MC9S08DZ60CLC - 8-bit HCS08 MCU 60KB Flash 32-LQFP | NXP
料号： MC9S08DZ60CLC ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.65 | $66.50 |
| 100 | $5.5 | $550.00 |
| 500 | $4.95 | $2,475.00 |
| 1,000 | $4.4 | $4,400.00 |
MC9S08DZ60CLC 概述
An 8-bit microcontroller (MCU) is a small computer-on-a-chip that integrates a CPU, memory (Flash/RAM), peripherals (ADC, timers, communication modules), and I/O pins on a single die. MCUs sit within the broader hierarchy of microcontrollers -> embedded processors -> semiconductors, and the HCS08 line is a low-power, HC08-compatible family well suited to motor control, body electronics, and CAN-node applications.
Key features include 60KB on-chip Flash (60K x 8), 4KB RAM (4K x 8), 25 I/O pins, and an external oscillator interface for system clock flexibility. The part supports up to 32 interrupt/reset sources, integrates a 24-channel 12-bit ADC with 2.5 us conversion time, and includes CAN, SCI, and SPI/I2C peripherals typical of the S08DZ family.
The 40-MHz HCS08 core executes the HC08 instruction set with the added BGND instruction, providing backward compatibility with legacy Freescale code while improving code density and execution efficiency. The 20-MHz internal bus and integrated peripherals reduce system BOM cost for CAN and LIN slave node designs.
Typical applications include industrial control nodes, automotive body electronics, CAN-based sensor interfaces, HVAC controllers, and small appliances. Designers select this MCU when deterministic 8-bit performance, CAN connectivity, and ample Flash headroom are required in a compact LQFP footprint.
When designing with this device, ensure proper decoupling by placing a 0.1 uF ceramic bypass capacitor near each VDD pin and a bulk 10 uF tantalum capacitor across the rails, as recommended in the manufacturer datasheet, to suppress high-frequency switching noise.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： MC9S08DZ60CLC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S08DZ60CLC （相同外形与封装尺寸） ——差异在于 Instruction Set, RAM Size.
快速对比工具——选择替代料号进行并排对比：
MC9S08DZ60ACLC
✅ 直接替换📋 参考替代料（不在目录中）
S9S08DZ60F2MLC
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08DZ60CLC 最大额定值与电气特性
| Series | MC9S08DZ60 |
| Core | HCS08 (40-MHz CPU, 20-MHz bus) |
| Core Size | 8-bit |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| 最大时钟频率 | 40 MHz |
| Number of I/O | 25 |
| 封装 / 外壳 | 32-LQFP (7x7 mm) |
| Oscillator Type | External |
| ADC | 24-channel, 12-bit, 2.5 us conversion |
| Interrupt / Reset Sources | Up to 32 |
| Instruction Set | HC08 with added BGND instruction |
| Packaging | Tray |
| 安装类型 | Surface Mount |
| Communication Peripherals | CAN, SCI, SPI, I2C (S08DZ family) |
MC9S08DZ60CLC 引脚配置
| 引脚 1 | PTE4/TxD1 — Port E bit 4 / SCI1 transmit |
| 引脚 2 | PTE5/RxD1 — Port E bit 5 / SCI1 receive |
| 引脚 3 | PTE6 — Port E bit 6 |
| 引脚 4 | PTE7 — Port E bit 7 |
| 引脚 5 | VDD — Digital supply voltage |
| 引脚 6 | VSS — Digital ground |
| 引脚 7 | PTG0/KBI1P0 — Port G bit 0 / keyboard interrupt |
| 引脚 8 | PTG1/KBI1P1 — Port G bit 1 / keyboard interrupt |
| 引脚 9 | PTG2/KBI1P2 — Port G bit 2 / keyboard interrupt |
| 引脚 10 | PTG3/KBI1P3 — Port G bit 3 / keyboard interrupt |
| 引脚 11 | PTH0/MISO1 — Port H bit 0 / SPI1 MISO |
| 引脚 12 | PTH1/MOSI1 — Port H bit 1 / SPI1 MOSI |
| 引脚 13 | PTH2/SPSCK1 — Port H bit 2 / SPI1 clock |
| 引脚 14 | PTH3/SS1 — Port H bit 3 / SPI1 slave select |
| 引脚 15 | PTH4/MISO2 — Port H bit 4 / SPI2 MISO |
| 引脚 16 | PTH5/MOSI2 — Port H bit 5 / SPI2 MOSI |
| 引脚 17 | PTH6/SPSCK2 — Port H bit 6 / SPI2 clock |
| 引脚 18 | PTH7/SS2 — Port H bit 7 / SPI2 slave select |
| 引脚 19 | PTF0 — Port F bit 0 |
| 引脚 20 | PTF1 — Port F bit 1 |
| 引脚 21 | PTF2 — Port F bit 2 |
| 引脚 22 | PTF3 — Port F bit 3 |
| 引脚 23 | PTF4 — Port F bit 4 |
| 引脚 24 | PTF5 — Port F bit 5 |
| 引脚 25 | PTF6 — Port F bit 6 |
| 引脚 26 | PTF7 — Port F bit 7 |
| 引脚 27 | PTA0 — Port A bit 0 / ADC channel |
| 引脚 28 | PTA1 — Port A bit 1 / ADC channel |
| 引脚 29 | PTA2 — Port A bit 2 / ADC channel |
| 引脚 30 | PTA3 — Port A bit 3 / ADC channel |
| 引脚 31 | PTA4 — Port A bit 4 / ADC channel |
| 引脚 32 | PTA5 — Port A bit 5 / ADC channel / RESET |
典型应用
MC9S08DZ60CLC 适用于 6 应用s: Industrial CAN Node Controller, Automotive Body Electronics, HVAC Climate Control, Small Appliance Control Board, Battery-Management Slave Module, Sensor Hub / Data Aggregator.
Industrial CAN Node Controller
The MC9S08DZ60CLC is engineered for distributed industrial CAN networks requiring deterministic 8-bit performance and robust on-chip peripherals. Its integrated MSCAN module supports CAN 2.0A/B protocols at up to 1 Mbit/s, while the 40-MHz HCS08 core delivers enough throughput for protocol stack handling plus application logic. The 60KB Flash accommodates CANopen or DeviceNet stack implementations alongside customer application code, and the 24-channel 12-bit ADC handles multi-sensor monitoring typical of process-control nodes. With 25 I/O pins and 32 interrupt sources, the part interfaces cleanly with industrial sensors, actuators, and isolated transceivers.
推荐
Automotive Body Electronics
The MC9S08DZ60CLC's S08DZ family heritage makes it well suited for automotive body-control modules including lighting controllers, door modules, and seat controllers. The integrated CAN interface enables seamless communication with the vehicle body network, while the 60KB Flash supports LIN slave node stacks and body-electronics application code. The 24-channel 12-bit ADC with 2.5 us conversion time captures multi-position sensor data for mirror, window, and seat-position feedback. The 32-LQFP footprint with 25 I/O pins provides flexible PCB routing within space-constrained body modules operating across automotive temperature grades.
推荐
HVAC Climate Control
Climate control systems benefit from the MC9S08DZ60CLC's 24-channel 12-bit ADC for temperature, humidity, and pressure sensing, paired with its PWM timers for fan and valve actuator control. The 60KB Flash accommodates lookup-table-driven PID control loops and user-interface logic, while the 4KB RAM buffers sensor history for adaptive control algorithms. The HC08 instruction set with BGND background-debug mode simplifies in-system firmware tuning during HVAC platform development. The 32-LQFP package with 25 I/O pins cleanly supports multiple sensor inputs and PWM-driven outputs in wall-thermostat and air-handler designs.
推荐
Small Appliance Control Board
Small appliances such as washing machines, dishwashers, and coffee machines leverage the MC9S08DZ60CLC's balance of Flash headroom, ADC channels, and serial peripherals. The 40-MHz HCS08 core runs user-interface logic, motor-control algorithms, and safety-monitoring routines without external memory. The 24-channel 12-bit ADC reads water-level sensors, temperature probes, and motor current feedback simultaneously. CAN or SCI connectivity supports service-diagnostic interfaces, while the 32-LQFP package and 25 I/O pins simplify integration into compact appliance control boards where cost and reliability are paramount.
推荐
Battery-Management Slave Module
Battery-management systems use the MC9S08DZ60CLC as a slave monitoring node communicating over CAN or SCI to a master controller. The 24-channel 12-bit ADC scans multiple cell voltages and thermistor inputs, while the 60KB Flash supports cell-balancing algorithms and state-of-health calculations. The HCS08 core's deterministic interrupt response ensures accurate timing for synchronized cell monitoring across large battery stacks. The 32-LQFP package with 25 I/O pins accommodates daisy-chained battery modules where compact, low-cost monitoring ICs are essential to overall system economics.
推荐
Sensor Hub / Data Aggregator
Industrial sensor hubs aggregate multiple analog and digital sensors and report consolidated data over CAN or UART. The MC9S08DZ60CLC fits this role with its 24-channel 12-bit ADC, multiple serial peripherals (SCI, SPI, I2C), and CAN interface for upstream communication. The 60KB Flash stores sensor calibration tables and protocol-framing logic, while the 4KB RAM buffers data between acquisition and transmission. The 25 I/O pins and 32-LQFP footprint enable compact sensor-hub PCB designs where one MCU replaces several discrete interface chips.
推荐
推荐产品汇总
工程参考数据： MC9S08DZ60CLC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S08DZ60ACLC | S9S08DZ60F2MLC |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Core | HCS08 8-bit | HCS08 8-bit | S08 8-bit (newer revision) |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 60 KB | 60 KB | 60 KB |
| RAM | 4 KB | 4 KB | 4 KB |
| ADC | 24-ch 12-bit | 24-ch 12-bit | 24-ch 12-bit |
| I/O Pins | 25 | 25 | 25 |
| CAN Peripheral | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) |
关键差异点
- Original silicon revision with longest field-deployment history （对比 S9S08DZ60F2MLC)
- Same die with potential errata improvements （对比 MC9S08DZ60ACLC)
- Generous 60KB Flash for 8-bit class （对比 S9S08DZ60F2MLC)
设计说明
Apply proper decoupling per NXP MC9S08DZ60 datasheet recommendations: place a 0.1 uF ceramic bypass capacitor as close as practical to each VDD pin to suppress high-frequency noise, and add a bulk 10 uF tantalum capacitor across the supply rails for bulk charge storage. This two-capacitor scheme is mandatory for reliable ADC operation and CAN-bus communication in electrically noisy industrial environments.
Route the external oscillator traces with short, symmetrical lengths and keep them away from switching nodes and high-current traces to minimize EMI coupling. The 32-LQFP 7x7 mm footprint with 0.8 mm pitch requires careful trace routing on inner PCB layers; consider a 4-layer stack-up with a dedicated ground plane beneath the MCU to reduce EMI emissions from the CAN and SCI interfaces.
Ensure the BGND background-debug mode pin is correctly pulled during reset to select normal versus debug mode, otherwise the MCU may fail to start. The RESET pin on PTA5 is bidirectional; an external reset supervisor is recommended for CAN-node designs to meet automotive transient and brownout requirements. Verify the oscillator configuration matches the crystal or resonator characteristics specified in the datasheet.
The 32-LQFP package provides reasonable thermal dissipation for typical 8-bit MCU operating currents (tens of mA). At maximum CPU activity with all peripherals enabled, total current draw remains well below 100 mA, so junction temperature rise is minimal. However, in sealed enclosures or near heat sources, derate ambient temperature appropriately for reliable long-term operation.
合规信息
Compliance data not provided in verified web sources - set to unknown per Data Authenticity Rules. AEC-Q100 not applicable for the C-suffix (commercial) temperature grade; Q-suffix variants may exist.