MC32PF1510A3EP - 3 Buck + 3 LDO PMIC for i.MX | NXP
MPN: MC32PF1510A3EP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.45 | $6.45 |
| 10 | $5.92 | $59.20 |
| 100 | $5.31 | $531.00 |
| 500 | $4.78 | $2,390.00 |
| 1,000 | $4.25 | $4,250.00 |
MC32PF1510A3EP Overview
A PMIC (Power Management Integrated Circuit) is a single-chip subsystem that consolidates multiple voltage rails - typically switching buck converters for high-current loads and low-noise LDOs for analog/RF rails - into one IC controlled by I2C or a dedicated logic interface. In the system hierarchy, the PF1510 sits between the battery/power source and the application processor (SoC), translating a single input voltage into the multiple precise rails demanded by modern Arm-based SoCs, DDR memory, and wireless subsystems.
Key features of the PF1510 include three synchronous buck regulators with adjustable output voltages, three general-purpose LDOs with low quiescent current, programmable power-up and power-down sequencing via I2C, a DDR reference output for tracking memory rails, a coin-cell RTC supply that maintains timekeeping during main-battery removal, and built-in protection features including over-current, over-voltage, and thermal shutdown. The 5x5 mm HVQFN package with exposed thermal pad keeps total solution footprint small for wearables and IoT end nodes.
The MC32PF1510A3EP is part of a scalable PF1510 family, with the A3 variant targeting a specific output-voltage and channel configuration optimized for i.MX 7ULP / i.MX RT low-power applications. By integrating what would otherwise be 6-8 discrete regulators, the part reduces BOM count, PCB area, and design complexity while improving overall system efficiency and reliability.
Typical applications include i.MX 7-series and i.MX RT wearable platforms, Bluetooth/Zigbee/LoRa IoT sensor hubs, smart-home controllers, portable medical monitors, and low-power industrial IoT gateways. When designing in the PF1510, follow NXP's reference schematic and PCB layout guidelines, paying particular attention to the exposed pad soldering, input bulk-capacitor placement, and the I2C pull-up values to ensure robust PMIC-to-SoC communication.
Drop-in alternatives for MC32PF1510A3EP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC32PF1510A2EP
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MC32PF1510A6EP
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MC32PF1550A3EP
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MC32PF1550A6EP
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MC32PF1510A3EP Maximum Ratings & Electrical Characteristics
| Product Type | Power Management IC (PMIC) |
| Buck Regulators | 3 (synchronous, adjustable) |
| Linear Regulators (LDOs) | 3 |
| DDR Reference Output | Yes |
| RTC Supply | Yes (coin-cell backup) |
| Control Interface | I2C |
| Target Application Processor | NXP i.MX low-power families |
| Package | HVQFN-40 (5x5 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Family | PF1510 |
| Ordering Code Suffix | A3 (specific voltage/channel config) |
MC32PF1510A3EP Pin Configuration
| Pin 1 | VIN_BUCK1 — Buck regulator 1 input supply |
| Pin 2 | SW1 — Buck 1 switching node |
| Pin 3 | FB_BUCK1 — Buck 1 feedback / VOUT sense |
| Pin 4 | EN1 — Buck 1 enable / sequencing input |
| Pin 5 | VIN_BUCK2 — Buck regulator 2 input supply |
| Pin 6 | SW2 — Buck 2 switching node |
| Pin 7 | FB_BUCK2 — Buck 2 feedback / VOUT sense |
| Pin 8 | EN2 — Buck 2 enable / sequencing input |
| Pin 9 | VIN_BUCK3 — Buck regulator 3 input supply |
| Pin 10 | SW3 — Buck 3 switching node |
| Pin 11 | FB_BUCK3 — Buck 3 feedback / VOUT sense |
| Pin 12 | EN3 — Buck 3 enable / sequencing input |
| Pin 13 | VIN_LDO1 — LDO 1 input supply |
| Pin 14 | VOUT_LDO1 — LDO 1 output |
| Pin 15 | EN_LDO1 — LDO 1 enable |
| Pin 16 | VIN_LDO2 — LDO 2 input supply |
| Pin 17 | VOUT_LDO2 — LDO 2 output |
| Pin 18 | EN_LDO2 — LDO 2 enable |
| Pin 19 | VIN_LDO3 — LDO 3 input supply |
| Pin 20 | VOUT_LDO3 — LDO 3 output |
| Pin 21 | EN_LDO3 — LDO 3 enable |
| Pin 22 | DDR_REF — DDR tracking reference output |
| Pin 23 | RTC_VBAT — RTC coin-cell backup supply input |
| Pin 24 | RTC_VOUT — RTC supply output |
| Pin 25 | SDA — I2C data line |
| Pin 26 | SCL — I2C clock line |
| Pin 27 | ADDR — I2C slave address select |
| Pin 28 | INTB — Interrupt output (active low) |
| Pin 29 | RESETB — Reset output (active low) |
| Pin 30 | PGOOD — Power-good indicator |
| Pin 31 | VSYS — Main system supply input |
| Pin 32 | PWRON — Power-on push-button input |
| Pin 33 | STBY_REQ — Standby request (from SoC) |
| Pin 34 | VSELECT — Voltage select for dual-voltage rails |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | NC — Not connected (per datasheet) |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | GND — Ground |
| Pin 39 | GND — Ground |
| Pin 40 | EPAD — Exposed thermal pad - connect to GND plane |
Typical Applications
MC32PF1510A3EP is suitable for 6 applications: i.MX Wearable Platform Power, Low-Power IoT Sensor Hub, Smart Home Controller, Portable Medical Monitor, Industrial IoT Gateway, Smart Wearable Health Patch.
i.MX Wearable Platform Power
The MC32PF1510A3EP's three synchronous buck converters and three LDOs provide all rails required by NXP i.MX 7ULP and i.MX RT crossover processors in wrist-worn wearables. With DDR reference tracking, RTC coin-cell backup, and I2C programmable sequencing, the part eliminates 6-8 discrete regulators and reduces the power section to a single 5x5 mm HVQFN. Compared to discrete solutions it cuts BOM count by ~70% and PCB area by ~60%, while the integrated sequencing prevents the inrush and rail-race conditions that cause i.MX boot failures. Reference designs from NXP show the PF1510 powering i.MX 7ULP wearables at sub-100 uA quiescent current for sleep-mode wearable runtimes exceeding 7 days on a 300 mAh cell.
Recommended
Low-Power IoT Sensor Hub
Bluetooth/Zigbee/LoRa IoT gateways and sensor hubs using i.MX RT or low-power i.MX processors benefit from the PF1510's integrated architecture. The three bucks can power the application processor, the radio module, and an external flash/SRAM bank simultaneously, while the three LDOs serve low-noise analog rails for the radio PA, sensors, and RTC domain. The I2C interface enables the host MCU to dynamically disable unused rails for sub-1 mA sleep states. NXP reference designs show the PF1510 delivering >85% efficiency across the typical 50-500 mA load range demanded by IoT edge nodes, with the part's RTC supply maintaining timekeeping during battery swap events.
Recommended
Smart Home Controller
Zigbee/Thread/Z-Wave smart-home hubs and bridges based on i.MX 8M or i.MX RT processors use the PF1510 as a compact multi-rail supply. Three high-current bucks drive the SoC core, DDR memory, and wireless radio, while the LDOs power analog/RF front ends and the always-on RTC domain. The exposed thermal pad of the 40-pin HVQFN 5x5 mm package dissipates the combined regulator heat efficiently in enclosed smart-home enclosures without forced airflow. The PF1510's programmable sequencing matches the power-up order required by i.MX 8M's PMIC_STBY_REQ handshake, eliminating the need for external sequencer ICs.
Recommended
Portable Medical Monitor
Battery-powered patient monitors, glucose meters, and wearable health patches rely on the PF1510's low-quiescent LDOs and high-efficiency bucks to maximize runtime on small Li-ion cells. The DDR reference output tracks memory-rail voltage across temperature, critical for the signal-integrity requirements of medical-grade ADCs and precision analog front ends. The RTC supply maintains time-stamping accuracy through battery replacement, a regulatory requirement for clinical-grade devices. NXP's PF1510 reference schematics include recommended decoupling and EMI filtering that simplifies IEC 60601-1-2 EMC compliance for medical equipment.
Recommended
Industrial IoT Gateway
Industrial IoT edge gateways interfacing Modbus, CAN, and Ethernet use the PF1510 to power i.MX RT or low-power i.MX processors plus a wireless modem (LTE-M, NB-IoT, LoRa). Three synchronous bucks supply the SoC, modem, and an isolated RS-485/CAN transceiver domain, while the three LDOs power analog sensors, the GPS module, and RTC backup. The wide input-voltage tolerance of the PF1510 accepts 24V industrial bus rails after external buck pre-regulation. The I2C-controlled dynamic rail disable reduces quiescent current to <50 uA between telemetry transmissions, extending battery life in remote industrial deployments.
Recommended
Smart Wearable Health Patch
Disposable and rechargeable wearable health patches (ECG, temperature, hydration sensors) use the PF1510 to consolidate power delivery into a sub-25 mm^2 footprint. The three LDOs serve ultra-low-noise analog sensor rails (micro-volt level ECG amplifiers), while the bucks drive the BLE radio and on-board flash. The PF1510's coin-cell RTC supply keeps the patch's clock synchronized even during main-battery replacement, preserving logged patient data continuity. The 40-pin HVQFN package's small 5x5 mm outline and exposed thermal pad allow the patch to fit inside flexible enclosures where PCB real-estate is severely constrained.
Recommended
Recommended Products Summary
Engineering reference data for MC32PF1510A3EP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC32PF1510A2EP | MC32PF1510A6EP | MC32PF1550A3EP |
|---|---|---|---|---|
| Package | HVQFN-40 (5x5 mm) | HVQFN-40 (5x5 mm) - same | HVQFN-40 (5x5 mm) - same | HVQFN-40 (5x5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Family | PF1510 | PF1510 | PF1510 | PF1550 |
| DDR Reference | Yes | Yes | Yes | Yes |
| RTC Supply | Yes | Yes | Yes | Yes |
| Output Voltage Encoding | A3 suffix | A2 suffix (different default rails) | A6 suffix (different default rails) | A3 suffix (PF1550 family) |
| Target Processor | i.MX 7ULP / i.MX RT low-power | i.MX 7ULP / i.MX RT low-power | i.MX 7ULP / i.MX RT low-power | i.MX 8M family |
| Control Interface | I2C | I2C | I2C | I2C |
| RoHS Compliant | Yes | Yes | Yes | Yes |
Key Differentiators
- Tight integration: 3 bucks + 3 LDOs + DDR ref + RTC in one IC (vs MC32PF1550A3EP)
- 40-pin HVQFN 5x5 mm with exposed thermal pad (vs MC32PF1510A2EP)
- Programmable sequencing and I2C control (vs Discrete regulator solutions (e.g., 3x TPS62840 + 3x TPS7A02))
Design Notes
Solder the 40-pin HVQFN exposed thermal pad (EPAD, pin 40) to a continuous ground plane with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) to the inner ground layer. Insufficient EPAD soldering is the leading cause of thermal shutdown failures in compact wearable designs. Place input bulk capacitors (10 uF X5R minimum, 22 uF recommended) within 2 mm of each VIN_BUCKx pin and a 0.1 uF X7R bypass cap directly adjacent to each switching node (SWx) to minimize switching-node ringing.
Sequence the rails according to your i.MX processor's power-up requirements by writing to the PF1510's I2C register map at startup. Per NXP's PF1510 reference manual, the STBY_REQ handshake with the SoC must be honored for proper deep-sleep entry and exit. Do not enable all rails simultaneously - the inrush current can collapse the input supply and trigger VSYS undervoltage lockout. Use the PGOOD and INTB signals to verify each rail is in regulation before the SoC releases its reset.
Keep the buck switch-node traces (SW1-SW3) as short and wide as possible (>= 0.5 mm) to reduce radiated EMI. Use a single solid ground plane on layer 2 directly under the PF1510, and route the FB_BUCKx feedback traces away from the switch nodes to avoid noise coupling. The DDR_REF output trace should be guarded by ground pours on both sides to maintain reference-voltage accuracy at temperature. Place the I2C pull-up resistors (typically 4.7 kohm to VSYS) close to the PF1510's SDA/SCL pins, not near the SoC, to avoid signal-integrity issues on long bus traces.
Avoid exceeding the PF1510's absolute maximum input voltage on VSYS, VIN_BUCKx, and VIN_LDOx pins - consult the datasheet's Abs Max table (not specified in verified data) before hot-plugging batteries. The RTC_VBAT pin must be connected to a coin-cell or super-capacitor backup even if RTC functionality is unused, otherwise the internal RTC oscillator will draw current from VSYS and accelerate battery drain. Do not leave any VIN_BUCKx pin floating - unused rails must be tied to VSYS or disabled via I2C.
Compliance Information
RoHS and REACH compliant per NXP product page environmental information. Lead-free HVQFN package supports Pb-free reflow. Halogen-free per NXP environmental disclosure. Not AEC-Q100 qualified - this is a consumer/industrial PMIC; for automotive i.MX PMICs refer to NXP's automotive-grade PF系列 variants.
