NXP Semiconductors

MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MPN: MC9S12XDT256MAA ✗ End of Life
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2.5V/5V Vdss 80-QFP (14x14 mm) Package 80 MHz Speed 256KB (256K x 8) Memory
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MC9S12XDT256MAA Overview

The NXP Semiconductors MC9S12XDT256MAA is a 16-bit HCS12X microcontroller running at 80 MHz with 256KB (256K x 8) Flash program memory and 16KB RAM, housed in an 80-pin QFP (14x14 mm) surface-mount package.

A 16-bit microcontroller (MCU) is a single-chip computing device whose arithmetic logic unit and internal data paths are 16 bits wide. The MC9S12XD family sits within the broader HCS12X / S12XD hierarchy of automotive-oriented microcontrollers, which themselves belong to the microcontroller unit (MCU) class of embedded processors. MCUs integrate CPU, memory, and peripherals on one die, making them the control backbone of body electronics, gateways, and industrial nodes.

Key features include the 16-bit HCS12X CISC core, upward compatible with the HCS12 instruction set, delivering 32-bit-class performance with 16-bit efficiency. Peripherals include CANbus, EBI/EMI external bus interface, I2C, IrDA, LINbus, SCI, and SPI connectivity, plus PWM, watchdog timer (WDT), low-voltage detect (LVD), and power-on reset (POR). The enhanced indexed addressing and instruction queue improve code density and interrupt latency versus legacy HCS12 devices.

Architecturally, the S12XD family was targeted at automotive multiplexing applications, where its XGATE-style co-processor concept and rich CAN/LIN mix offload communication processing from the main core. The 256KB Flash supports single-chip designs without external memory, and the 5V-tolerant I/O structure suits harsh 12V automotive electrical environments.

Typical applications include automotive body control modules, gateway nodes bridging CAN and LIN networks, dashboard and instrumentation clusters, and industrial control systems that benefit from 5V noise immunity.

A key design consideration is lifecycle status: NXP lists this part as NRND (Not Recommended for New Designs), so new projects should evaluate S12XE/XS family successors while the XDT256 remains ideal for maintaining existing designs.

This page synthesizes distributor inventory data, drop-in alternatives, lifecycle status, and practical design notes not found in the manufacturer datasheet, delivering information gain beyond standard catalog listings.

Drop-in alternatives for MC9S12XDT256MAA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12XDT256MAA (same form factor and footprint) — differing in Package, Operating Temperature, Core Processor, RAM Size, Supply Voltage.

NXP Semiconductors
Package: 80-QFP (PQFP 14x14 mm)
Operating Temperature: -40C to +125C (automotive grade)
Core Processor: HCS12X (with XGATE co-processor)
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NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (S12XD)
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NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
Operating Temperature: -40C to +85C
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NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
Operating Temperature: -40C to +125C (automotive grade)
Supply Voltage: 2.5V / 5V
Compare with MC9S12XDT256MAA →
NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Operating Temperature: -40C to +125C (TA)
RAM Size: 20KB
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NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
Compare with MC9S12XDT256MAA →
NXP Semiconductors
Package: 80-QFP (14 x 14 mm), PQFP
Operating Temperature: -40C to +125C
Core Processor: HCS12X (16-bit CISC)
Compare with MC9S12XDT256MAA →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
Core Processor: HCS12X (S12X)
Compare with MC9S12XDT256MAA →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12XDT512MAA

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ In Stock

Contact for price

View Datasheet →

MC9S12XDT256CAG

✅ Drop-In
NXP Semiconductors
📦 80-QFP
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ In Stock

$17.4 / Unit

View Datasheet →

MC9S12XDT256MAL

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12X (16-bit CISC) · 256KB (256K x 8) · 80 MHz · 40 MHz (typical, derived from 80MHz core) · 2.5V / 5V · -40C to +125C (automotive grade)

✓ In Stock

$15.85 / Unit

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MC9S12XET256MAA

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14 mm)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · 256 KB (256K x 8) · 16 KB · 4 KB · 12-bit · 8 channels

✓ In Stock

$6.98 / Unit

View Datasheet →

MC9S12XD256MAA

✅ Drop-In
NXP Semiconductors
📦 80-QFP
HCS12X (with XGATE co-processor) · 16-Bit · CISC · 80 MHz · 256 KB (256K x 8) · Flash · 14 KB · 4 KB

✓ In Stock

$11.95 / Unit

View Datasheet →

S912XET256J2VAG

✅ Drop-In
NXP Semiconductors
📦 80-QFP
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ In Stock

Contact for price

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MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 80-QFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ In Stock

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MC9S12XDT256MAA Maximum Ratings & Electrical Characteristics

Core Processor HCS12X
Core Size 16-Bit
Core Architecture CISC
Maximum Clock Speed 80 MHz
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
RAM Size 16KB
Supply Voltage 2.5V/5V
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 59
Package 80-QFP (14x14 mm)
Mounting Type Surface Mount
Terminal Form Gull Wing
Packaging Tray
Temperature Grade Automotive
Part Status NRND (Not Recommended for New Designs)

MC9S12XDT256MAA 80-qfp (14x14 mm) Pin Configuration Guide

Pin configuration for MC9S12XDT256MAA (80-qfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

80-qfp (14x14 mm) package pinout diagram for MC9S12XDT256MAA

No detailed pinout data available for MC9S12XDT256MAA.

Refer to the datasheet for full pin configuration.

Typical Applications

MC9S12XDT256MAA is suitable for 6 applications: Automotive Body Control Modules, CAN/LIN Network Gateways, Automotive Dashboard and Instrument Clusters, Industrial Control and Automation Nodes, Motor Control and Actuator Drivers, Diagnostic and Telematics Interface Modules.

🚗

Automotive Body Control Modules

Body control modules (BCMs) coordinate lighting, window lift, door locks, and wiper functions across a vehicle's electrical system. The MC9S12XDT256MAA fits this role directly: its automotive temperature grade, 5V-tolerant I/O with 59 lines, PWM channels for lamp dimming and motor control, and watchdog timer with low-voltage detect address the reliability requirements of 12V in-vehicle environments. The 256KB Flash accommodates full body-function firmware in a single chip without external memory, while the 80 MHz HCS12X core delivers 32-bit-class throughput at 16-bit code efficiency. Because the S12XD family was designed specifically for automotive multiplexing, reference designs and toolchain support are mature, reducing development risk in legacy platform maintenance.

🌐

CAN/LIN Network Gateways

In-vehicle gateways bridge high-speed CAN trunk networks to lower-cost LIN sub-networks for sensors and actuators. The MC9S12XDT256MAA integrates both CANbus and LINbus controllers on-chip, alongside SCI and SPI for diagnostic links, allowing a single MCU to perform protocol translation without external communication ICs. The enhanced indexed addressing and instruction queue of the HCS12X core reduce interrupt latency when handling bursty CAN traffic, and the 16KB RAM buffers message queues for gateway routing tables. In existing platform designs, the 80-QFP (14x14 mm) footprint and 5V I/O directly reuse qualified schematics. For new gateway designs, engineers should evaluate the active-lifecycle S12XE successors, but for sustaining approved XDT256 platforms this part remains the path of least requalification.

📺

Automotive Dashboard and Instrument Clusters

Instrument clusters combine stepper-motor gauge drive, backlight dimming, switch scanning, and CAN communication to the vehicle network. The MC9S12XDT256MAA's PWM peripherals drive gauge and backlight dimming with hardware timing independent of software load, while its 59 I/O lines scan keypads and indicator lamps directly. The 80 MHz core headroom handles multiplexed display refresh and CAN message filtering simultaneously, and 256KB Flash stores display tables and calibration data on-chip. Its 5V I/O structure interfaces cleanly with legacy 5V cluster components without level shifters. Automotive temperature grading ensures operation across the full vehicle cabin environment. Existing cluster platforms validated on the S12XD generation can sustain production with this NRND part while planning migration to S12XE-class successors.

🏭

Industrial Control and Automation Nodes

Industrial nodes require robust 5V logic, deterministic interrupt behavior, and serial connectivity to PLC backbones. The MC9S12XDT256MAA serves these needs with an SPI and SCI interface for fieldbus and HMI links, EBI/EMI external bus for memory-mapped expansion, and PWM outputs for actuator and motor drive. The 16-bit HCS12X CISC core provides predictable execution timing valued in sequential control logic, and the watchdog timer plus power-on reset and low-voltage detect deliver fail-safe behavior required in factory equipment. Its 5V tolerance simplifies interfacing with industrial sensors still specified at 5V levels, and the 80-QFP 14x14 mm package fits standard reflow assembly. For new industrial designs, note the NRND status and consider S12XE-family pin-compatible parts instead.

⚙

Motor Control and Actuator Drivers

DC motor and actuator control in mechatronic modules (throttle, HVAC flaps, seat adjusters) benefits from the MC9S12XDT256MAA's hardware PWM channels, which generate fixed-frequency drive signals independent of CPU load. The 80 MHz core executes closed-loop control algorithms using feedback from timer-input-capture signals, and the 59 I/O lines interface H-bridge drivers and limit switches directly at 5V logic. The watchdog timer ensures PWM outputs enter a safe state on software failure, a requirement for in-cabin actuator safety. Automotive temperature grading and the S12XD family's automotive pedigree align with module-level qualification requirements. Designs already qualified on this die can sustain supply via remaining stock; new actuator designs should adopt active S12XE equivalents in the same 80-QFP footprint.

🧩

Diagnostic and Telematics Interface Modules

Service diagnostic modules and early telematics units tap vehicle CAN buses and forward data over SCI/IrDA or external links. The MC9S12XDT256MAA's CAN controller, SCI UART, and IrDA support cover both in-vehicle capture and workshop-tool connectivity, while 16KB RAM buffers logged frames between upload sessions. The EBI/EMI external bus allows attachment of additional nonvolatile memory for extended log storage beyond the on-chip 256KB Flash, a flexibility not always present in modern single-chip MCUs. Its 5V I/O tolerates the electrical abuse of workshop environments, and the automotive grade covers under-hood adjacent placements. For legacy diagnostic hardware sustaining a vehicle fleet, this NRND part remains procurable via XAIPART sourcing with pin-compatible S12XE successors as forward migration.

What is the MC9S12XDT256MAA microcontroller?
The MC9S12XDT256MAA is an NXP 16-bit HCS12X microcontroller with 256KB Flash, 16KB RAM, and an 80 MHz core, packaged in an 80-pin QFP (14x14 mm). According to NXP's product page, it belongs to the S12XD family targeted at automotive multiplexing applications, with CAN, LIN, I2C, SPI, and SCI connectivity on board. It is now marked NRND, meaning it is supported for existing designs but not recommended for new designs.
Is MC9S12XDT256MAA still in production and available to buy?
The MC9S12XDT256MAA is listed by NXP as NRND (Not Recommended for New Designs), so NXP no longer promotes it for new projects, though remaining authorized stock has been available through distributors such as Mouser and DigiKey. As of 2026-10-18, availability is spot-market dependent. For long-term production, engineers should migrate to S12XE/XS family successors or secure last-time-buy quantities; XAIPART offers BOM-quote sourcing for remaining inventory.
What is the price of MC9S12XDT256MAA?
Verified pricing for the MC9S12XDT256MAA was not available in the data captured as of 2026-10-18, so unit pricing is provided on request via XAIPART's quote workflow rather than a fixed price table. Because the part is NRND, distributor pricing varies significantly with remaining stock and reel quantity. Submit a BOM quantity through XAIPART to receive current market pricing and lead time from authorized and independent sources.
What is the best drop-in replacement for MC9S12XDT256MAA?
The closest drop-in replacement is the NXP MC9S12XDT512MAA, which shares the identical 80-QFP (14x14 mm) footprint and HCS12X architecture but doubles Flash to 512KB. For designs needing only 256KB, the MC9S12XDT256CAG is an equivalent package-80 variant. Because all S12XD/XE 80-QFP family members are pin-compatible, migration typically requires only a Flash-size and register-header update in software, not a PCB respin.
What is the difference between MC9S12XDT256MAA and MC9S12XET256MAA?
Both are 256KB Flash S12-family MCUs in 80-QFP packages, but the MC9S12XET256MAA belongs to the enhanced S12XE generation, while the XDT256 uses the older S12XD core generation with the full XGATE-architecture feature set of the XD family. Electrical characteristics and some peripheral configurations differ between the generations, so although the package footprint is the same, software register-level verification is required before substitution. Treat the XET256 as a pin-compatible upgrade, not a code-identical swap.
Is MC9S12XDT256MAA suitable for automotive applications?
Yes. According to NXP and distributor data, the MC9S12XDT256MAA carries an automotive temperature grade and the S12XD family was explicitly targeted at automotive multiplexing applications such as body control modules and CAN/LIN network gateways. Its 5V I/O structure, CANbus and LINbus controllers, watchdog timer, and low-voltage detect make it well suited to 12V automotive electrical environments with demanding noise conditions.
How much Flash and RAM does MC9S12XDT256MAA have?
The MC9S12XDT256MAA provides 256KB (256K x 8) of on-chip Flash program memory and 16KB of RAM, per distributor specification data. This memory combination supports single-chip operation without external memory for most body-electronics and gateway applications. If your code base exceeds 256KB, the pin-compatible MC9S12XDT512MAA doubles program Flash to 512KB in the same 80-QFP (14x14 mm) package.
What communication interfaces does MC9S12XDT256MAA support?
The MC9S12XDT256MAA integrates CANbus, LINbus, I2C, IrDA, SCI (UART), and SPI serial interfaces, plus an EBI/EMI external bus interface for expanding memory or peripherals off-chip. This connectivity mix, confirmed by distributor specification listings, is the reason the part is widely used in automotive multiplexing: one MCU can bridge high-speed CAN trunk networks to lower-cost LIN sub-networks while debugging over SCI.
Where can I download the MC9S12XDT256MAA datasheet PDF?
The MC9S12XDT256MAA datasheet is available from NXP's official product page at nxp.com/part/MC9S12XDT256MAA, which links the current S12XD family reference manual and data sheet covering the S12XD, S12XB, and S12XA families. The family document is a large multi-thousand-page reference manual rather than a short data sheet, so download it directly from NXP rather than third-party mirrors to ensure you have the latest revision.
Where can I find the MC9S12XDT256MAA pinout for the 80-QFP package?
The complete 80-pin QFP pinout for the MC9S12XDT256MAA is documented in the S12XD family datasheet available on NXP's product page at nxp.com/part/MC9S12XDT256MAA. The 80-QFP (14x14 mm) device provides 59 general-purpose I/O lines multiplexed with CAN, LIN, SPI, I2C, SCI, and PWM functions. Because S12XD/XE 80-QFP parts share the same pin map, the same pinout table applies when evaluating the pin-compatible MC9S12XDT512MAA alternative.
MC9S12XDT256MAA vs MC9S12XDT256MAL - what is the difference?
The MC9S12XDT256MAA and MC9S12XDT256MAL are the same die and the same 80-pin QFP package; the suffix difference denotes the packing/tray ordering variant rather than a functional difference. Comparison listings such as FindIC group both as functionally consistent 16-bit HCS12X parts with 256KB Flash. In practice either ordering code can be substituted on the same PCB, but confirm the exact suffix against your company's approved-vendor-list conventions before purchasing.
Is there a NXP equivalent with more memory in the same 80-QFP package?
Yes. The NXP MC9S12XDT512MAA offers 512KB Flash - double the XDT256's 256KB - in the identical 80-QFP (14x14 mm) pin-compatible package, making it a true drop-in upgrade for memory-constrained firmware. Within the S12XE generation, the S912XET256/S912XET512 family members also provide 256KB/512KB options in pin-compatible 80-QFP housings, allowing PCB reuse across both product generations.
When should I choose MC9S12XDT256MAA over an S12XE successor?
Choose the MC9S12XDT256MAA only for sustaining existing designs whose PCB, firmware, and validation were built around the S12XD generation - its NRND status makes it unsuitable for new designs. For new projects, the S12XE family (e.g., S912XET256J2VAG) offers pin-compatible footprints, active lifecycle status, and lower power. If your BOM already qualifies the XDT256 and remaining stock covers your lifetime buy, staying with it minimizes requalification cost.
What supply voltage does MC9S12XDT256MAA require?
The MC9S12XDT256MAA operates from a 5V supply (with a 2.5V domain referenced in specification listings for the core regulator configuration), per distributor specification data such as FindIC's listing of 2.5V/5V operation. This 5V-tolerant I/O structure is a key advantage in automotive and industrial systems where sensors and transducers still run at 5V logic levels, eliminating level-shift circuitry that 3.3V MCUs would require.
What are the key specifications of MC9S12XDT256MAA that engineers should know?
The MC9S12XDT256MAA is a 16-bit HCS12X CISC microcontroller running at 80 MHz with 256KB Flash, 16KB RAM, and 59 I/O lines in an 80-QFP (14x14 mm) gull-wing surface-mount package. Connectivity includes CAN, LIN, I2C, IrDA, SCI, SPI, and EMI; peripherals include PWM, WDT, LVD, and POR. It is automotive temperature graded, supplied in trays, and listed by NXP as NRND. These parameters come from NXP's product page and DigiKey specification data.

Engineering reference data for MC9S12XDT256MAA — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S12XDT256MAA when you are sustaining an existing S12XD-generation automotive or industrial design whose PCB, firmware, and validation are already qualified on this die - it preserves full software compatibility at minimal requalification cost. Choose MC9S12XDT512MAA instead if firmware growth risks exceeding 256KB, since it is pin-identical with double Flash. Choose MC9S12XET256MAA or S912XET256J2VAG for new designs: they are pin-compatible successors with active lifecycle status, eliminating NRND supply risk, though they demand software revalidation. Choose MC9S12XEQ384CAG when you need an intermediate 384KB memory step. All these parts share the 80-QFP (14x14 mm) footprint, so a single PCB layout accommodates the whole family - but verify S12XD-versus-S12XE register differences before swapping generations in software. Trade-off summary: XDT256 minimizes engineering effort; S12XE successors minimize supply risk.

Comparison with Alternatives

Parameter This Product MC9S12XDT512MAA MC9S12XDT256CAG MC9S12XET256MAA MC9S12XEQ384CAG
Package 80-QFP (14x14 mm) 80-QFP (14x14 mm) - same 80-QFP - same 80-QFP (14x14 mm) - same 80-QFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Architecture HCS12X 16-bit CISC HCS12X 16-bit CISC HCS12X 16-bit CISC S12XE 16-bit (next generation) HCS12X 16-bit CISC
Max Clock Speed 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
Program Flash 256KB 512KB 256KB 256KB 384KB
Connectivity CAN, LIN, I2C, IrDA, SCI, SPI, EBI/EMI CAN, LIN, I2C, SCI, SPI, EBI/EMI CAN, LIN, SCI, SPI CAN, LIN, SCI, SPI CAN, LIN, SCI, SPI

Key Differentiators

  • Largest on-chip Flash in XD-class 80-QFP option set (vs MC9S12XDT256CAG)
  • Rich connectivity set including IrDA and EBI/EMI (vs MC9S12XET256MAA)
  • Legacy code compatibility advantage (vs S912XET256J2VAG)

Design Notes

The MC9S12XDT256MAA is NRND per NXP's product page. Before committing a new PCB, confirm lifetime supply: either place a last-time-buy covering the product's service life or design in a pin-compatible S12XE successor such as S912XET256J2VAG from the start. NRND parts can transition to obsolete with limited notice, and spot-market stock carries counterfeit risk - source only through authorized or verified distributors.

The device operates from a 5V supply with a 2.5V core-referenced domain per specification listings. Decouple VDD/VDDPLL pins with 0.1uF ceramics placed within 5 mm of each pin, and add 10uF bulk capacitance per power domain. Observe the S12XD datasheet's specified PLL filter network on XFC pins to guarantee stable 80 MHz bus-clock operation; an incorrect loop filter causes jitter and CAN bit-timing errors.

The 80-QFP (14x14 mm) gull-wing package needs a standard 0.5 mm-pitch QFP land pattern per the manufacturer's mechanical drawing. Use thermal relief-free direct connections on VSS pins and a solid ground plane on layer 2 for CAN/LIN signal integrity. Keep CAN transceiver traces short and pair differential routing; route the 80 MHz bus clock away from analog I/O and CAN lines to minimize EMI in automotive harness environments.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Temperature grade is listed as AUTOMOTIVE by distributor data (Partstack). RoHS/REACH/lead-free status were not stated in the captured web data; verify on NXP's product page environmental section.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MC9S12XDT256MAA MC9S12XDT512MAA MC9S12XET256MAA MC9S12XEQ384CAG S912XET256J2VAG HCS12X S12XD family 16-bit microcontroller MCU CISC architecture QFP 80-QFP 14x14 mm surface mount NRND CANbus LINbus SPI PWM watchdog timer automotive multiplexing body control module EBI/EMI
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