NXP Semiconductors

MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

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112-LQFP (20x20 mm) Package 25 MHz Speed 512 KB (512K x 8) Flash Memory
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Price updated: 2026-10-18
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10 $13.1 $131.00
100 $11.85 $1,185.00
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MC9S12DP512MPVE Overview

The NXP Semiconductors MC9S12DP512MPVE is a 16-bit HCS12 microcontroller operating at 25 MHz with 512 KB of Flash memory, 12 KB of RAM, and 4 KB of EEPROM, housed in a 112-pin LQFP (20x20 mm) package.

A 16-bit microcontroller is a complete computer-on-a-chip whose CPU processes data in 16-bit words, sitting above 8-bit MCUs in arithmetic throughput while remaining far simpler than 32-bit parts. The HCS12 (S12) family evolved from the Freescale 68HC12 lineage and remains a mainstay of automotive body electronics and industrial control, offering CISC efficiency, extensive peripheral integration, and an upward migration path from the 68HC08, 68HC11, and 68HC12 architectures.

Key features include the enhanced HCS12 CISC CPU at up to 25 MHz bus speed, 512 KB of 0.25 um on-chip Flash with 1024-byte sector erase, 91 general-purpose I/O lines, and two asynchronous serial communications interfaces (SCI). The peripheral set is rich for its class: an 8-channel enhanced capture timer (IC/OC), an 8-channel pulse-width modulator, an Inter-IC (IIC) bus, and a system of standardized on-chip modules with unified resource mapping, clock generation, and interrupt control.

Technically, the MC9S12D series combines standard on-chip peripherals around a 16-bit CPU12 core. Analog capability comprises two 8-channel 10-bit ADCs, providing up to 16 analog inputs for sensor acquisition. Flash-based program memory supports in-system reprogramming, and the pin-compatible S12 family scales from 32 KB to 512 KB of Flash, enabling scalable designs on a single PCB footprint.

Typical applications are automotive multiplexing systems, body control modules, instrument clusters, gateway nodes, and industrial control equipment where 16-bit processing, generous Flash, and mature tooling matter more than raw 32-bit performance.

Design consideration: budget oscillator selection and bus-clock divider settings carefully to hit the 25 MHz bus maximum while meeting the flash programming and ADC clock constraints; also account for the full 512 KB paged memory model in the linker configuration.

This page synthesizes distributor pricing context, drop-in alternatives within the S12 family, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for MC9S12DP512MPVE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12DP512MPVE (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Supply Voltage, Core.

NXP Semiconductors
Supply Voltage: 2.5V / 5V
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm, 0.5 mm pitch)
ADC: 2 x 10-bit, 8 channels each (16 total)
Supply Voltage: 2.35 V to 2.75 V (core) / 5 V I/O
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NXP Semiconductors
ADC: 8-channel, 10-bit
Core: HCS12 (16-bit CISC)
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm, 0.65 mm pitch)
ADC: 10-bit, 8 channels
Operating Temperature: -40 C to +85 C (automotive AEC-Q100)
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm), gull-wing
ADC: Two 8-channel, 10-bit
Operating Temperature: -40C to +125C (automotive AEC-Q100 grade)
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Compare with MC9S12DP512MPVE →
NXP Semiconductors
ADC: 2 x 8-channel, 10-bit
Operating Temperature: -40 C to +85 C (industrial)
Supply Voltage: 5.0 V (4.5 V to 5.5 V)
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Operating Temperature: -40C to +125C
Core: HCS12
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
ADC: 2x 8-channel, 10-bit
Operating Temperature: -40C to +85C (industrial, per 'P' suffix family)
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Operating Temperature: -40C to +105C
Compare with MC9S12DP512MPVE →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Supply Voltage: 5 V (internal regulator from 12 V battery)
Core: CPU12 (HCS12)
Compare with MC9S12DP512MPVE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12DP512CPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit) · 25 MHz · 512 KB (512K x 8) · 12 KB (12K x 8) · 4 KB · 91 · 112-LQFP (20 x 20 mm) · Surface Mount

✓ In Stock

$16.75 / Unit

View Datasheet →

MC9S12DT128MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ In Stock

$36.5 / Unit

View Datasheet →

MC9S12XDP512VAG

✅ Drop-In
📦 112-LQFP
S12X generation with XGATE co-processor vs classic HCS12; same 512 KB Flash and 112-pin package, register map differs

📋 Reference alternative (not in catalog)

MC9S12DT256CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (CPU12 CISC) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 12 KB · 4 KB · 16-bit · 2.35 V to 2.75 V (core), 5 V I/O tolerant typical

✓ In Stock

$20.85 / Unit

View Datasheet →

MC9S12A512CPVE

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 16-Bit · 25 MHz · 512KB (512K x 8) · 2.5V / 5V · 112-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ In Stock

$10.45 / Unit

View Datasheet →

MC9S12DP512MPVE Maximum Ratings & Electrical Characteristics

Core Processor HCS12 (CPU12), 16-bit CISC
Core Size 16-bit
Maximum Clock Frequency 25 MHz
Program Memory Size 512 KB (512K x 8) Flash
RAM Size 12 KB
EEPROM Size 4 KB
Number of I/O 91 general-purpose I/O
ADC Resolution 10-bit
Number of ADC Channels 16 (two 8-channel 10-bit ADCs)
Serial Interfaces 2x SCI (asynchronous serial), IIC, SPI
Timers 8-channel enhanced capture timer (IC/OC)
PWM Channels 8-channel pulse-width modulator
Package 112-LQFP (20x20 mm)
Mounting Type Surface Mount
Program Memory Type FLASH (0.25 um)
Lifecycle Status Active

MC9S12DP512MPVE 112-lqfp (20x20 mm) Pin Configuration Guide

Pin configuration for MC9S12DP512MPVE (112-lqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

112-lqfp (20x20 mm) package pinout diagram for MC9S12DP512MPVE

No detailed pinout data available for MC9S12DP512MPVE.

Refer to the datasheet for full pin configuration.

Typical Applications

MC9S12DP512MPVE is suitable for 6 applications: Automotive Body Control Modules, Automotive Gateway Nodes, Instrument Clusters, Industrial Motor Control, Data Acquisition Systems, Embedded Gateways and Legacy Maintenance.

🚗

Automotive Body Control Modules

The MC9S12DP512MPVE was designed explicitly for automotive multiplexing, and body control modules are its signature use case. Its 91 GPIO lines directly drive relays, lamp diagnostics, and switch matrices, while two 8-channel 10-bit ADCs (16 analog inputs) digitize voltage, current, and temperature sense lines without external front ends. The on-chip msCAN modules handle in-vehicle network traffic, and the 512 KB Flash stores generous diagnostic code and parameter tables. The extended automotive temperature option in the MPVE ordering suffix suits under-dash and engine-bay-adjacent environments. Place the MCU between the CAN transceivers and high-side driver array; the 8-channel PWM supports soft lamp dimming and blower control, reducing EME compared with hard switching.

🌐

Automotive Gateway Nodes

Gateway ECUs that bridge multiple CAN buses benefit from the DP512's combination of 512 KB Flash and rich serial connectivity. The two SCI ports plus msCAN modules and IIC bus let one MCU terminate several network segments, while the 25 MHz CPU12 core has adequate headroom for message filtering, ID translation, and diagnostic services (UDS-style routines) typical of gateway firmware. The 12 KB RAM buffers message queues during burst traffic, and 4 KB EEPROM holds calibration and learn values across power cycles. According to Motorola/NXP family documentation, the S12D architecture was built around standard on-chip peripherals with unified interrupt control, simplifying multi-protocol interrupt service. Designers should budget RAM carefully since 12 KB is modest for dense routing tables.

📺

Instrument Clusters

Analog-digital hybrid instrument clusters use the MC9S12DP512MPVE's two 10-bit ADCs to read fuel-level, temperature, and pressure senders (16 channels total), while the 8-channel PWM drives back-light dimming and stepper-motor-style pointer control through external drivers. The enhanced capture timer measures input pulse trains from speed sensors with microsecond resolution, and the 512 KB Flash accommodates localized text, gauge curves, and localization tables. The 91 GPIO lines handle tell-tale outputs and key-sense inputs directly. The device's mature automotive qualification heritage and long ecosystem support make it a low-risk choice for service-repair and legacy cluster production, where avoiding full redesign of stepper drive firmware outweighs migrating to 32-bit MCUs.

🏭

Industrial Motor Control

In industrial drives and actuators, the MC9S12DP512MPVE's 8-channel PWM module generates complementary or independent PWM outputs for three-phase and DC motor control, and the enhanced capture timer performs rotor-position capture from Hall or encoder signals. The dual 10-bit ADCs sample phase currents and bus voltage for closed-loop current control, achieving update rates consistent with the 25 MHz bus clock. The 512 KB Flash holds fieldbus stacks, motion profiles, and safety logic, while 4 KB EEPROM retains parameter sets. For noise-sensitive analog sampling, synchronize ADC conversion triggers to the PWM reload event to minimize switching-noise coupling, a technique described in the S12 ADC application literature from Freescale/NXP.

🔬

Data Acquisition Systems

Distributed industrial data-acquisition nodes exploit the DP512's 16 analog input channels (two 8-channel 10-bit ADCs) to monitor multi-sensor arrays, converting at rates supported by the 25 MHz core. The two SCI ports stream converted data to a host or radio module, while IIC connects external EEPROM, RTC, and precision ADC front ends when 10-bit resolution is insufficient. On-board 512 KB Flash buffers logged datasets in low-power or disconnected operation, and 4 KB EEPROM stores calibration coefficients per channel. The 91 GPIO lines handle channel multiplexing and handshake signals. A design tip: average multiple samples per channel in firmware to exceed the native 10-bit effective resolution at the cost of bandwidth.

🔧

Embedded Gateways and Legacy Maintenance

For service organizations maintaining fleets of HCS12-based equipment - agricultural controllers, marine ECUs, generator sets - the MC9S12DP512MPVE is the standard repair and re-manufacturing component. Its 0.25 um Flash supports in-system programming through the single-wire background debug mode (BDM), enabling firmware updates without desoldering. Because the pin-compatible S12D family scales Flash from 32 KB to 512 KB in the same 112-LQFP footprint, repair shops can consolidate inventory across product variants. The 25 MHz CISC core preserves cycle-exact behavior for timing-sensitive legacy code, avoiding the migration risk that a 32-bit redesign would introduce. XAIPART stocks the MPVE grade for extended-temperature service environments.

Recommended Products Summary

MC33902D CAN transceiver for in-vehicle network Used in: Automotive Body Control Modules, Automotive Gateway Nodes MC33880 Serial high-side switch driver Used in: Automotive Body Control Modules MC33810 Automotive power/spi companion IC Used in: Automotive Gateway Nodes MC33979 Gauge/stepper driver companion Used in: Instrument Clusters MC33596 RF receiver for TPMS-linked cluster Used in: Instrument Clusters MC33883 H-bridge gate driver pre-driver Used in: Industrial Motor Control MC34932 Motor driver for auxiliary actuators Used in: Industrial Motor Control MCP3208 External 12-bit ADC for higher resolution Used in: Data Acquisition Systems 24LC256 IIC EEPROM for extended logging Used in: Data Acquisition Systems MC9S12DT128MPVE NXP Semiconductors Used in: Embedded Gateways and Legacy Maintenance MC9S12XDT512MAA NXP Semiconductors Used in: Embedded Gateways and Legacy Maintenance
What is the MC9S12DP512MPVE microcontroller?
The MC9S12DP512MPVE is an NXP (Freescale) HCS12 16-bit microcontroller running at up to 25 MHz with 512 KB of Flash, 12 KB of RAM, and 4 KB of EEPROM, packaged in a 112-pin LQFP measuring 20x20 mm. According to NXP product data, it integrates two 10-bit ADCs, an 8-channel PWM, an enhanced capture timer, and 91 general-purpose I/O lines, targeting automotive multiplexing and industrial control applications.
How much Flash memory does the MC9S12DP512MPVE have?
The MC9S12DP512MPVE contains 512 KB (512K x 8) of on-chip Flash program memory, built on Freescale's 0.25 um Flash technology. Per the MC9S12DP512 fact sheet, the Flash features 1024-byte sector erase and 64-word row programming. The DP512 is the top of a pin-compatible family scaling from 32 KB to 512 KB, so designs can migrate memory density without PCB changes.
What is the difference between MC9S12DP512MPVE and MC9S12XDP512VAG?
The MC9S12XDP512VAG is the newer S12X-generation successor: it adds the XGATE co-processor for offloading interrupt handling, while both offer 512 KB Flash in 112-pin packages. The DP512MPVE is the classic HCS12 part without XGATE, meaning application code runs solely on the CPU12 core. Cross-reference comparisons (ETEI) list them as replacement candidates, but X-part code requires the S12X register map, so software changes are needed when migrating.
Can MC9S12DT128MPVE replace MC9S12DP512MPVE?
Yes, in hardware the MC9S12DT128MPVE is a drop-in alternate in the same 112-LQFP package with minor register-level differences, as confirmed in NXP community discussions about S12 migration. However, it provides only 128 KB of Flash versus 512 KB, so your application image and data must fit within 128 KB. It suits cost-driven redesigns or code-space-constrained firmware, not a blind swap for Flash-heavy applications.
What is the best drop-in replacement for MC9S12DP512MPVE?
The closest drop-in replacement is the MC9S12DP512CPV, the same die in the same 112-LQFP package with identical 512 KB Flash, 12 KB RAM, and 4 KB EEPROM; it differs mainly in temperature/speed ordering suffix, so verify your operating range and bus-speed grade before ordering. Within the same footprint, the MC9S12A512CPVE also offers 512 KB Flash but a reduced peripheral set, so confirm your ADC, PWM, and CAN requirements against its datasheet.
Where can I download the MC9S12DP512MPVE datasheet PDF?
The authoritative documentation is available from NXP: the MC9S12DP512MPVE product page at nxp.com/part/MC9S12DP512MPVE links the Device Guide and fact sheet (MC9S12DP512FS.pdf). Historic datasheet PDFs from Freescale Semiconductor and Motorola are also mirrored on aggregator sites such as alldatasheet.com and DigiKey's media library, but always prefer the NXP portal for the latest revision and errata.
Where can I find the MC9S12DP512MPVE pinout?
The complete pinout for the 112-pin LQFP package is given in the MC9S12DP512 Device Guide available from NXP.com under Signal Descriptions and Pinout chapters. The device provides 91 GPIO plus power, ground, oscillator, reset, BDM (background debug mode), and CAN/SCI/IIC function-multiplexed pins. For layout work, also consult the pin-multiplexing table, since peripheral functions like CAN0 and SCI1 map to specific port pins in this package option.
Is MC9S12DP512MPVE suitable for automotive applications?
Yes. According to Motorola/NXP documentation, the MC9S12DP512 family was explicitly designed for automotive multiplexing applications such as body control modules, gateways, and instrument clusters. The MPVE ordering suffix corresponds to the extended automotive temperature range option within the S12D family. For new automotive designs, NXP recommends evaluating S12X or MagniV successors, but the DP512 remains a proven, field-deployed choice for maintenance and legacy platforms.
What are the key specifications of MC9S12DP512MPVE that engineers should know?
Key specs: 16-bit HCS12 CISC CPU at 25 MHz maximum bus frequency; 512 KB Flash with 1024-byte sector erase; 12 KB RAM; 4 KB EEPROM; two 8-channel 10-bit ADCs (16 analog inputs); 8-channel PWM; 8-channel enhanced capture timer; two SCI ports, SPI, and IIC bus; 91 GPIO; 112-pin LQFP 20x20 mm surface-mount package. These figures come from the NXP product page and the MC9S12DP512 family documentation.
What is the price of MC9S12DP512MPVE?
Pricing for the MC9S12DP512MPVE varies by distributor and quantity; as of 2026-10-18, single-unit pricing from major distributors such as DigiKey and Mouser typically falls in the low-to-mid teens in USD, with meaningful volume discounts at 100+ pieces. Octopart lists 8 distributors carrying stock. Because mature S12 parts see frequent stock swings, request a current quote on this page for verified, dated pricing before committing to a BOM.
Where can I buy MC9S12DP512MPVE online?
You can buy the MC9S12DP512MPVE from XAIPART on this page, or compare stock across major distributors including DigiKey (part #1167805), Mouser, and the 8 distributors indexed by Octopart. NXP's official buy-options portal also routes to authorized channels. Because this is a mature automotive MCU, confirm date-code and packaging (tray) when ordering, and buy from authorized distributors to avoid remarked parts.
Is MC9S12DP512MPVE in stock, and what is the lead time?
Stock is generally available: DigiKey's listing advertises ships-today availability for the MC9S12DP512MPVE, and Octopart reports 8 distributing sources. Exact quantity on hand and lead times change daily, so verify at order time. For volume requirements beyond distributor stock, NXP or authorized channels may require factory lead time measured in weeks; plan buffer stock for this legacy-support part accordingly.
Is MC9S12DP512MPVE the same as MC9S12DP512CPV?
Functionally yes, package-wise yes - both are the S12D family DP512 with 512 KB Flash in a 112-pin LQFP. The suffixes encode ordering details: MPVE and CPV differ in temperature range and/or speed grade binning conventions (M and P/V letters), not in the core architecture or memory map. Per ETEI's side-by-side comparison, they are listed as replacement candidates; always confirm the exact temperature and frequency grade your application needs against the NXP ordering-info table.
When should I choose MC9S12DP512MPVE over S12X alternatives like MC9S12XEP768CAG?
Choose the MC9S12DP512MPVE when you need maximum software compatibility with existing HCS12 (S12D) code, proven automotive field history, and the specific DP512 peripheral mix (dual 10-bit ADCs, 8-channel PWM, enhanced capture timer) in a 112-LQFP. Choose an S12X part such as the MC9S12XEP768CAG when you need XGATE co-processing, more Flash, CAN-FD-era features, or faster bus speeds. The DP512 avoids S12X register-map migration cost; the S12X offers more headroom for future features.
Does the MC9S12DP512MPVE support CAN communication?
Yes. The MC9S12DP512 family integrates on-chip CAN (msCAN) modules alongside its two SCI ports, SPI, and IIC bus, which is precisely why the family was designed for automotive multiplexing applications where multiple CAN nodes exchange messages. The number of active CAN channels depends on the package pin availability; in the 112-LQFP MPVE option, consult the Device Guide pin-multiplexing tables to confirm which CAN instances are mapped to pins, and verify your transceiver selection (e.g., 5V-compatible physical layer) separately.

Engineering reference data for MC9S12DP512MPVE — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S12DP512MPVE when you need the maximum 512 KB Flash in the classic HCS12 architecture with the full S12D peripheral set (dual 10-bit ADCs, 8-channel PWM, enhanced capture timer, msCAN) for automotive body, gateway, cluster, or industrial control designs. Choose the MC9S12DP512CPV when only the ordering grade (temperature/speed binning) differs - functionally it is the same die. Choose the MC9S12DT128MPVE (128 KB) or MC9S12DT256CPVE (256 KB) when code fits in smaller memory and cost matters, on the identical footprint. Choose the MC9S12XDP512VAG for new designs needing XGATE co-processing and 40 MHz performance, accepting S12X software migration. All five alternatives share the 112-LQFP package, so PCB reuse across the family is straightforward; verify each grade's exact temperature range in the NXP ordering information before release.

Comparison with Alternatives

Parameter This Product MC9S12DP512CPV MC9S12DT128MPVE MC9S12XDP512VAG MC9S12DT256CPVE MC9S12A512CPVE
Package 112-LQFP (20x20 mm) 112-LQFP - same 112-LQFP - same 112-LQFP - same 112-LQFP - same 112-LQFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 (CPU12) 16-bit CISC HCS12 16-bit HCS12 16-bit S12X (CPU12X) + XGATE HCS12 16-bit HCS12 16-bit
Max Clock Frequency 25 MHz 25 MHz (grade-dependent) 25 MHz 40 MHz 25 MHz 25 MHz
Flash Memory 512 KB 512 KB 128 KB 512 KB 256 KB 512 KB
XGATE Co-processor No No No Yes No No

Key Differentiators

  • Maximum Flash density in the pin-compatible S12D family (vs MC9S12DT128MPVE)
  • Classic HCS12 software compatibility (vs MC9S12XDP512VAG)
  • Dual 10-bit ADCs plus 8-channel PWM plus enhanced capture timer (vs MC9S12A512CPVE)

Design Notes

The S12D family runs from a single 5 V supply (the V in MPVE denotes the 5V/extended-grade binning convention used by Freescale ordering codes); verify the exact VDD range in the Device Guide for your grade before routing power. Provide local 100 nF decoupling at every VDD/VSS pair of the 112-LQFP plus bulk 10 uF near the regulator. The MCU includes an internal voltage regulator for the PLL and Flash pump on some S12 variants - confirm whether your grade requires the external filter capacitor on the VDDPLL/VDDA pins, and never leave analog supplies unfiltered, or ADC noise floor degrades measurably.

The 112-LQFP 20x20 mm footprint needs careful crystal and CAN routing. Keep the crystal/oscillator loop (EXTAL/XTAL) short and guarded by ground, and place PLL loop filter components exactly per the Device Guide reference values. Route CAN lines as controlled-impedance differential pairs with a common-mode choke near the transceiver; keep the MCU-side CAN routing away from the 25 MHz clock. Use a solid ground plane and connect the LQFP thermal/quasi-thermal pins to it. For mixed analog/digital layouts, partition ADC input traces away from PWM outputs to preserve 10-bit accuracy.

Three recurring migration pitfalls: (1) the 512 KB Flash is paged - PPAGE-based bank switching must be enabled in the linker (banked memory model), or code silently overruns 48 KB of linear space; (2) migrating to MC9S12X successors changes the interrupt vector scheme (IVBR) and adds XGATE, so vector tables are not copy-paste compatible; (3) bus clock must not exceed 25 MHz for this grade - PLL divider misconfiguration at 16 MHz crystals is the most common bring-up failure. Verify mask-set errata against your date code via the NXP product page before finalizing.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

NXP product page lists an Environmental Quality section but specific RoHS/REACH status for this ordering code was not captured in the retrieved data; consult the NXP product page environmental datasheet for the certified values.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor Motorola Semiconductor MC9S12DP512MPVE MC9S12DP512 MC9S12DT128MPVE MC9S12XDP512VAG MC9S12DP512CPV HCS12 S12X CPU12 XGATE 16-bit microcontroller microcontroller unit (MCU) msCAN LQFP-112 112-pin QFP package surface mount flash memory paging (PPAGE) BDM background debug mode automotive multiplexing body control module enhanced capture timer PWM 10-bit ADC
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