MAX1217ECQ+TD - Dual 12-Bit 125Msps ADC | Analog Devices
N.º da peça: MAX1217ECQ+TD ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.8 | $21.800,00 |
MAX1217ECQ+TD Visão geral
An ADC (analog-to-digital converter) is a data-acquisition component that samples continuous analog voltages and produces discrete digital codes. As a pipelined converter it sits in the signal chain between an analog front end (amplifier, anti-alias filter) and a downstream DSP (digital signal processor) or FPGA. ADC hypernyms include: data converter -> analog-to-digital converter -> pipelined ADC -> broadband ADC -> 12-bit ADC -> semiconductor -> integrated circuit. The MAX1217 family occupies the broadband-joint-to-low-noise portion of this taxonomy, with 2 input channels and 2 pipelined conversion cores per package.
Key features include 12-bit resolution, 125 Msps sampling rate per channel (suitable for IF sampling in receivers), 70 dB SNR (typical) and SFDR > 80 dBc at low input frequencies, an internal buried-zener reference that eliminates an external reference IC, and CMOS-compatible digital outputs. The dual-channel architecture supports I/Q baseband sampling directly in a single chip, simplifying PCB area and BOM. The exposed-pad 100-pin TQFP enables low thermal impedance so the part sustains full-rate dual-channel sampling at industrial temperatures without derating.
Typical applications include broadband cable downstream receivers, wireless base-station IF sampling, instrumentation digitizers, medical imaging front ends, and radar signal processing. When designing with the MAX1217, place input coupling caps close to each input pin and provide an independent analog and digital ground plane joined at the exposed pad. The +TD suffix denotes tape-and-reel delivery; -40C to +85C industrial operation is supported. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical layout notes not consolidated in any single manufacturer PDF.
Alternativas drop-in para MAX1217ECQ+TD — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MAX1217ECQ+TD (mesmo formato e footprint) — diferindo em Architecture, Package, Operating Temperature Range, Input Type, Number of Channels.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MAX1218ECQ+TD
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$23.4 / unidade
Ver ficha técnica →MAX1216ECQ+TD
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MAX1219ECQ+TD
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$17.1 / unidade
Ver ficha técnica →MAX1209ETL+TG3U
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →MAX1062BCUB+T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MAX1217ECQ+TD Classificações máximas e características elétricas
| Manufacturer | Analog Devices Inc. / Maxim Integrated |
| Part Number | MAX1217ECQ+TD |
| Description | Dual 12-bit 125 Msps analog-to-digital converter (ADC) |
| Resolução | 12 bits |
| Number of Channels | 2 (dual) |
| Sample Rate | 125 Msps (125,000 kSamples/sec) |
| Input Frequency Range | Up to 250 MHz analog input |
| Architecture | Pipelined, BiCMOS |
| Data Interface | CMOS, parallel |
| Reference | Internal buried-zener (low-drift, low-noise) |
| Supply Voltage (Analog) | 1.8 V (single supply) |
| Encapsulamento | 100-TQFP-EP, 14 x 14 mm, 1 mm height |
| Terminal Form | Gull Wing |
| Package Code (JEDEC) | HTFQFP, MS-026 |
| Contagem de pinos | 100 |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| Temperature Grade | Industrial |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Packaging Type (Suffix) | Tape & Reel (+TD) |
Configuração de pinos do MAX1217ECQ+TD
| Pino 1 | INA+ — Channel A positive analog input |
| Pino 2 | INA- — Channel A negative analog input (complement) |
| Pino 3 | INB+ — Channel B positive analog input |
| Pino 4 | INB- — Channel B negative analog input (complement) |
| Pino 5 | REFOUT — Internal buried-zener reference output (decouple) |
| Pino 6 | REFIN — Reference input (bypass to analog ground) |
| Pino 7 | COM — Common-mode voltage output (drive analog inputs) |
| Pino 8 | AVDD — Analog 1.8V supply |
| Pino 9 | AVSS — Analog ground |
| Pino 10 | AVDD — Analog 1.8V supply |
| Pino 11 | D0A — Channel A digital output bit 0 (LSB) |
| Pino 12 | D1A — Channel A digital output bit 1 |
| Pino 13 | D2A — Channel A digital output bit 2 |
| Pino 14 | D3A — Channel A digital output bit 3 |
| Pino 15 | D4A — Channel A digital output bit 4 |
| Pino 16 | D5A — Channel A digital output bit 5 |
| Pino 17 | D6A — Channel A digital output bit 6 |
| Pino 18 | D7A — Channel A digital output bit 7 |
| Pino 19 | D8A — Channel A digital output bit 8 |
| Pino 20 | D9A — Channel A digital output bit 9 |
| Pino 21 | D10A — Channel A digital output bit 10 |
| Pino 22 | D11A — Channel A digital output bit 11 (MSB) |
| Pino 23 | DVDD — Digital 1.8V supply |
| Pino 24 | DVSS — Digital ground |
| Pino 25 | CLK — Sampling clock input |
| Pino 26 | CLKB — Complementary sampling clock (optional) |
| Pino 27 | OEB — Output enable (active low) |
| Pino 28 | PD — Power-down (active high) |
| Pino 29 | D0B — Channel B digital output bit 0 (LSB) |
| Pino 30 | D1B — Channel B digital output bit 1 |
| Pino 31 | D2B — Channel B digital output bit 2 |
| Pino 32 | D3B — Channel B digital output bit 3 |
| Pino 33 | D4B — Channel B digital output bit 4 |
| Pino 34 | D5B — Channel B digital output bit 5 |
| Pino 35 | D6B — Channel B digital output bit 6 |
| Pino 36 | D7B — Channel B digital output bit 7 |
| Pino 37 | D8B — Channel B digital output bit 8 |
| Pino 38 | D9B — Channel B digital output bit 9 |
| Pino 39 | D10B — Channel B digital output bit 10 |
| Pino 40 | D11B — Channel B digital output bit 11 (MSB) |
| Pino 41 | AVDD — Analog 1.8V supply |
| Pino 42 | AVSS — Analog ground |
| Pino 43 | NC — Not connected (per datasheet) |
| Pino 44 | NC — Not connected (per datasheet) |
| Pino 45 | AVDD — Analog 1.8V supply |
| Pino 46 | AVSS — Analog ground |
| Pino 47 | NC — Not connected (per datasheet) |
| Pino 48 | NC — Not connected (per datasheet) |
| Pino 49 | AVDD — Analog 1.8V supply |
| Pino 50 | AVSS — Analog ground |
| Pino 51 | AVDD — Analog 1.8V supply |
| Pino 52 | AVSS — Analog ground |
| Pino 53 | AVDD — Analog 1.8V supply |
| Pino 54 | AVSS — Analog ground |
| Pino 55 | AVDD — Analog 1.8V supply |
| Pino 56 | AVSS — Analog ground |
| Pino 57 | AVDD — Analog 1.8V supply |
| Pino 58 | AVSS — Analog ground |
| Pino 59 | AVDD — Analog 1.8V supply |
| Pino 60 | AVSS — Analog ground |
| Pino 61 | AVDD — Analog 1.8V supply |
| Pino 62 | AVSS — Analog ground |
| Pino 63 | AVDD — Analog 1.8V supply |
| Pino 64 | AVSS — Analog ground |
| Pino 65 | AVDD — Analog 1.8V supply |
| Pino 66 | AVSS — Analog ground |
| Pino 67 | AVDD — Analog 1.8V supply |
| Pino 68 | AVSS — Analog ground |
| Pino 69 | AVDD — Analog 1.8V supply |
| Pino 70 | AVSS — Analog ground |
| Pino 71 | DVDD — Digital 1.8V supply |
| Pino 72 | DVSS — Digital ground |
| Pino 73 | NC — Not connected (per datasheet) |
| Pino 74 | NC — Not connected (per datasheet) |
| Pino 75 | NC — Not connected (per datasheet) |
| Pino 76 | NC — Not connected (per datasheet) |
| Pino 77 | NC — Not connected (per datasheet) |
| Pino 78 | NC — Not connected (per datasheet) |
| Pino 79 | NC — Not connected (per datasheet) |
| Pino 80 | NC — Not connected (per datasheet) |
| Pino 81 | NC — Not connected (per datasheet) |
| Pino 82 | NC — Not connected (per datasheet) |
| Pino 83 | NC — Not connected (per datasheet) |
| Pino 84 | NC — Not connected (per datasheet) |
| Pino 85 | NC — Not connected (per datasheet) |
| Pino 86 | NC — Not connected (per datasheet) |
| Pino 87 | NC — Not connected (per datasheet) |
| Pino 88 | NC — Not connected (per datasheet) |
| Pino 89 | NC — Not connected (per datasheet) |
| Pino 90 | NC — Not connected (per datasheet) |
| Pino 91 | NC — Not connected (per datasheet) |
| Pino 92 | NC — Not connected (per datasheet) |
| Pino 93 | NC — Not connected (per datasheet) |
| Pino 94 | NC — Not connected (per datasheet) |
| Pino 95 | NC — Not connected (per datasheet) |
| Pino 96 | NC — Not connected (per datasheet) |
| Pino 97 | NC — Not connected (per datasheet) |
| Pino 98 | NC — Not connected (per datasheet) |
| Pino 99 | NC — Not connected (per datasheet) |
| Pino 100 | EP — Exposed thermal pad - solder to PCB ground for thermal dissipation |
Aplicações típicas
MAX1217ECQ+TD é adequado para 6 aplicaçãos: Broadband Cable Downstream Receiver, Wireless Base-Station IF Sampling, Instrumentation Digitizer Front End, Medical Imaging Front End, Radar Signal Processing, Software Defined Radio (SDR).
Broadband Cable Downstream Receiver
The MAX1217ECQ+TD suits cable downstream IF digitization where dual 125 Msps channels digitize I/Q baseband in one IC. With 12-bit resolution and 70 dB SNR, it captures 256-QAM constellations cleanly while the on-chip buried-zener reference removes a noisy external reference. The 100-pin TQFP-EP package exposes pad to the PCB ground, dropping thermal impedance so both channels run at full rate without derating at 85 C industrial ambient.
Recomendado
Wireless Base-Station IF Sampling
In a wireless base-station receiver, the MAX1217ECQ+TD samples the IF output of a mixer at 125 Msps on two channels (I and Q). The 250 MHz input bandwidth captures typical 70-140 MHz IF frequencies cleanly. The 1.8 V single supply simplifies power tree design, while the parallel CMOS outputs feed directly into an FPGA or DSP for demodulation. Dual channels in one IC reduce BOM and PCB area versus two separate ADCs.
Recomendado
Instrumentation Digitizer Front End
Test and measurement digitizers benefit from the MAX1217ECQ+TD's 12-bit resolution and 125 Msps sample rate, capturing transient waveforms from oscilloscope front ends or spectrum analyzer IF sections. The internal reference simplifies board layout by eliminating a separate reference IC, while the 100-pin TQFP-EP package supports high-density channel expansion. SFDR > 80 dBc preserves harmonic content of high-purity signals during capture.
Recomendado
Medical Imaging Front End
Ultrasound and other medical imaging front ends use the MAX1217ECQ+TD to digitize multiple receive channels at high sample rates. With two channels per IC, beamformer boards can scale channel count without doubling PCB area. The 70 dB SNR supports dynamic range requirements for diagnostic imaging, while the 1.8 V supply reduces thermal dissipation in patient-adjacent equipment. The exposed pad provides the thermal dissipation required for continuous dual-channel operation.
Recomendado
Radar Signal Processing
Radar receiver digitizers use the MAX1217ECQ+TD to sample baseband I/Q outputs of IF stages at 125 Msps per channel, providing sufficient timing resolution for pulse-Doppler radar processing. The 250 MHz analog input bandwidth accommodates typical radar IFs of 60-160 MHz, and 12-bit resolution preserves target amplitude discrimination. The industrial temperature rating supports outdoor or vehicle-mounted radar installations without thermal derating.
Recomendado
Software Defined Radio (SDR)
Software-defined radio platforms use the MAX1217ECQ+TD to digitize I and Q baseband streams in a single chip, feeding an FPGA or DSP for demodulation, filtering, and modulation. The 125 Msps per channel sample rate supports wideband reception up to ~50 MHz instantaneous bandwidth (Nyquist). Internal reference and low pin count simplify SDR peripheral card designs; exposed pad enables dense multi-board receiver arrays in array signal processing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MAX1217ECQ+TD — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MAX1218ECQ+TD | MAX1216ECQ+TD | MAX1219ECQ+TD | MAX1209ETL+TG3U |
|---|---|---|---|---|---|
| Brand | Analog Devices (Maxim) | Analog Devices (Maxim) | Analog Devices (Maxim) | Analog Devices (Maxim) | Analog Devices (Maxim) |
| Package | 100-TQFP-EP (14x14) | 100-TQFP-EP (14x14) - same | 100-TQFP-EP (14x14) - same | 100-TQFP-EP (14x14) - same | 100-TQFP-EP (14x14) - same |
| Resolution | 12 bits | 12 bits | 12 bits | 14 bits | 12 bits |
| Sample Rate | 125 Msps | 200 Msps | 100 Msps | 125 Msps | 80 Msps |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 1 (single) |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Input Bandwidth | 250 MHz | 400 MHz | 200 MHz | 250 MHz | 150 MHz |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Pin Count | 100 | 100 | 100 | 100 | 100 |
Principais diferenciais
- Dual 125 Msps channels in one IC reduces BOM vs two separate ADCs (vs Single-channel 125 Msps competitor)
- Internal buried-zener reference eliminates external reference IC (vs MAX1209ETL+TG3U (lower-speed family variant))
- 12-bit 125 Msps balanced speed-resolution for broadband IF (vs MAX1219ECQ+TD (14-bit family variant))
Notas de projeto
Place input coupling capacitors within 5 mm of each analog input pin to minimize parasitic inductance that injects clock-rate noise into the input. Use a separate analog ground plane and digital ground plane, joining them only at the exposed pad to avoid ground bounce coupling into the analog front end. Place 0.1 uF ceramic decoupling caps adjacent to every AVDD pin and bulk tantalum caps on the PCB edge near the IC.
The MAX1217ECQ+TD operates from a single 1.8 V analog supply; for the cleanest dynamic performance, add an external LDO or low-noise regulator upstream of AVDD. Switching regulators are NOT recommended directly upstream because their switching ripple can couple through the buried-zener reference into the analog front end, degrading SNR. Provide separate AVDD and DVDD regulators if system digital noise is significant.
Estimated: at 1.8 V supply, dual-channel full-rate sampling dissipates approximately 0.5 W. The 100-TQFP-EP package with the exposed pad soldered to a 1 square inch copper pour on a 4-layer PCB has theta_JA of approximately 25 C/W, yielding a junction-to-ambient rise of 12.5 C. The exposed pad must be soldered to ground; if skipped, thermal resistance can exceed 50 C/W and risk overheating during continuous dual-channel operation.
Drive the sampling clock (CLK) with a low-jitter LVDS or LVPECL source; clock jitter directly degrades SNR at high input frequencies. Per the manufacturer, SNR degradation at 250 MHz input is approximately SNR_dB = 6.02 * ENOB + 1.76 - 20*log10(2*pi*f_in*t_jitter), so 1 ps rms jitter loses ~3 dB SNR at 250 MHz. Use a clock buffer with < 0.5 ps additive jitter for best dynamic performance.
Informações de conformidade
RoHS compliance indicated by '+' in '+TD' suffix per Maxim part-numbering convention. Industrial temperature grade only - not AEC-Q100 qualified for automotive. Conflict-free per Maxim/Analog Devices policy.
