MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP
MPN: MC9S12XDT256MAL ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $27.5 | $27.50 |
| 10 | $24.2 | $242.00 |
| 100 | $20.95 | $2,095.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.85 | $15,850.00 |
MC9S12XDT256MAL Overview
An automotive microcontroller is a single-chip computer integrating CPU, memory, I/O peripherals, and communication interfaces designed to operate reliably in harsh vehicle environments (under-hood temperature swings, EMI, vibration). Within the broader semiconductor hierarchy, microcontrollers belong to integrated circuits -> microcontrollers -> 16-bit/32-bit MCUs -> automotive-grade ECUs. The MC9S12XDT256MAL sits in the HCS12X family targeted at body electronics, gateway modules, and central body controllers requiring LIN/CAN connectivity and real-time determinism.
Key features include 256KB on-chip Flash (256K x 8), 2.5V/5V supply operation, integrated CAN and SCI/SPI peripherals, PWM and timer modules for motor control, and an A/D converter for sensor acquisition. The device supports extended operating temperature ranges appropriate for automotive AEC-Q100 qualified applications. The 112-LQFP package provides ample I/O for body controller requirements.
Technically, the HCS12X core delivers up to 80MHz bus clock with sophisticated interrupt handling, while XGATE co-processors allow deterministic peripheral servicing without CPU intervention. The architecture balances Flash endurance, EEPROM emulation, and security features such as memory protection units, making it suitable for locked-immobilizer-style applications seen in central body modules.
Typical applications include automotive body ECUs, central body modules with immobilizer functions, gateway ECUs bridging CAN/LIN networks, instrument cluster controllers, climate control modules, and industrial CAN-based control nodes. The 16-bit core, automotive temperature grade, and AEC-Q100 lineage make this MCU well-matched to vehicle networks where deterministic response and reliability are mandatory.
When designing with this part, ensure proper decoupling near all supply pins, follow NXP's recommended oscillator layout guidelines for EMC compliance, and confirm extended-temperature qualification against your application's thermal envelope. Designers migrating from older HCS12 parts benefit from full instruction-set compatibility, simplifying firmware porting.
This page consolidates distributor pricing, drop-in alternatives within the HCS12X family, and practical design notes not found in the manufacturer datasheet summary.
Drop-in alternatives for MC9S12XDT256MAL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S12XDT256MAL (same form factor and footprint) — differing in Supply Voltage, Package, ADC, Core Architecture, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S12XDT256MAA
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MC9S12XD256MAL
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →MC9S12XDQ256MAG
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12DT256BMPV
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12HZ256CAL
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S12XDT256MAL Maximum Ratings & Electrical Characteristics
| Core Architecture | HCS12X (16-bit CISC) |
| Program Memory (Flash) | 256KB (256K x 8) |
| Maximum CPU Clock | 80 MHz |
| Bus Frequency | 40 MHz (typical, derived from 80MHz core) |
| Supply Voltage | 2.5V / 5V |
| Operating Temperature | -40C to +125C (automotive grade) |
| Package | 112-pin LQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Communication Interfaces | CAN, SCI (UART), SPI, I2C |
| ADC | 10/12-bit (model dependent) |
| Instruction Set Compatibility | Upward compatible with HCS12 |
| Co-processor | XGATE peripheral co-processor |
| Automotive Qualification | AEC-Q100 qualified |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
MC9S12XDT256MAL Pin Configuration
| Pin 1 | BKGD — Background Debug Mode pin |
| Pin 2 | PA0 — Port A bit 0 (general I/O) |
| Pin 3 | PA1 — Port A bit 1 (general I/O) |
| Pin 4 | PA2 — Port A bit 2 (general I/O) |
| Pin 5 | PA3 — Port A bit 3 (general I/O) |
| Pin 6 | PA4 — Port A bit 4 (general I/O) |
| Pin 7 | PA5 — Port A bit 5 (general I/O) |
| Pin 8 | PA6 — Port A bit 6 (general I/O) |
| Pin 9 | PA7 — Port A bit 7 (general I/O) |
| Pin 10 | VSS — Ground |
| Pin 11 | VDDR — I/O supply voltage |
| Pin 12 | VDDX — External voltage regulator supply |
| Pin 13 | VSSX — Voltage regulator ground |
| Pin 14 | RESET — External reset input (active low) |
| Pin 15 | VSSPLL — PLL ground |
| Pin 16 | VDDPLL — PLL supply voltage |
| Pin 17 | EXTAL — External oscillator input |
| Pin 18 | XTAL — External oscillator output |
| Pin 19 | TEST — Test mode pin (must be tied high in normal operation) |
| Pin 20 | VSS — Ground |
| Pin 21 | VDD — Core supply voltage (2.5V regulated) |
| Pin 22 | PP0 — Port P bit 0 (PWM/timer) |
| Pin 23 | PP1 — Port P bit 1 (PWM/timer) |
| Pin 24 | PP2 — Port P bit 2 (PWM/timer) |
| Pin 25 | PP3 — Port P bit 3 (PWM/timer) |
| Pin 26 | PP4 — Port P bit 4 (PWM/timer) |
| Pin 27 | PP5 — Port P bit 5 (PWM/timer) |
| Pin 28 | PP6 — Port P bit 6 (PWM/timer) |
| Pin 29 | PP7 — Port P bit 7 (PWM/timer) |
| Pin 30 | PJ0 — Port J bit 0 |
| Pin 31 | PJ1 — Port J bit 1 |
| Pin 32 | PJ2 — Port J bit 2 |
| Pin 33 | PJ3 — Port J bit 3 |
| Pin 34 | PJ4 — Port J bit 4 |
| Pin 35 | PJ5 — Port J bit 5 |
| Pin 36 | PJ6 — Port J bit 6 |
| Pin 37 | PJ7 — Port J bit 7 |
| Pin 38 | PK0 — Port K bit 0 |
| Pin 39 | PK1 — Port K bit 1 |
| Pin 40 | PK2 — Port K bit 2 |
| Pin 41 | PK3 — Port K bit 3 |
| Pin 42 | PK4 — Port K bit 4 |
| Pin 43 | PK5 — Port K bit 5 |
| Pin 44 | PK6 — Port K bit 6 |
| Pin 45 | PK7 — Port K bit 7 |
| Pin 46 | PM0 — Port M bit 0 |
| Pin 47 | PM1 — Port M bit 1 |
| Pin 48 | PM2 — Port M bit 2 |
| Pin 49 | PM3 — Port M bit 3 |
| Pin 50 | PM4 — Port M bit 4 |
| Pin 51 | PM5 — Port M bit 5 |
| Pin 52 | PM6 — Port M bit 6 |
| Pin 53 | PM7 — Port M bit 7 |
| Pin 54 | PS0 — Port S bit 0 (SPI/SI) |
| Pin 55 | PS1 — Port S bit 1 (SPI/SO) |
| Pin 56 | PS2 — Port S bit 2 (SPI/SCK) |
| Pin 57 | PS3 — Port S bit 3 (SPI/SS) |
| Pin 58 | PS4 — Port S bit 4 |
| Pin 59 | PS5 — Port S bit 5 |
| Pin 60 | PS6 — Port S bit 6 |
| Pin 61 | PS7 — Port S bit 7 |
| Pin 62 | PT0 — Port T bit 0 (timer) |
| Pin 63 | PT1 — Port T bit 1 (timer) |
| Pin 64 | PT2 — Port T bit 2 (timer) |
| Pin 65 | PT3 — Port T bit 3 (timer) |
| Pin 66 | PT4 — Port T bit 4 (timer) |
| Pin 67 | PT5 — Port T bit 5 (timer) |
| Pin 68 | PT6 — Port T bit 6 (timer) |
| Pin 69 | PT7 — Port T bit 7 (timer) |
| Pin 70 | PAD00 — A/D converter input channel 0 |
| Pin 71 | PAD01 — A/D converter input channel 1 |
| Pin 72 | PAD02 — A/D converter input channel 2 |
| Pin 73 | PAD03 — A/D converter input channel 3 |
| Pin 74 | PAD04 — A/D converter input channel 4 |
| Pin 75 | PAD05 — A/D converter input channel 5 |
| Pin 76 | PAD06 — A/D converter input channel 6 |
| Pin 77 | PAD07 — A/D converter input channel 7 |
| Pin 78 | VRH — A/D high reference voltage |
| Pin 79 | VRL — A/D low reference voltage |
| Pin 80 | VDDA — A/D supply voltage |
| Pin 81 | VSSA — A/D ground |
| Pin 82 | CAN0TX — CAN0 transmit output |
| Pin 83 | CAN0RX — CAN0 receive input |
| Pin 84 | CAN1TX — CAN1 transmit output |
| Pin 85 | CAN1RX — CAN1 receive input |
| Pin 86 | CAN2TX — CAN2 transmit output |
| Pin 87 | CAN2RX — CAN2 receive input |
| Pin 88 | CAN3TX — CAN3 transmit output |
| Pin 89 | CAN3RX — CAN3 receive input |
| Pin 90 | SCIO_TX — Serial Communications Interface 0 transmit |
| Pin 91 | SCIO_RX — Serial Communications Interface 0 receive |
| Pin 92 | SCI1_TX — Serial Communications Interface 1 transmit |
| Pin 93 | SCI1_RX — Serial Communications Interface 1 receive |
| Pin 94 | SPI0_SCK — SPI 0 serial clock |
| Pin 95 | SPI0_MOSI — SPI 0 master out / slave in |
| Pin 96 | SPI0_MISO — SPI 0 master in / slave out |
| Pin 97 | SPI0_SS — SPI 0 slave select |
| Pin 98 | SPI1_SCK — SPI 1 serial clock |
| Pin 99 | SPI1_MOSI — SPI 1 master out / slave in |
| Pin 100 | SPI1_MISO — SPI 1 master in / slave out |
| Pin 101 | SPI1_SS — SPI 1 slave select |
| Pin 102 | PE0 — Port E bit 0 (general I/O) |
| Pin 103 | PE1 — Port E bit 1 (general I/O) |
| Pin 104 | PE2 — Port E bit 2 (general I/O) |
| Pin 105 | PE3 — Port E bit 3 (general I/O) |
| Pin 106 | PE4 — Port E bit 4 (general I/O) |
| Pin 107 | PE5 — Port E bit 5 (general I/O) |
| Pin 108 | PE6 — Port E bit 6 (general I/O) |
| Pin 109 | PE7 — Port E bit 7 (general I/O) |
| Pin 110 | PH0 — Port H bit 0 |
| Pin 111 | PH1 — Port H bit 1 |
| Pin 112 | PH2 — Port H bit 2 (IRQ) |
Typical Applications
MC9S12XDT256MAL is suitable for 6 applications: Automotive Central Body Module, CAN/LIN Gateway ECU, Instrument Cluster Controller, Automotive Climate Control Module, Industrial CAN Node Controller, Immobilizer and Security ECU.
Automotive Central Body Module
The MC9S12XDT256MAL's 256KB Flash and 80MHz HCS12X core make it ideal for central body modules orchestrating lighting, door locks, and immobilizer functions. Its integrated MSCAN controllers handle high-speed CAN communication with other vehicle ECUs at 500 kbps typical body bus rates. AEC-Q100 qualification ensures reliable operation across -40C to +125C automotive temperature swings. The 112-LQFP footprint provides ample I/O for body module sensor inputs.
Recommended
CAN/LIN Gateway ECU
The MC9S12XDT256MAL's multiple MSCAN modules and SCI/SPI interfaces support gateway functionality bridging CAN and LIN subnetworks in modern vehicles. The HCS12X core's deterministic interrupt handling and XGATE co-processor ensure low-latency message routing between networks running at different baud rates. 256KB Flash accommodates gateway protocol stacks including CANOpen, J1939, and OEM-proprietary transport layers. Suitable for both passenger and commercial vehicle gateway designs.
Recommended
Instrument Cluster Controller
With 80MHz CPU performance and PWM modules for gauge driving, the MC9S12XDT256MAL serves as a main cluster controller driving stepper motors or analog gauges. The 256KB Flash supports graphics libraries, diagnostic routines, and CAN-based cluster message decoding (such as GM GMLAN or FCA CCN protocols). Automotive qualification ensures cluster accuracy across wide temperature ranges. The HCS12X instruction-set compatibility eases porting from older HCS12 cluster designs.
Recommended
Automotive Climate Control Module
The MC9S12XDT256MAL's A/D converter and PWM channels suit HVAC control modules reading temperature sensors, blend-door position feedback, and driving blower motors. Its integrated CAN interface enables HVAC integration into the vehicle body network for zone control commands. Automotive temperature grade supports under-dash thermal conditions. The 112-LQFP provides dedicated I/O for HVAC actuator H-bridge control and keypad input scanning.
Recommended
Industrial CAN Node Controller
Beyond automotive, the MC9S12XDT256MAL serves industrial CANOpen nodes for factory automation, motor drives, and process control where extended temperature and reliability matter. The HCS12X core handles real-time CANOpen SDO/PDO processing at typical 250 kbps to 1 Mbps rates. AEC-Q100 grade suits industrial cabinets and outdoor enclosures. The 256KB Flash accommodates CANOpen stack, application firmware, and OEM configuration profiles.
Recommended
Immobilizer and Security ECU
The MC9S12XDT256MAL's memory protection unit and secure firmware execution make it suitable for immobilizer ECUs storing cryptographic keys and validating transponder challenges. Its automotive temperature grade and long-term Flash retention suit under-dash deployment with 15+ year service life. The HCS12X core provides deterministic response for handshake timing. The 112-LQFP integrates easily into security module form factors alongside RF readers.
Recommended
Recommended Products Summary
Engineering reference data for MC9S12XDT256MAL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12XDT256MAA | MC9S12XD256MAL | MC9S12XDQ256MAG | MC9S12DT256BMPV | MC9S12HZ256CAL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP - same | 112-LQFP - same |
| Core Architecture | HCS12X (16-bit) | HCS12X - same | HCS12X - same | HCS12X - same | HCS12 (non-X) | HCS12X |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 50 MHz |
| XGATE Co-processor | Yes | Yes | Yes | Yes | No | Yes |
| Operating Temperature | -40C to +125C | Per suffix variant | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active |
| Automotive Grade | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified | AEC-Q100 qualified |
Key Differentiators
- HCS12X core with XGATE co-processor (vs MC9S12DT256BMPV)
- Multi-channel MSCAN integration (vs MC9S12HZ256CAL)
- Wider temperature range (vs MC9S12HZ256CAL)
Design Notes
Decouple every VDD/VDDR/VDDA/VDDX supply pin with a 100nF ceramic capacitor placed within 5mm of the pin per NXP's HCS12X hardware design guidelines. Use a 10uF bulk capacitor near the MCU plus 4.7uF near the internal voltage regulator output. A clean ground plane directly beneath the LQFP reduces digital switching noise coupling into ADC references.
The TEST pin must be tied to VDDR through a 1k-10k resistor or directly high; floating TEST pin may place the MCU in factory test mode and prevent normal startup. The BKGD pin requires a dedicated pull-up to VDDR when not actively in use for background debug. Both pins are commonly overlooked by designers migrating from other MCU families and cause debug-time headaches.
CAN bus termination: place 120 ohm termination resistors at each end of the CAN bus, not at the MCU. Use shielded twisted pair for CAN_H/CAN_L traces with characteristic impedance of 120 ohms. Keep CAN traces away from switching power supply nodes and PWM outputs to minimize EMI-induced CAN error frames. Follow NXP AN2464 CAN application note guidance for EMC compliance.
Estimated: at full 80MHz CPU load with all peripherals active, the LQFP-112 junction-to-ambient thermal resistance is approximately 45-55 C/W on a standard 4-layer JEDEC PCB. For under-hood or high-ambient automotive deployments, ensure ambient temperature plus internal power dissipation does not exceed the 125C junction limit. Add thermal vias beneath the exposed pad if available in your PCB stack-up.
The MC9S12XDT256MAL integrates an internal voltage regulator producing 2.5V core from 5V VDDR supply, eliminating external core LDO requirements. However, power sequencing requires VDDR stable before RESET deassertion per NXP S12XD reference manual. Adding a 100nF + 10uF capacitor pair at the VDDX pin ensures stable internal regulator operation across load transients.
Compliance Information
RoHS compliant and AEC-Q100 qualified per NXP product declarations. Halogen-free per NXP environmental compliance documentation. Conflict minerals compliant per NXP's CMRT filings.
