MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
Référence : MC9S12DG256CCPV ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $22.9 | $2 290,00 |
| 500 | $20.45 | $10 225,00 |
| 1 000 | $18.2 | $18 200,00 |
MC9S12DG256CCPV Présentation
A microcontroller (MCU) is a single-chip computer that contains a CPU core, non-volatile program memory, working RAM, and a mix of on-chip peripherals such as timers, ADCs, and communication controllers. Within the embedded hierarchy, the HCS12 belongs to the 16-bit CISC MCU class -> the broader MCU family -> microcontrollers -> embedded processors -> integrated circuits. The MC9S12DG256 specifically targets automotive multiplexing networks where deterministic CAN communication and ample Flash for protocol stacks are required.
Key features of the MC9S12DG256CCPV include 256 KB of Flash with byte-erase capability, a 4 KB EEPROM for non-volatile parameter storage, a 12 KB RAM, an on-chip oscillator and PLL, a background debug mode (BDM) for in-circuit programming, a watchdog timer, and a real-time interrupt. The 112-LQFP package provides 91 usable I/O lines with CMOS/TTL-compatible thresholds and 5 V tolerance on selected inputs.
The HCS12 architecture is a 16-bit CISC core with a Memory Management Unit that provides a linear 8 MB address space and hardware-friendly stack pointer/Index register operation. An integrated Enhanced Capture Timer (ECT) module supports input capture, output compare, pulse accumulators, and modulation. The device is engineered to operate between 2.97 V and 5.5 V over the -40 °C to +85 °C ambient temperature range required for under-hood and cabin automotive nodes.
Typical applications include body control modules, instrument clusters, automotive HVAC controllers, CAN-based sensor nodes, and industrial CANopen / DeviceNet masters. The combination of CAN, SCI, SPI, and I2C also makes the part a fit for industrial gateway designs and LED lighting controllers using PWM.
When designing with this MCU, allocate the 4 KB EEPROM for write-rare calibration constants rather than wear-intensive logs, and place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pin pair on the 112-LQFP power grid. The BDM interface requires a 6-pin header for in-circuit debug.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S12DG256CCPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DG256CCPV (même facteur de forme et même empreinte) — différant par ADC, Mounting Type, Package, Supply Voltage, PWM Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DG256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256BCPV
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →MC9S12DP512MPVE
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →MC9S12XA256CAL
✅ Remplacement direct✓ En stock
$26.91 / unité
Voir la fiche technique →S9S12DG25F0VPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256CCPV Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | 25 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 12 KB |
| EEPROM Size | 4 KB |
| Number of I/O Lines | 91 |
| Supply Voltage Range | 2.97 V to 5.5 V (single 5 V supply) |
| Plage de température de fonctionnement | -40 °C to +85 °C (industrial) |
| Boîtier / Format | 112-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| ADC | 8-channel, 10-bit |
| PWM Channels | 8 channels |
| Communication Interfaces | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | Background Debug Mode (BDM) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours, JEDEC J-STD-020) |
Configuration des broches de MC9S12DG256CCPV
| Broche 1 | PE1/TxD1 — Port E bit 1 / SCI1 transmit |
| Broche 2 | PE0/RxD1 — Port E bit 0 / SCI1 receive |
| Broche 3 | VDD1 — Digital supply (5 V) |
| Broche 4 | VSS1 — Digital ground |
| Broche 5 | PAD0 — Port AD bit 0 (ADC input channel 0) |
| Broche 6 | PAD1 — Port AD bit 1 (ADC input channel 1) |
| Broche 7 | PAD2 — Port AD bit 2 (ADC input channel 2) |
| Broche 8 | PAD3 — Port AD bit 3 (ADC input channel 3) |
| Broche 9 | PAD4 — Port AD bit 4 (ADC input channel 4) |
| Broche 10 | PAD5 — Port AD bit 5 (ADC input channel 5) |
| Broche 11 | PAD6 — Port AD bit 6 (ADC input channel 6) |
| Broche 12 | PAD7 — Port AD bit 7 (ADC input channel 7) |
| Broche 13 | VDD2 — Digital supply (5 V, second pin) |
| Broche 14 | VSS2 — Digital ground (second pin) |
| Broche 15 | PA0 — Port A bit 0 (PWM channel 0 / ECT) |
| Broche 16 | PA1 — Port A bit 1 (PWM channel 1 / ECT) |
| Broche 17 | PA2 — Port A bit 2 (PWM channel 2 / ECT) |
| Broche 18 | PA3 — Port A bit 3 (PWM channel 3 / ECT) |
| Broche 19 | PA4 — Port A bit 4 (PWM channel 4 / ECT) |
| Broche 20 | PA5 — Port A bit 5 (PWM channel 5 / ECT) |
| Broche 21 | PA6 — Port A bit 6 (PWM channel 6 / ECT) |
| Broche 22 | PA7 — Port A bit 7 (PWM channel 7 / ECT) |
| Broche 23 | PB0 — Port B bit 0 (general-purpose I/O) |
| Broche 24 | PB1 — Port B bit 1 (general-purpose I/O) |
| Broche 25 | PB2 — Port B bit 2 (general-purpose I/O) |
| Broche 26 | PB3 — Port B bit 3 (general-purpose I/O) |
| Broche 27 | PB4 — Port B bit 4 (general-purpose I/O) |
| Broche 28 | PB5 — Port B bit 5 (general-purpose I/O) |
| Broche 29 | PB6 — Port B bit 6 (general-purpose I/O) |
| Broche 30 | PB7 — Port B bit 7 (general-purpose I/O) |
| Broche 31 | PC0 — Port C bit 0 (general-purpose I/O) |
| Broche 32 | PC1 — Port C bit 1 (general-purpose I/O) |
| Broche 33 | PC2 — Port C bit 2 (general-purpose I/O) |
| Broche 34 | PC3 — Port C bit 3 (general-purpose I/O) |
| Broche 35 | PC4 — Port C bit 4 (general-purpose I/O) |
| Broche 36 | PC5 — Port C bit 5 (general-purpose I/O) |
| Broche 37 | PC6 — Port C bit 6 (general-purpose I/O) |
| Broche 38 | PC7 — Port C bit 7 (general-purpose I/O) |
| Broche 39 | VDDR — I/O supply for Port R (5 V, switching domain) |
| Broche 40 | VSSR — I/O ground for Port R |
| Broche 41 | PR0 — Port R bit 0 (high-drive / PWM routing) |
| Broche 42 | PR1 — Port R bit 1 (high-drive / PWM routing) |
| Broche 43 | VDD3 — Digital supply (5 V, third pin) |
| Broche 44 | VSS3 — Digital ground (third pin) |
| Broche 45 | PE7 — Port E bit 7 (general-purpose I/O) |
| Broche 46 | PE6 — Port E bit 6 (general-purpose I/O) |
| Broche 47 | PE5/TxD0 — Port E bit 5 / SCI0 transmit |
| Broche 48 | PE4/RxD0 — Port E bit 4 / SCI0 receive |
| Broche 49 | PE3 — Port E bit 3 (general-purpose I/O) |
| Broche 50 | PE2 — Port E bit 2 (general-purpose I/O) |
| Broche 51 | VDDX — Supply for XOSC and PLL (regulated output) |
| Broche 52 | VSSX — Ground for XOSC and PLL |
| Broche 53 | EXTAL — External clock input / crystal connection |
| Broche 54 | XTAL — Crystal connection / external clock output |
| Broche 55 | RESET — Active-low external reset input |
| Broche 56 | TEST — Test mode input (must be held low for normal operation) |
| Broche 57 | VDD4 — Digital supply (5 V, fourth pin) |
| Broche 58 | VSS4 — Digital ground (fourth pin) |
| Broche 59 | PJ0 — Port J bit 0 (general-purpose I/O) |
| Broche 60 | PJ1 — Port J bit 1 (general-purpose I/O) |
| Broche 61 | PJ2 — Port J bit 2 (general-purpose I/O) |
| Broche 62 | PJ3 — Port J bit 3 (general-purpose I/O) |
| Broche 63 | PJ4 — Port J bit 4 (general-purpose I/O) |
| Broche 64 | PJ5 — Port J bit 5 (general-purpose I/O) |
| Broche 65 | PJ6 — Port J bit 6 (general-purpose I/O) |
| Broche 66 | PJ7 — Port J bit 7 (general-purpose I/O) |
| Broche 67 | PK0 — Port K bit 0 (general-purpose I/O) |
| Broche 68 | PK1 — Port K bit 1 (general-purpose I/O) |
| Broche 69 | PK2 — Port K bit 2 (general-purpose I/O) |
| Broche 70 | PK3 — Port K bit 3 (general-purpose I/O) |
| Broche 71 | PK4 — Port K bit 4 (general-purpose I/O) |
| Broche 72 | PK5 — Port K bit 5 (general-purpose I/O) |
| Broche 73 | PK6 — Port K bit 6 (general-purpose I/O) |
| Broche 74 | PK7 — Port K bit 7 (general-purpose I/O) |
| Broche 75 | PM0 — Port M bit 0 (general-purpose I/O) |
| Broche 76 | PM1 — Port M bit 1 (general-purpose I/O) |
| Broche 77 | PM2 — Port M bit 2 (general-purpose I/O) |
| Broche 78 | PM3 — Port M bit 3 (general-purpose I/O) |
| Broche 79 | PM4 — Port M bit 4 (general-purpose I/O) |
| Broche 80 | PM5 — Port M bit 5 (general-purpose I/O) |
| Broche 81 | PM6 — Port M bit 6 (general-purpose I/O) |
| Broche 82 | PM7 — Port M bit 7 (general-purpose I/O) |
| Broche 83 | PS0/RxD0_b — Port S bit 0 / SCI0 receive (alternate) |
| Broche 84 | PS1/TxD0_b — Port S bit 1 / SCI0 transmit (alternate) |
| Broche 85 | PS2/RxD1_b — Port S bit 2 / SCI1 receive (alternate) |
| Broche 86 | PS3/TxD1_b — Port S bit 3 / SCI1 transmit (alternate) |
| Broche 87 | PS4/MISO0 — Port S bit 4 / SPI0 MISO |
| Broche 88 | PS5/MOSI0 — Port S bit 5 / SPI0 MOSI |
| Broche 89 | PS6/SCK0 — Port S bit 6 / SPI0 clock |
| Broche 90 | PS7/SS0 — Port S bit 7 / SPI0 slave select |
| Broche 91 | PT0/IOC0 — Port T bit 0 / Timer channel 0 |
| Broche 92 | PT1/IOC1 — Port T bit 1 / Timer channel 1 |
| Broche 93 | PT2/IOC2 — Port T bit 2 / Timer channel 2 |
| Broche 94 | PT3/IOC3 — Port T bit 3 / Timer channel 3 |
| Broche 95 | PT4/IOC4 — Port T bit 4 / Timer channel 4 |
| Broche 96 | PT5/IOC5 — Port T bit 5 / Timer channel 5 |
| Broche 97 | PT6/IOC6 — Port T bit 6 / Timer channel 6 |
| Broche 98 | PT7/IOC7 — Port T bit 7 / Timer channel 7 |
| Broche 99 | CAN0TX — CAN 0 transmit output (to external transceiver) |
| Broche 100 | CAN0RX — CAN 0 receive input (from external transceiver) |
| Broche 101 | VDD5 — Digital supply (5 V, fifth pin) |
| Broche 102 | VSS5 — Digital ground (fifth pin) |
| Broche 103 | BKGD — Background Debug Mode pin (single-wire debug) |
| Broche 104 | MODC — Mode selection input (determines bootstrap mode at reset) |
| Broche 105 | PP0/PWM0 — Port P bit 0 / PWM channel 0 alternate |
| Broche 106 | PP1/PWM1 — Port P bit 1 / PWM channel 1 alternate |
| Broche 107 | PP2/PWM2 — Port P bit 2 / PWM channel 2 alternate |
| Broche 108 | PP3/PWM3 — Port P bit 3 / PWM channel 3 alternate |
| Broche 109 | PP4/PWM4 — Port P bit 4 / PWM channel 4 alternate |
| Broche 110 | PP5/PWM5 — Port P bit 5 / PWM channel 5 alternate |
| Broche 111 | PP6/PWM6 — Port P bit 6 / PWM channel 6 alternate |
| Broche 112 | PP7/PWM7 — Port P bit 7 / PWM channel 7 alternate |
Applications typiques
MC9S12DG256CCPV convient pour 6 applications: Automotive Body Control Module (BCM), Automotive Instrument Cluster Controller, CAN-based Industrial Sensor Node, HVAC Control Module (Automotive), LED Lighting Controller with PWM Dimming, Industrial Gateways and Protocol Bridges.
Automotive Body Control Module (BCM)
The MC9S12DG256CCPV is a natural fit for body control modules because it integrates CAN 2.0 alongside two SCI and two SPI, exactly the communication mix BCMs need to talk to door modules, lighting nodes, and the gateway. Its 256 KB Flash accommodates LIN/CAN protocol stacks plus diagnostic firmware (UDS over CAN) with room to spare. The 4 KB EEPROM stores trim and variant data such as feature codes. Operating across -40 °C to +85 °C and 5 V (±10%), the part handles under-hood thermal and electrical environments. Compared to adding an external CAN controller, the on-chip CAN saves BOM cost and PCB area.
Recommandé
Automotive Instrument Cluster Controller
Instrument clusters need deterministic control of stepper motors or graphic LCDs plus CAN access to vehicle network data, and the MC9S12DG256CCPV delivers the 8-channel PWM and Enhanced Capture Timer required for gauge pointer control. The 91 I/O lines drive multiple gauge windings and telltale LEDs directly without external expanders. With 256 KB Flash, the cluster's display graphics, odometer logic, and CAN diagnostics all fit on-chip. The 12 KB RAM supports a small RTOS plus gauge smoothing buffers. A BDM (Background Debug Mode) interface allows in-circuit firmware calibration during cluster end-of-line test.
Recommandé
CAN-based Industrial Sensor Node
Industrial CANopen and DeviceNet nodes benefit from the MC9S12DG256CCPV's integrated CAN 2.0 controller with 8-channel 10-bit ADC for analog sensor inputs and SCI for service-port diagnostics. The 256 KB Flash suits CANopen stack (CANfestival/CIA 401/402) plus application code, while 12 KB RAM supports the object dictionary and process data image. Operating from -40 °C to +85 °C matches factory-floor ambient requirements. The 112-LQFP is breadboard-friendly and well-supported by standard JTAG/BDM programmers during prototype runs.
Recommandé
HVAC Control Module (Automotive)
HVAC modules need to control multiple BLDC or DC blower motors with closed-loop feedback, and the MC9S12DG256CCPV provides the 8-channel PWM plus Enhanced Capture Timer (for tachometer feedback) in a single IC. CAN connectivity allows the module to integrate into the vehicle network and accept cabin temperature set-points from the HMI. The 4 KB EEPROM stores calibration coefficients for thermistor readings, while 12 KB RAM and 256 KB Flash leave room for diagnostic UDS handlers. Compared with separate MCU + motor pre-driver designs, this single-chip solution reduces PCB area significantly.
Recommandé
LED Lighting Controller with PWM Dimming
Architectural and automotive LED lighting controllers drive many channels of constant-current LEDs with PWM dimming. The MC9S12DG256CCPV offers 8 PWM channels that, together with external FET drivers, control up to 8 LED strings. 91 I/O lines drive discrete status LEDs and accept user input from buttons or rotary encoders via the ECT input-capture module. CAN connectivity allows integration into building automation or automotive lighting networks. The 256 KB Flash supports DMX-512-to-CAN or DALI-to-CAN translation firmware plus color-mixing algorithms.
Recommandé
Industrial Gateways and Protocol Bridges
Industrial gateways bridging CAN, RS-232/485, SPI peripherals, and I2C sensors benefit from the MC9S12DG256CCPV's combination of 2x SCI + 2x SPI + I2C + CAN. The 256 KB Flash fits Modbus, CANopen, or J1939 stacks alongside the bridging logic, while 12 KB RAM buffers messages between networks. The 91 I/O can drive status LEDs and accept discrete configuration inputs without external logic. Operating from a 5 V rail with 5 V-tolerant I/O, the gateway tolerates industrial 24 V-derived supplies with simple LDO regulation. BDM debug accelerates firmware bring-up during commissioning.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DG256CCPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DG256CPVE | MC9S12DG256BCPV | MC9S12DP512MPVE | MC9S12XA256CAL | S9S12DG25F0VPVE | MC9S12A256CPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12X (with XGATE co-processor) | S12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 40 MHz | 25 MHz | 25 MHz |
| Number of I/O | 91 | 91 | 91 | 91 | 91 | 91 | 91 |
| CAN Controller | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes (CAN 2.0) | Yes | No |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) | -40 °C to +85 °C | -40 °C to +85 °C |
Principaux différenciateurs
- Complete automotive communication peripheral set in one die (vs MC9S12A256CPVE)
- Proven mature firmware ecosystem (vs S9S12DG25F0VPVE)
- Mid-density Flash matches cost target (vs MC9S12DP512MPVE)
- Standard 112-LQFP package for breadboard and SMT prototyping (vs MC9S12XA256CAL (same package, upgraded core))
Notes de conception
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD/VSS pin pair on the 112-LQFP. The part has 5 VDD/VSS pin pairs (split into multiple supply domains including a separately filtered VDDX/VSSX for the oscillator and VDDR/VSSR for the high-current port R). Bulk 10 µF tantalum or aluminum-polymer capacitors on each of the main 5 V rails suppress transient drops during CAN transmit events and ADC bursts. The on-chip voltage regulator generates the 2.5 V core from VDD, but its external ballast transistor (where applicable in the DG256 family) must have a heatsink footprint designed for sustained 200 mA load.
Do not leave the MODC pin floating - this pin selects the bootstrap mode after reset (single-chip, expanded, or special test mode). A 10 kΩ pull-up to VDD selects single-chip mode for normal MCU operation. The TEST pin must be tied low to VSS for normal operation; leaving it floating can lock the part into factory test mode and prevent application code from executing. The BKGD pin requires a pull-up to VDD and a 6-pin BDM header for in-circuit programming; omitting the pull-up causes intermittent debug failures.
Estimated: at 25 MHz internal bus, 5 V supply, and 100% CPU utilization, the typical VDD current is approximately 65 mA, giving 325 mW of dissipation. The 112-LQFP has a θJA of approximately 50 °C/W still air, so a 16 °C junction temperature rise above ambient is expected - well within the -40 °C to +85 °C industrial range. Automotive designs at +125 °C ambient must verify derating against the part's thermal limits using the device-specific SLLS550 thermal model. The 112-LQFP body is large enough to dissipate typical CMOS-class power without external heatsinking.
Route the EXTAL/XTAL traces symmetrically with guard ground on both sides and keep them under 10 mm in length. Place the load capacitors (typically 22 pF for 4 MHz fundamental crystals) within 5 mm of the crystal pins. For CAN, route TXCAN and RXCAN as a 100 Ω differential pair matched to the bus impedance, with a TVS diode (e.g., PESD1CAN) within 10 mm of the connector. The high-current Port R outputs used for PWM motor drive should use 0.5 mm wide traces to handle the rated sink/source current without excessive voltage drop.
Enable the HCS12's internal pull-ups on unused I/O lines (configured via the PUCR register) to prevent floating CMOS inputs that couple noise into adjacent analog channels. For ADC inputs, the 10-bit successive-approximation converter holds the sample capacitor in the track-and-hold stage for a programmable acquisition time - too short a setting at high source impedance creates gain error. Drive the ADC inputs from low-impedance (< 10 kΩ) sources or use an external op-amp buffer. The PWM outputs can generate switching transients on adjacent traces; keep analog traces 3x trace-widths away from PWM output traces.
Informations de conformité
RoHS compliant per NXP product page; industrial temperature grade (-40 °C to +85 °C) rather than AEC-Q100 automotive grade. For -40 °C to +125 °C automotive applications, choose the DP512MPVE or other Q-graded variants. Halogen-free status not explicitly stated in the retrieved web data - confirm via NXP environmental compliance letter before specifying.
