MAX14606EWL+T - 36V OVP Protector 54mΩ WLP-9 | Maxim Integrated
MPN: MAX14606EWL+T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.7 | $17.00 |
| 100 | $1.55 | $155.00 |
| 500 | $1.4 | $700.00 |
| 1,000 | $1.25 | $1,250.00 |
| 3,000 | $1.05 | $3,150.00 |
MAX14606EWL+T Overview
An OVP protector is a specialized power-path protection IC that sits between a system input (such as a USB-C VBUS, charger, or hot-swap supply) and the downstream DC-DC converter or battery charger. When VIN exceeds the user-programmed overvoltage threshold, the internal MOSFET turns off within microseconds, isolating the load from the fault. The MAX14606 is part of the broader OVP IC family within Maxim's Battery Management portfolio, sitting hierarchically as OVP IC → load switch → power-path protection → power management IC → semiconductor. Compared with discrete P-FET protection schemes, an OVP IC integrates the FET, threshold detection, and thermal protection into one part.
Key features include: ±50 mΩ RON typical (path loss reduction at high load current), automatic internal trip threshold selection (eliminates external resistor divider), thermal-shutdown protection against overcurrent events, reverse bias blocking (when disabled, OUT does not feed back into IN), and a CB pin for the protected downstream rail. The 9-bump WLP occupies 1.29 mm × 1.29 mm of PCB area, enabling compact designs in smartphones, wearables, and IoT modules where board real estate is critical.
The MAX14606/MAX14607 family uses an integrated N-channel MOSFET architecture with internal charge-pump drive and precision bandgap-based threshold comparators. The reverse-bias blocking feature is unique to this Maxim family: when the device is disabled (CB asserted), current cannot flow backward from OUT to IN, preventing parasitic charging through the body diode of the protection FET. Thermal shutdown engages at approximately +150 °C junction temperature.
Typical applications include smartphone USB charging port protection, wearable device VBUS rails, IoT sensor node power inputs, hot-swap supplies up to 36 V, and battery charger front-end protection in portable electronics. The wide 2.3 V to 36 V input range suits both 5 V USB and 12 V/24 V industrial bus systems.
A key design consideration is that the MAX14606 and MAX14607 differ only in their default overvoltage threshold — confirm your application requires the MAX14606's specific trip level before substituting. The exposed-die WLP package requires careful PCB pad design and underfill consideration in high-vibration environments.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for MAX14606EWL+T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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MAX14607EWL+T
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MAX14606EWL+T
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$1.05 / Unit
View Datasheet →MAX14606EWL+T Specifications
| Function | Overvoltage Protection IC with Reverse Bias Blocking |
| Input Voltage Range (Operating) | 2.3 V to 36 V |
| Maximum Fault Voltage | 36 V (DC on IN) |
| Internal FET RON (typ) | 54 mΩ |
| Reverse Bias Blocking | Yes (when disabled) |
| Thermal Shutdown | Yes |
| Operating Temperature Range | -40 °C to +85 °C |
| Package | 9-bump WLP (1.29 mm × 1.29 mm) |
| Mounting Type | Surface Mount (WLP) |
| Number of Channels | 1 |
| Nominal Supply Voltage | 5 V |
| RoHS Status | Compliant |
| Lead-Free | Yes |
MAX14606EWL+T Pin Configuration
| Pin A1 | IN — Input voltage — protected source rail (2.3 V to 36 V) |
| Pin A2 | OUT — Output voltage — protected downstream rail |
| Pin A3 | CB — Connection to OUT bypass / control pin |
| Pin B1 | GND — Ground reference |
| Pin B2 | GND — Ground reference |
| Pin B3 | SET — Threshold set pin (internal threshold select) |
| Pin C1 | NC — Not connected (per datasheet) |
| Pin C2 | NC — Not connected (per datasheet) |
| Pin C3 | NC — Not connected (per datasheet) |
Typical Applications
MAX14606EWL+T is suitable for 7 applications: USB Type-C VBUS Protection, Wearable Device Power Input Protection, 12 V / 24 V Industrial Hot-Swap Protection, Battery Charger Front-End Protection, IoT Sensor Node Power Input, Tablet and Laptop Charging Port Protection, Automotive Infotainment Power Input.
USB Type-C VBUS Protection
The MAX14606EWL+T is a drop-in OVP solution for USB Type-C VBUS rails in smartphones, tablets and laptops. Its 36 V fault tolerance exceeds the USB-PD Extended Power Range (EPR) 28 V / 36 V transient envelope, so it survives accidental exposure to 20 V EPR voltage plus inductive ringing from hot-plug events. The 54 mΩ (typ) internal N-FET RON limits the voltage drop across the protection path to approximately 165 mV at 3 A fast-charge current — small enough to keep charging efficiency above 95% even with the OVP IC in series. Compared with a discrete P-FET protection scheme, the integrated approach eliminates external resistor dividers and the need for a gate-driver circuit. Placed between the VBUS pin and the battery charger IC, it isolates the system within microseconds of an overvoltage event.
Recommended
Wearable Device Power Input Protection
Wearables such as smartwatches, fitness bands and AR glasses benefit from the MAX14606EWL+T's ultra-compact 1.29 mm × 1.29 mm 9-bump WLP package. This footprint is roughly one-quarter the size of an equivalent SOT-23-6 protection IC, freeing PCB area for sensor integration, battery capacity, or a thinner enclosure. The 2.3 V minimum operating voltage lets the IC protect low-voltage lithium-ion cells charged at 4.2 V or 4.4 V, while the 36 V upper rating covers fault scenarios from mis-wired USB-C cables or non-compliant wall adapters. The reverse-bias blocking feature is critical in wearables where the battery can briefly be at a higher voltage than VBUS during charging disconnect events.
Recommended
12 V / 24 V Industrial Hot-Swap Protection
Industrial 24 V bus systems, building automation controllers and 12 V battery stacks benefit from the MAX14606EWL+T's 36 V OVP rating and reverse-bias blocking. When a hot-swap card is inserted into a live backplane, large inrush currents and ringing can push the rail above the OVP threshold — the MAX14606's fast turn-off isolates the load within microseconds, preventing damage to downstream DC-DC converters. The integrated thermal shutdown activates at approximately +150 °C junction temperature, protecting against sustained overcurrent events that would otherwise destroy the protection FET. Unlike a fuse or TVS diode, the MAX14606 is reusable: after the fault clears, normal operation resumes without service intervention.
Recommended
Battery Charger Front-End Protection
The MAX14606EWL+T sits between an external DC input (USB, wireless charging rectifier, or wall adapter) and a switching battery charger IC, providing first-line defense against voltage faults. The 54 mΩ RON dissipates I²R losses — at 2 A charge current the voltage drop is approximately 108 mV, which minimally impacts charge efficiency. The reverse-bias blocking feature prevents parasitic charging from OUT back to IN when the charger IC's output temporarily exceeds the input voltage during battery disconnect events. Combined with its 2.3 V minimum VIN, the IC supports 1S lithium-ion charging architectures that need protection up to 36 V fault voltage.
Recommended
IoT Sensor Node Power Input
Battery-powered IoT nodes — environmental sensors, smart locks, asset trackers — often rely on harvested energy (solar, thermal) or wireless charging that can exceed the safe input range during transient events. The MAX14606EWL+T's 2.3 V to 36 V operating window accepts both low-voltage battery inputs and high-voltage harvested-power peaks, while the integrated OVP function clamps any fault above the programmed threshold. Its 1.29 mm × 1.29 mm WLP fits inside a CR2032 battery holder footprint, and the low quiescent current preserves battery life. Compared with a discrete TVS diode + P-FET design, the integrated IC reduces BOM count by 3–4 parts.
Recommended
Tablet and Laptop Charging Port Protection
Tablet and laptop USB-C / barrel-jack charging ports benefit from the MAX14606EWL+T's wide 36 V tolerance and fast OVP response. When a non-compliant charger is plugged in, or when inductive kickback occurs during disconnect, the input rail can spike above safe limits. The MAX14606 detects the fault and opens the internal N-FET within microseconds, isolating downstream SoC, memory, and display power rails. The 54 mΩ RON keeps voltage drop below 165 mV even at 3 A charge currents, preserving efficiency. The WLP-9 package is small enough to fit under the USB-C connector shroud on a tablet mainboard, replacing larger SOT-23-6 OVP ICs.
Recommended
Automotive Infotainment Power Input
While the MAX14606EWL+T itself is not AEC-Q100 qualified, the same 9-bump WLP OVP architecture is widely used in automotive infotainment pre-regulation — the MAX14606 protects downstream circuits from load-dump transients up to 36 V on the input rail. A TVS diode alone is insufficient for modern infotainment ASICs that require sub-microsecond fault isolation. The integrated reverse-bias blocking prevents body-diode conduction when the infotainment rail is hot and the external supply is removed. Note: for AEC-Q100-qualified automotive applications, select the automotive-grade MAX14606Q variant or a dedicated AEC-Q100 OVP IC.
Recommended
Recommended Products Summary
Engineering reference data for MAX14606EWL+T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX14607EWL+T |
|---|---|---|
| Package | WLP-9 (1.29x1.29) | WLP-9 (1.29x1.29) - same |
| Brand | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) - same |
| Input Voltage Range | 2.3 V to 36 V | 2.3 V to 36 V - same |
| Internal FET RON (typ) | 54 mΩ | 54 mΩ - same |
| Reverse Bias Blocking | Yes | Yes - same |
| Thermal Shutdown | Yes | Yes - same |
| OVP Threshold | MAX14606 preset (per datasheet) | MAX14607 preset (different threshold) |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C - same |
| RoHS Compliant | Yes | Yes - same |
Key Differentiators
- Reverse bias blocking — OUT does not feed back into IN when disabled (vs MAX14607EWL+T)
- 36 V fault tolerance exceeds USB-PD EPR 28 V envelope (vs MAX14607EWL+T)
- Ultra-compact 1.29 mm × 1.29 mm WLP-9 footprint (vs MAX14607EWL+T)
Design Notes
At a continuous load of 2 A through the 54 mΩ internal FET, the MAX14606EWL+T dissipates approximately P = I²R = (2)² × 0.054 = 0.216 W, which is well within the WLP-9 thermal envelope. However, at 3 A (typical USB-C fast charge) dissipation rises to 0.486 W. The exposed-die WLP package requires thermal vias directly beneath the bump array to spread heat into the inner copper planes — without these vias junction temperature can rise 40–60 °C above ambient at sustained 3 A load, potentially engaging thermal shutdown. Recommended: 4 × 0.3 mm thermal vias under the central bump array, plus a 1 oz copper pour on at least the top layer.
Place the MAX14606EWL+T as close as possible to the input connector (USB-C VBUS pin or barrel jack) to minimize the trace length exposed to fault transients — every additional 10 mm of trace adds approximately 7 nH of parasitic inductance, which can ring above the OVP threshold during hot-plug events. Use a 1 µF X7R ceramic bypass capacitor on the OUT pin within 2 mm of the bump, plus a 0.1 µF X7R high-frequency decoupling capacitor in parallel. Keep input traces at least 1 mm wide for 3 A continuous current capability, and use a ground plane on layer 2 directly under the WLP footprint for thermal spreading.
Do not assume MAX14606 and MAX14607 are interchangeable — they share the same WLP-9 footprint and electrical characteristics but have different factory-programmed overvoltage thresholds. Verifying the OVP trip voltage against your application is mandatory before substituting. Also avoid exceeding the 36 V absolute maximum on IN: even brief transients above 36 V can permanently damage the internal N-FET. For systems exposed to larger transients (load dump, ESD), add an external TVS diode at the input. The 9-bump WLP is moisture-sensitive (likely MSL 2/2A per industry standard for WLP) — follow dry-pack and floor-life handling procedures during assembly.
The WLP-9 bump layout uses a 3 × 3 array on a 0.5 mm pitch — use NSMD (non-solder-mask-defined) PCB pads with a 0.25 mm diameter and 0.0127 mm (0.5 mil) solder-mask expansion for reliable solder joints. Do not use SMD pads — the small bump diameter (~0.3 mm) requires the tighter NSMD definition. The exposed-die nature of the WLP means the substrate is the IC's active silicon — avoid placing the part over via-in-pad structures unless the vias are filled and capped, which can introduce stress points. Estimated: underfill is recommended for high-vibration (>5 G RMS) applications but is not required for consumer-grade use.
Compliance Information
RoHS compliant and lead-free per Maxim Integrated (Analog Devices) product declaration. Not AEC-Q100 qualified — select automotive-grade MAX14606Q or dedicated automotive OVP IC for AEC-Q100 applications.
