MC13892BJVKR2 - PMIC for i.MX51/37/35/27 with 4 Buck/12 LDO | NXP
MPN: MC13892BJVKR2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.05 | $170.50 |
| 100 | $15.6 | $1,560.00 |
| 500 | $14.2 | $7,100.00 |
| 1,000 | $12.95 | $12,950.00 |
MC13892BJVKR2 Overview
A PMIC (Power Management Integrated Circuit) is a specialized mixed-signal IC that consolidates multiple voltage regulators, battery charging circuitry, power sequencing logic, and supervisory functions into one device. In modern portable electronics, the PMIC sits between the battery or wall adapter and the application processor, replacing dozens of discrete regulators. PMICs reduce PCB area, quiescent current, and BOM cost while providing centralized control of power-up/power-down sequencing.
Key features include 4 synchronous buck DC-DC converters for core, memory, and I/O rails; 12 low-dropout (LDO) regulators for peripheral and analog supplies; integrated Li-Ion/Li-Polymer battery charger with thermal regulation; an LED driver for display backlight; an ADC for battery and system monitoring; and an SPI/I2C control interface for dynamic voltage scaling. The device operates from a single 2.7V-5.5V input and supports per-rail enable/disable plus hardware power sequencing matched to the i.MX processor rail requirements.
The MC13892BJVKR2 uses a programmable architecture with on-chip non-volatile configuration registers (trimmed at the factory for default i.MX5x/i.MX3x/i.MX27 rail voltages). The internal control block supports sleep, deep-sleep, and standby modes that drop quiescent current to microamp levels, extending battery life between charges. RTC domain and coin-cell backup keep a few critical rails alive during system suspend.
Typical applications include smartphones, personal navigation devices, portable media players, e-readers, and industrial handhelds powered by NXP i.MX application processors. It is also used in ruggedized tablet computers and telematics control units where a single chip must manage battery charging, multiple processor rails, and a display backlight simultaneously.
When designing with this part, follow NXP reference designs for the i.MX family. The 139-pin BGA requires careful escape routing on 4-6 layer PCBs; the exposed die pad must be soldered to a continuous ground plane for thermal and electrical performance. SPI-based reconfiguration is required for any non-default voltage or sequencing variant.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet to help engineers source and qualify this PMIC.
Drop-in alternatives for MC13892BJVKR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC13892BJVKR2 (same form factor and footprint) — differing in Package, Mounting Type, LDO Regulators, Packaging, Product Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC13892CJVKR2
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.4 / Unit
View Datasheet →MC13892BJVK
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.45 / Unit
View Datasheet →PF0100BSUC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC13892BJVKR2 Specifications
| Product Type | Power Management IC (PMIC) |
| Target Application Processors | i.MX51, i.MX37, i.MX35, i.MX27 |
| Buck DC-DC Converters | 4 synchronous |
| LDO Regulators | 12 |
| Battery Charger Support | Li-Ion / Li-Polymer |
| Display LED Drivers | Yes (integrated backlight driver) |
| Input Voltage Range | 2.7 V to 5.5 V |
| Control Interface | SPI / I2C |
| Package | 139-TFBGA (7x7 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Range | -40C to +85C (industrial) |
| Temperature Grade | Industrial |
| Number of Pins | 139 |
| RoHS Status | Compliant |
| Manufacturer | Freescale Semiconductor (acquired by NXP) |
MC13892BJVKR2 139-tfbga (7x7 mm) Pin Configuration Guide
Pin configuration for MC13892BJVKR2 (139-tfbga (7x7 mm) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for MC13892BJVKR2.
Refer to the datasheet for full pin configuration.
Typical Applications
MC13892BJVKR2 is suitable for 6 applications: Personal Media Player (PMP) Power Supply, Portable Navigation Device (PND) Power System, Industrial Handheld Terminal PMIC Block, E-Reader Battery Management, Tablet Display and Backlight Power, Telematics Control Unit (TCU).
Personal Media Player (PMP) Power Supply
The MC13892BJVKR2 is the reference NXP PMIC for the original i.MX37-based personal media players. Its 4 synchronous buck converters supply the i.MX37 core (typ. 1.0-1.2V), memory (1.8V), and I/O rails, while the 12 LDOs fan out to audio DAC, headphone driver, LCD panel logic, and touch controller analog supplies. The integrated Li-Ion charger accepts a USB or wall input in the 2.7V-5.5V range, and the SPI/I2C control interface lets the host processor scale voltage on the fly to save power during video playback. At USB suspend, the PMIC drops quiescent current to low microamps, extending idle battery life.
Recommended
Portable Navigation Device (PND) Power System
For i.MX51-based portable navigation devices, the MC13892BJVKR2 outputs the rails required by the i.MX51 core (1.2V), 1.8V DDR, 2.8V GPS LNA and 3.3V LCD panel logic from a single Li-Ion cell. Four buck converters handle the high-current SoC and memory rails, while the integrated LED display driver directly drives the backlight strings of a 3.5-4.3 inch LCD display, eliminating an external driver IC. Its 2.7-5.5V input window supports both battery and 5V car-charger inputs typical in PNDs. Hardware sequence and reset signaling match the i.MX51 power-on requirements.
Recommended
Industrial Handheld Terminal PMIC Block
In industrial handhelds for warehousing and logistics, the MC13892BJVKR2 provides the rugged power backbone: 4 buck converters for application SoC, Wi-Fi/Bluetooth module, and memory; 12 LDOs for barcode imager, keypad scanner, and LED indicators. Its -40C to +85C industrial operating range is suitable for cold-storage and outdoor use. The charger supports hot-swap and dual-source input (wall + battery), critical for shift operations. Integrated sequencing matches the boot profile of i.MX35 industrial SoCs used in ruggedized tablet and PDA form factors.
Recommended
E-Reader Battery Management
E-readers built around the i.MX27 or i.MX35 processor pair the MC13892BJVKR2 with a large Li-Ion cell to deliver week-long battery life. The PMIC's deep-sleep mode drops quiescent current to microamps while keeping RTC and memory retention rails alive, which is essential for the standby profile of an e-reader. Buck converters handle the high-current SoC burst during page refresh, and the LDOs bias the E-ink display drivers and front-light LED string. The integrated charger accepts a 5V USB input and runs through CC/CV with thermal regulation, ideal for casual overnight charging.
Recommended
Tablet Display and Backlight Power
Tablets using the i.MX51 family rely on the MC13892BJVKR2 to manage a multi-zone LED backlight array. The PMIC's integrated LED driver handles up to several strings of white LEDs directly, with PWM-controlled brightness adjustment through the SPI/I2C interface. The 4 buck regulators feed the SoC, DDR, and 3.3V panel logic, while 12 LDOs supply the touchscreen digitizer, audio codec, and accelerometer rails. Designers can save 2-3 ICs compared with a discrete backlight solution, and the PMIC's sequencing ensures the panel reset precedes the backlight ramp per i.MX51 reference designs.
Recommended
Telematics Control Unit (TCU)
In automotive telematics and fleet telematics control units based on the i.MX5 family, the MC13892BJVKR2 accepts a wide 2.7-5.5V supply from a vehicle-grade 12V-to-5V regulator downstream. The industrial-grade temperature range (-40C to +85C) covers in-cabin environments. The PMIC provides the GSM/LTE modem and GNSS receiver rails, plus battery backup for a supercap-backed RTC during ignition-off. Its power-sequencing logic aligns with the i.MX5x boot ROM requirements, simplifying vehicle software bring-up. The IC is not AEC-Q100 qualified and is intended for non-safety-critical TCU subsystems.
Recommended
Recommended Products Summary
Engineering reference data for MC13892BJVKR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC13892CJVKR2 | MC13892BJVK | PF0100BSUC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 139-TFBGA (7x7 mm) | 139-TFBGA (7x7 mm) | 139-TFBGA (7x7 mm) | 139-TFBGA (7x7 mm) |
| Target SoC Family | i.MX51 / i.MX37 / i.MX35 / i.MX27 | i.MX51 / i.MX37 / i.MX35 / i.MX27 | i.MX51 / i.MX37 / i.MX35 / i.MX27 | i.MX6 family |
| Buck Converters | 4 | 4 | 4 | 4 |
| Input Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Li-Ion Charger | Integrated | Integrated | Integrated | Integrated |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Single-chip PMIC for i.MX5/i.MX3/i.MX2 reference designs (vs PF0100BSUC)
- Integrated Li-Ion charger + LED display driver (vs MC13892BJVK)
- Most current silicon revision available in NXP PMIC family (vs MC13892CJVKR2)
Design Notes
The 139-TFBGA package dissipates power primarily through the exposed die paddle on the underside. Solder this paddle to a continuous ground plane that extends across at least 1 square inch of copper area. With 2 W total dissipation worst-case (charger plus buck/load), the junction temperature rise is typically 25-35 C above ambient on a 4-layer PCB. For higher ambient environments (>70 C), add thermal vias on a 1 mm pitch array under the paddle.
Use 0.5 mm-pitch escape routing for the 139-ball BGA. Route high-current buck switch-node traces (SWx) on top layer with a 0.2 mm gap to the SW return, and place input/output ceramic capacitors (1 uF X7R) within 2 mm of each BGA ball. Place bulk tantalum or polymer caps (47-100 uF) on the VBAT and PVIN pads. Follow NXP reference design PCB stackup; deviation often causes excessive ripple on the 1.2 V core rail.
Do not apply a supply voltage to the IC before the SPI/I2C interface is fully initialized - a premature enable can latch the device in an undefined state requiring a power cycle. Sequence the i.MX processor before applying backlight (LEDOUT) to avoid inrush on the cold LCD. Note that the 'C' silicon revision is required if your firmware uses errata fixes shipped only on the C-revision; verify i.MX driver compatibility before substituting revisions.
Compliance Information
Per distributor listings and the manufacturer datasheet. Not AEC-Q100 qualified; not intended for automotive safety-critical applications.
