NXP Semiconductors

MC9S12DT128CPV - HCS12 16-Bit 25MHz MCU 128KB Flash | NXP | 112-LQFP

MPN: MC9S12DT128CPV ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V / 5 V (family) Vdss 112-LQFP (20x20 mm) Package 25 MHz Speed 128 KB (128K x 8) Memory
From $9.85 USD / Unit
MOQ: 1 |
Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.95 $1,395.00
500 $11.4 $5,700.00
1,000 $9.85 $9,850.00
ℹ️ All prices are in USD

MC9S12DT128CPV Overview

The NXP (formerly Freescale/Motorola) MC9S12DT128CPV is a 16-bit HCS12 CISC microcontroller built around the CPU12 core, offering 128KB of on-chip Flash program memory, 8KB of RAM and 2KB of EEPROM, clocked at up to 25 MHz, and housed in a 112-pin LQFP package (20x20 mm). It is designed for automotive multiplexing and body-electronics applications, integrating a rich peripheral set including up to 91 I/O lines, a PWM module, a watchdog timer, and multiple serial interfaces (CAN, SCI/SPI/I2C). The part is specified for industrial temperature operation, with a 2.5V/5V-tolerant supply for the HCS12 family.

HCS12 microcontrollers are 16-bit CISC devices that originated as the evolution of the Motorola HC11 architecture, retaining code compatibility while adding background debug mode (BDM), a 16-bit CPU register set, and a sophisticated interrupt controller. As members of the broader microcontroller category, HCS12 devices sit below 32-bit ARM Cortex-M parts in flash-memory density but above 8-bit 8051/AVR devices in computational throughput, making them a fit for cost-sensitive real-time embedded control rather than high-throughput applications like graphics or wireless stacks.

Key features of the MC9S12DT128CPV include 128KB Flash organized as 128K x 8, an integrated CAN 2.0 module for in-vehicle networking, pulse-width modulation outputs for motor or lighting drivers, and a watchdog timer for fail-safe recovery. The 8KB on-chip SRAM is sufficient for protocol stacks and small buffers, while the 2KB EEPROM supports non-volatile parameter storage (CAN IDs, calibration data, fault logs). The HCS12 core executes most instructions in a single bus cycle, giving effective throughput near 25 MIPS at the rated 25 MHz E-clock.

Architecturally, the device combines the HCS12 CPU12 core, a multi-channel ADC (referenced in the family datasheet), an enhanced capture/timer module, and the BDLC/SCI/SPI/IIC blocks behind a standard HCS12 peripheral bridge. The part is fully pin-compatible with other members of the MC9S12D-Family, letting designers swap memory and peripheral options without board rework. According to the family datasheet, the design targets automotive multiplexing where CAN bandwidth and deterministic interrupt response are key.

Typical applications for the MC9S12DT128CPV include automotive body control modules, gateway and multiplexing nodes, HVAC control panels, instrument clusters, and industrial CAN-based sensor hubs. The combination of integrated CAN, ample Flash, and the LQFP-112 footprint also suits bench-test equipment and factory automation peripherals where automotive-grade peripherals are repurposed.

Design consideration: because the device is sourced primarily through the legacy/obsolete channel (rated Obsolete by some distributors), verify long-term supply via authorized franchises or licensed aftermarket suppliers before committing to new designs. Plan a Freescale/NXP S12X or S12 MagniV successor as the modernization path, keeping in mind that those successors usually require firmware migration despite pin family compatibility.

This page consolidates distributor pricing, parametric alternatives, design notes, and AEO-optimized engineering content that goes beyond raw datasheet restatement to accelerate BOM qualification and obsolescence planning.

Drop-in alternatives for MC9S12DT128CPV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12DT128CPV (same form factor and footprint) — differing in Operating Temperature, Supply Voltage, RAM Size, ADC, Bus Frequency.

NXP Semiconductors
RAM Size: 8 KB
Compare with MC9S12DT128CPV →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial)
Supply Voltage: 5.0 V (4.5 V to 5.5 V)
RAM Size: 12 KB (12K x 8)
Compare with MC9S12DT128CPV →
NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Supply Voltage: 2.5V / 5V
ADC: 10/12-bit (model dependent)
Compare with MC9S12DT128CPV →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12DT128CPVE

✅ Drop-In
📦 112-LQFP (20x20)
Same die, tray variant; identical Flash/RAM/EEPROM and core speed

📋 Reference alternative (not in catalog)

MC9S12DT256CPV

✅ Drop-In
📦 112-LQFP (20x20)
256KB Flash vs 128KB (+100%); same 25 MHz core and pinout

📋 Reference alternative (not in catalog)

MC9S12DT128CPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
NXP USA Inc. · HCS12 · HCS12 (CPU12) · 16-Bit · CISC · 25 MHz · 128 KB (128K x 8) · FLASH

✓ In Stock

$9.85 / Unit

View Datasheet →

MC9S12A128CPV

✅ Drop-In ⚠️ Specs Unverified
📦 112-LQFP (20x20)
Same 128KB Flash but A-family peripheral map (no CAN); differs in CAN absence only

📋 Reference alternative (not in catalog)

MC9S12DP512CPV

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit) · 25 MHz · 512 KB (512K x 8) · 12 KB (12K x 8) · 4 KB · 91 · 112-LQFP (20 x 20 mm) · Surface Mount

✓ In Stock

$16.75 / Unit

View Datasheet →

MC9S12XDT256MAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit CISC) · 256KB (256K x 8) · 80 MHz · 40 MHz (typical, derived from 80MHz core) · 2.5V / 5V · -40C to +125C (automotive grade)

✓ In Stock

$15.85 / Unit

View Datasheet →

MC9S12DT128CPV Maximum Ratings & Electrical Characteristics

Manufacturer NXP USA Inc.
Series HCS12
Core Processor HCS12 (CPU12)
Core Size 16-Bit
Core Architecture CISC
Speed (E-clock) 25 MHz
Program Memory Size 128 KB (128K x 8)
Program Memory Type FLASH
RAM Size 8 KB
EEPROM Size 2 KB
Number of I/O 91
Connectivity CANbus, I2C, SCI, SPI
Peripherals PWM, WDT
Oscillator Type External (per datasheet family)
Supply Voltage 2.5 V / 5 V (family)
Operating Temperature -40C to +85C (industrial)
Package / Case 112-LQFP (20x20 mm)
Mounting Type Surface Mount
Terminal Form Gull Wing

MC9S12DT128CPV Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 PE0 — Port E bit 0 / IRQ (per family datasheet)
Pin 2 PE1 — Port E bit 1 / XIRQ (per family datasheet)
Pin 3 PE2 — Port E bit 2 / TCLK
Pin 4 PE3 — Port E bit 3 / MODC
Pin 5 PE4 — Port E bit 4 / ECLK
Pin 6 PE5 — Port E bit 5
Pin 7 PE6 — Port E bit 6
Pin 8 PE7 — Port E bit 7
Pin 9 VSSR — Reset VSS
Pin 10 VDDR — Reset VDD
Pin 11 BKGD — Background Debug Mode pin
Pin 12 RESET — External reset input, active low
Pin 13 TEST — Test mode pin, tie low in normal operation
Pin 14 VDD — 5V/2.5V digital supply (per family)
Pin 15 VSS — Digital ground
Pin 16 VDDPLL — PLL supply pin (per family)
Pin 17 XFC — PLL loop filter capacitor pin
Pin 18 EXTAL — External clock/crystal pin
Pin 19 XTAL — Crystal pin
Pin 20 VSSPLL — PLL ground
Pin 21-30 PA0-PA7 / PB0-PB7 / PAD group — Port A and Port B mixed I/O per family datasheet
Pin 31-40 PJ0-PJ7 / PK0-PK7 — Port J and Port K GPIO/interrupt group
Pin 41-60 PT0-PT7 / CAN/SCI/SPI — Port T plus dedicated peripherals (TCLK, PWM, IOC) - mapping per datasheet
Pin 61-80 PM0-PM7 / PN0-PN7 — Port M and Port N GPIO/IO per datasheet
Pin 81-100 PS0-PS7 / PP0-PP7 / PWM — Port S/P/P peripheral group
Pin 101-112 PAD remaining / VDD / VSS — Remaining I/O and additional supply/ground pins per datasheet

Typical Applications

MC9S12DT128CPV is suitable for 6 applications: Automotive Body Control Module (BCM), Automotive Gateway / Multiplexing Node, HVAC Control Panel Electronics, Instrument Cluster / Auxiliary Display Driver, Industrial CAN-Based Sensor Hub, Engineered Replacement / Legacy Service Board.

🚗

Automotive Body Control Module (BCM)

The MC9S12DT128CPV fits BCM designs because it integrates a CAN 2.0 controller, two SCI, one SPI and one I2C - the four buses that a body module needs to talk to door nodes, mirror motors and lighting drivers. Its 128KB Flash is enough for a BCM-style RTOS plus diagnostic UDS stack, while the 8KB RAM hosts CANmailbox buffers and debounce tables. The 112-LQFP package puts all 91 I/O on a single PCB layer, easing the body-module wiring harness interface. Compared with discrete logic plus a separate CAN controller, the part consolidates the application into one IC and shrinks Bill-of-Materials. Designers should pair it with a TJA1050 or TLE6250 CAN transceiver on the bus pins, and a 5V LDO such as NXP's MC33761 for stable VDD during cranking pulses.

🌐

Automotive Gateway / Multiplexing Node

In automotive gateways the MC9S12DT128CPV acts as a CAN-to-CAN or CAN-to-LIN bridge, offloading protocol translation from a higher-tier ECU. The HCS12 core at 25 MHz leaves headroom for software CAN filtering at ~500 kbps on both channels, and the 8KB RAM is sufficient to buffer short messages while awaiting transmission on the slower bus. The 2KB EEPROM holds CAN identifier routing tables that production lines can set via BDM. Because the part is part of the MC9S12D family, designers can drop in MC9S12DT256CPV without PCB rework when higher throughput is required. A typical gateway board also uses a 16 MHz crystal with the on-chip PLL to derive 25 MHz bus clock; EMI is contained by the package's solid ground plane under the die.

🏭

HVAC Control Panel Electronics

The MC9S12DT128CPV is well matched to HVAC control panels where the MCU drives seven-segment or dot-matrix displays, scans key matrices, and PWM-modulates blower fan motors. The PWM module supports variable-speed fan control with duty resolution suited for cabin acoustic targets, and 91 available I/O cover the keypad scan plus LED indication without external expanders. The -40C to +85C industrial temperature grade spans cabin climate, while the 16-bit CISC core executes scan-loop math easily within the 100 ms refresh budget. The 112-LQFP package keeps the entire panel electronics under 25 mm^2 plus display, enabling slim bezel industrial designs. Designers typically pair the part with NXP's MC33996 for smart-power outputs and a low-cost SPI OLED display for the user interface.

📺

Instrument Cluster / Auxiliary Display Driver

Instrument clusters and tractor/marine auxiliary displays often use the MC9S12DT128CPV as the rendering and bus controller, since it can refresh stepper-motor gauges at 100 Hz while polling the CAN body network for vehicle speed and RPM. Its 8KB RAM is sufficient to buffer up to four gauge step-counter tables and a small frame buffer, while 128KB Flash holds a JPEG-style warning-icon library plus the cluster graphics. The integrated CAN frees an external transceiver slot, and the 5V tolerant I/O drives bipolar stepper coils directly when paired with VN750 or BTS432E drivers. Compared with 32-bit Cortex-M alternatives, the part wins on cost-effectiveness for non-graphical gauges. The LQFP-112 footprint is also convenient for hand-repair and field rework.

🏭

Industrial CAN-Based Sensor Hub

Outside the cabin, the MC9S12DT128CPV serves as a CAN-based sensor hub for factory automation, oil/gas telemetry, and remote pumping stations where extended -40C to +85C operation and CAN isolation are required. The 16-bit core is enough to run a CANopen or DeviceNet slave stack in 128KB Flash with 8KB RAM headroom for process-image (PDO) buffers. The PWM and timer channels drive analog-style actuator outputs proportional to received CAN PDOs, and the watchdog timer provides fail-safe recovery during brownouts. The 112-LQFP package fits a 50 x 70 mm sensor hub PCB alongside a CAN isolator and a DC/DC. Compared with discrete 8051-based designs, this part delivers HCS12 interrupt latency that simplifies deterministic CAN scheduling.

🔧

Engineered Replacement / Legacy Service Board

Because the MC9S12DT128CPV is marked obsolete, repair depots and manufacturers of long-life equipment (military, heavy machinery, locomotive) keep it as a service-stock part for legacy boards. Field service organizations rely on the device to refresh ATE and production testers originally designed in the early 2000s. The 112-LQFP package and HCS12 instruction set allow engineers to bring up identical test firmware on rebuilt units without re-validation. Licensed aftermarket suppliers like Rochester Electronics pre-qualify date-code inventory so service boards pass long-term aging tests. Engineering teams building replacement boards often design around the pin-compatible MC9S12DT256CPV when firmware headroom is needed for modernization patches.

Recommended Products Summary

TJA1050T High-speed CAN transceiver paired with CAN bus pins Used in: Automotive Body Control Module (BCM) MC33761 Automotive 5V LDO powering MCU VDD rail Used in: Automotive Body Control Module (BCM) MC9S12DT256CPV Pin-compatible upgrade with 256KB Flash for higher throughput Used in: Automotive Gateway / Multiplexing Node, Engineered Replacement / Legacy Service Board TLE7259-3GE LIN transceiver for body-domain gateways Used in: Automotive Gateway / Multiplexing Node MC33996 SPI-controlled 24-bit smart power driver for HVAC loads Used in: HVAC Control Panel Electronics MC9S08PT16 Companion 8-bit MCU for keypad scanning Used in: HVAC Control Panel Electronics VN750PT High-side driver for gauge stepper/lighting loads Used in: Instrument Cluster / Auxiliary Display Driver TJA1021 LIN transceiver for cluster-cluster talk to body module Used in: Instrument Cluster / Auxiliary Display Driver ISO1050 Isolated CAN transceiver for industrial galvanic isolation Used in: Industrial CAN-Based Sensor Hub TPS3823 Voltage supervisor with watchdog for fail-safe reset Used in: Industrial CAN-Based Sensor Hub USBDM BDM debug pod used to reflash service boards Used in: Engineered Replacement / Legacy Service Board
What is the MC9S12DT128CPV?
The MC9S12DT128CPV is a 16-bit HCS12 CISC microcontroller from NXP (formerly Freescale/Motorola) with 128KB Flash, 8KB RAM and 2KB EEPROM, running at up to 25 MHz in a 112-LQFP package. According to NXP/Motorola family documentation, it is part of the MC9S12D pin-compatible family designed for automotive multiplexing applications. Stock today is primarily through licensed aftermarket distributors because NXP has marked the part obsolete.
How much flash and RAM does the MC9S12DT128CPV have?
The MC9S12DT128CPV integrates 128 KB (128K x 8) of Flash program memory, 8 KB of SRAM, and 2 KB of EEPROM on-chip. The Flash supports in-application reprogramming via the BDM interface or background writes, while the 2 KB EEPROM is intended for non-volatile parameter and calibration storage typical of automotive body modules.
What is the difference between MC9S12DT128CPV and MC9S12DT128CPVE?
The MC9S12DT128CPV and MC9S12DT128CPVE share the same 112-LQFP footprint, 128 KB Flash, 8 KB RAM, 2 KB EEPROM and 25 MHz HCS12 core. The CPVE suffix differs only in packaging/tray or revised lead-finish tape-and-reel orientation versus CPV. Both versions are obsolete; replacements should be sourced together if board revisions must stay pin-compatible.
How many I/O pins and which peripherals does the MC9S12DT128CPV provide?
The MC9S12DT128CPV exposes up to 91 digital I/O pins, two SCI (UART) channels, one SPI, one I2C, one CAN 2.0 controller, an 8-channel PWM module and a watchdog timer. This peripheral mix is sized for automotive body and multiplexing nodes rather than high-throughput gateways.
Is the MC9S12DT128CPV still in production?
The MC9S12DT128CPV is marked obsolete by multiple distributors and NXP product pages. New direct factory orders are not accepted; remaining inventory is shipped by authorized aftermarket suppliers such as Rochester Electronics and independents. Plan modern designs around active S12X or MagniV successors instead.
What is the package and pinout of the MC9S12DT128CPV?
The MC9S12DT128CPV ships in a 112-pin LQFP (Low-profile Quad Flat Pack) measuring 20x20 mm with 0.5 mm pitch and gull-wing leads. Pin 1 is at the top-left when the bevel/dot is oriented per JEDEC. Refer to the NXP MC9S12DT128 datasheet PDF for the full 112-pin pinout, including VDD/VSS, PLL filter, BDM, and CAN pin assignments.
Where can I download the MC9S12DT128CPV datasheet PDF?
The MC9S12DT128CPV datasheet PDF is hosted on the NXP product page at https://www.nxp.com (search MC9S12DT128) and mirrored on alldatasheet.com. The family datasheet covers electrical characteristics, memory map, peripheral registers, and LQFP-112 pinout diagrams. Always cross-reference the latest revision letter before locking firmware offsets.
What is a drop-in replacement for the MC9S12DT128CPV?
Pin-compatible drop-in candidates for the MC9S12DT128CPV are mostly same-brand S12 family derivatives such as MC9S12DT128CPVE (identical die, tray variant) and MC9S12DT256CPV (more Flash, same LQFP-112). True cross-brand 16-bit microcontrollers with the same pinout do not exist; migrating to a different vendor typically requires firmware and toolchain rework.
Can MC9S12DT128CPV be used for automotive body control modules?
Yes. The MC9S12DT128CPV was designed for automotive multiplexing and supports CAN, SCI, SPI, I2C and PWM which are the typical peripherals for BCM, HVAC, seat controllers, and instrument cluster sub-modules. Industrial-grade temperature rating (typically -40C to +85C) is enough for cabin electronics but is not equivalent to full automotive Grade-1 qualification.
Is the MC9S12DT128CPV RoHS compliant?
RoHS compliance for the MC9S12DT128CPV depends on date code and lead-finish variant. Original CPV suffixes may be Pb-bearing while CPVE and later variants are typically lead-free. Always confirm RoHS status with the supplier's certificate of conformance at order time, especially for European OEM builds.
What is the price of MC9S12DT128CPV today?
Unit pricing for the MC9S12DT128CPV averages 18-20 USD at qty 1 in late 2026, decreasing to ~10 USD at qty 1000, reflecting scarce supply. Prices as of 2026-10-17 fluctuate with distributor inventory; licensed aftermarket suppliers (Rochester Electronics) carry stable stock but command premium pricing.
What is the lead time for MC9S12DT128CPV orders?
Lead time for MC9S12DT128CPV through Rochester Electronics and DigiKey/Mouser typically runs 2-4 weeks for stock-on-hand units. Lead time becomes indeterminate for large qty orders or unusual date codes; cross-check with multiple distributors because the part is obsolete and not on factory schedules.
What is the difference between MC9S12DT128CPV and MC9S12XDT256MAL?
Both are NXP 16-bit HCS12 microcontrollers, but the MC9S12XDT256MAL is an S12X device with 256 KB Flash, 12 KB RAM, XGATE co-processor and a 112-LQFP, whereas the MC9S12DT128CPV is a baseline HCS12 with 128 KB Flash and no XGATE. They share the HCS12 instruction set for migration, but the S12X peripheral map and interrupt priorities differ, so firmware is not binary-compatible.
How do I program the MC9S12DT128CPV?
Program the MC9S12DT128CPV through its Background Debug Mode (BDM) interface using an NXP/Freescale BDM pod such as USBDM, P&E Multilink, or Cyclone. CodeWarrior for HCS12 and GCC for S12 are the supported toolchains. BDM allows flash erase/program and in-circuit debug without a bootloader, which is convenient for production bring-up.
Where to buy MC9S12DT128CPV online?
Authorized online sources for the MC9S12DT128CPV include DigiKey, Mouser, Heisener, Jotrin and Hotenda, all of which display real-time stock. Because the part is obsolete, also check Rochester Electronics (the licensed aftermarket partner of NXP) for guaranteed-date-code stock. Independent brokers such as Partstack also list inventory but require obsolescence risk review.

Engineering reference data for MC9S12DT128CPV — comparison, design guidance, and compliance information.

Selection Guide

Choose MC9S12DT128CPV if you need a proven, obsolete-but-still-stock 16-bit HCS12 MCU in a 112-LQFP footprint for legacy board repair or mature product refresh. Pick MC9S12DT128CPVE if you need a tray/reel-equivalent die-match for kitting. Select MC9S12DT256CPV or MC9S12DP512CPV if you need extra Flash/RAM with the same pinout. Migrate to S12X (e.g., MC9S12XDT256MAL) only when you need higher throughput or XGATE - accept firmware migration. Replace with a non-NXP vendor only if you can rework software for a different toolchain; otherwise stay inside the NXP family for fastest time-to-board.

Comparison with Alternatives

Parameter This Product MC9S12DT128CPVE MC9S12DT256CPV MC9S12A128CPV MC9S12DP512CPV MC9S12XDT256MAL
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP
Core HCS12 (CPU12, 16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) HCS12 (16-bit) S12X (16-bit + XGATE)
Speed 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 40 MHz
Flash Size 128 KB 128 KB 256 KB 128 KB 512 KB 256 KB
RAM Size 8 KB 8 KB 12 KB 8 KB 14 KB 12 KB
EEPROM 2 KB 2 KB 2 KB 2 KB 4 KB 4 KB
CAN Module Yes (1x CAN 2.0) Yes (1x CAN) Yes (1x CAN) No (A-family lacks CAN) Yes (CAN) Yes (CAN)
Lifecycle Obsolete Obsolete Obsolete (varies by date code) Obsolete Obsolete Obsolete / Not recommended for new

Key Differentiators

  • Pin-compatible Flash upgrade option within the same NXP family (vs MC9S12DT256CPV)
  • Industry-standard HCS12 toolchain and BDM ecosystem (vs Cross-brand 16-bit MCUs)
  • Integrated CAN 2.0 for body-electronics network nodes (vs MC9S12A128CPV (A-family))

Design Notes

Run the MC9S12DT128CPV from a low-noise 5V LDO such as NXP MC33761 with 100 nF ceramic plus 10 µF bulk on VDD, and keep the PLL filter capacitor on XFC sized per the family datasheet. During crank/crash scenarios, automotive supply can dip below 5 V; design the rail to hold VDD >= 4.5 V until the LDO drops out, then route a reset to the supervisor so the MCU restarts cleanly.

The 112-LQFP at 0.5 mm pitch needs clean fan-out - use 0.2 mm/0.2 mm trace/spacing, four inner layers as GND + VDD, and place 0402 bypass capacitors directly under the package on each VDD/VSS pair. The crystal trace from EXTAL/XTAL must be short, with the load caps within 5 mm; long traces add jitter to the PLL-derived 25 MHz bus clock.

Estimated: BDM pin BKGD must be pulled high during reset (typically 4.7 kohm to VDD) - leaving it floating can lock the part in BDM by accident or, conversely, prevent BDM entry. The TEST pin must be tied low. Driving RESET while VDD is below 4.5 V risks race conditions; tie RESET to a TLE4471 or equivalent supervisor. Also confirm date code and lead finish RoHS requirements before pulling parts from distribution for a new order.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/lead-finish status depends on date code; verify per lot. Not specifically AEC-Q100 qualified at the part family level per the original NXP/Freescale MC9S12DT128 datasheet - for automotive OEM builds confirm compliance separately.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

Related Searches

MC9S12DT128CPV datasheet MC9S12DT128CPV price MC9S12DT128CPV alternative MC9S12DT128CPV pinout 112-LQFP NXP HCS12 16-bit microcontroller 128KB flash MC9S12DT128CPV drop-in replacement MC9S12DT128CPV automotive body control module MC9S12DT128CPV buy online obsolete MC9S12DT128CPV vs MC9S12DT128CPVE MC9S12DT128CPV vs MC9S12XDT256MAL 112-LQFP HCS12 CAN MCU what is the flash size of MC9S12DT128CPV

Related Components & Terms

NXP Semiconductors Freescale Semiconductor Motorola Semiconductor MC9S12DT128CPV MC9S12DT128CPVE MC9S12DT256CPV MC9S12A128CPV MC9S12DP512CPV MC9S12XDT256MAL HCS12 S12X 16-bit microcontroller CISC CPU12 Flash memory EEPROM CAN 2.0 SCI SPI I2C PWM Watchdog timer LQFP-112 BDM (Background Debug Mode) Automotive multiplexing Body control module RoHS AEC-Q100
Quick Quote RFQ
Fill in complete details — our sales team will respond within 24 hours
Part Number Manufacturer Package QTY Target Price Extended
Total: $0.00 USD
✓
Quote submitted!

We will respond to your email within 24 hours

1
RFQ Submitted
2
Quote Received
3
Order Placed
4
Payment
5
Shipped
6
Delivered
View RFQ Details