MC9SDG128EVPVR2 - 16-Bit 50MHz 128KB Flash MCU 112-LQFP | Freescale/NXP
MPN: MC9SDG128EVPVR2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $21.2 | $2,120.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.75 | $16,750.00 |
MC9SDG128EVPVR2 Overview
Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and programmable peripherals. The CPU12 architecture is an enhanced 16-bit superset of the original Motorola HC11, designed for automotive and industrial real-time control with a BDM (Background Debug Mode) interface, hardware-multiply/divide, and a paged memory model. Within the broader taxonomy, an MCU sits between a microprocessor (which requires external memory) and an SoC (which integrates even more system functions on the same die).
Key features: the 50 MHz core delivers up to 50 MIPS of integer throughput with deterministic interrupt latency, while the integrated 128KB Flash supports in-application programming for field firmware updates. The 112-LQFP (20x20 mm) package exposes enough I/O for multi-channel ADC, PWM, CAN, SPI, and SCI peripherals typical of the S12DG sub-family, and the extended-temperature grade suits under-hood and industrial enclosures.
Technical depth: the S12 architecture uses a 16-bit data path with a 20-bit program counter, supporting a 1MB linear address space with bank-switched Flash pages. Hardware breakpoints, BDM, and on-chip EEPROM emulation via Flash partitioning simplify development, while built-in periodic interrupt timers and a real-time interrupt (RTI) provide OS-free task scheduling for safety-critical automotive ECUs.
Typical applications for this part include automotive body and chassis control modules, CAN/J1850 gateway nodes, instrumentation clusters, HVAC controllers, and industrial sensor-conditioning boards where 16-bit deterministic control outperforms 8-bit MCUs but full 32-bit Cortex-M is unnecessary.
Design consideration: at 50 MHz the core draws significant current transients; place four 100 nF decoupling capacitors as close as possible to the VDD/VSS pin groups and reserve a dedicated ground plane under the 112-LQFP thermal pad for EMC-sensitive CAN bus designs. Boundary-scan is not supported - validate production firmware with a BDM probe on at least one test pad.
This page consolidates current distributor pricing, validated drop-in alternatives from the same S12 family, and practical design notes not duplicated in stock-page listings, helping engineers extend legacy designs without a costly board respin.
Drop-in alternatives for MC9SDG128EVPVR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9SDG128EVPVR2 (same form factor and footprint) — differing in Package, Maximum Clock Frequency, CPU Architecture, ADC Channels, Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S12DJ128CPVE
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View Datasheet →MC9SDT256BCPVR2
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View Datasheet →MC9SXDP512VPVR2
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View Datasheet →MC9S12HZ256CPV
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View Datasheet →MC912DG128AVPV-FR
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View Datasheet →MC9SDG128EVPVR2 Maximum Ratings & Electrical Characteristics
| Core Architecture | CPU12 (HC12) |
| Data Bus Width | 16-Bit |
| Maximum Clock Frequency | 50 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Package | 112-LQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Peripherals | CAN, SPI, SCI, PWM, ADC (per S12DG family) |
| Debug Interface | BDM (Background Debug Mode) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
MC9SDG128EVPVR2 112-lqfp (20x20 mm) Pin Configuration Guide
Pin configuration for MC9SDG128EVPVR2 (112-lqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC9SDG128EVPVR2.
Refer to the datasheet for full pin configuration.
Typical Applications
MC9SDG128EVPVR2 is suitable for 6 applications: Automotive Body Control Module, CAN Gateway and Bus Multiplexer, Industrial HVAC Controller, Instrumentation Cluster, Sensor Conditioning Node, Servo Motor Control.
Automotive Body Control Module
The MC9SDG128EVPVR2's 16-bit CPU12 core at 50 MHz offers deterministic interrupt latency needed for body-control ECUs driving lights, mirrors, and wipers. Its 128KB Flash supports bootloaders and CAN-based diagnostic stacks. The 112-LQFP exposes enough I/O for multi-channel ADC sampling of switch inputs and PWM outputs for motor drivers, with built-in msCAN connecting the module to the vehicle CAN bus without an external protocol engine.
Recommended
CAN Gateway and Bus Multiplexer
In a CAN gateway the MC9SDG128EVPVR2 acts as a software-defined message router between CAN and LIN subnets, with 128KB Flash for routing tables and protocol-conversion firmware. The CPU12's deterministic interrupt latency preserves bus timing, while the on-chip msCAN eliminates the need for an external CAN controller. Place two high-speed CAN transceivers at the bus edges for dual-channel routing, with the MCU acting as the central protocol bridge.
Recommended
Industrial HVAC Controller
HVAC controllers benefit from the MC9SDG128EVPVR2's 16-bit math for proportional-integral control loops handling temperature, pressure, and airflow. The 128KB Flash holds control algorithms and lookup tables, while the 112-LQFP provides ample PWM channels to drive variable-speed fan motors and damper actuators. The CPU12's hardware divider accelerates fixed-point math without taxing the 50 MHz core, and the extended-temperature grade supports attic and rooftop installations.
Recommended
Instrumentation Cluster
Instrument clusters need a 16-bit controller that can refresh multi-segment LCD or LED displays while reading analog sensor inputs. The MC9SDG128EVPVR2's on-chip ADC, PWM, and 128KB Flash support gauge-sweep drivers and CAN-based message decoding from the engine ECU. Its -40C to +125C temperature grade suits the cabin-to-engine-bay thermal range, and the 112-LQFP gives designers the I/O margin to attach LED drivers and stepper-motor drivers for needle movements.
Recommended
Sensor Conditioning Node
Distributed industrial sensor nodes use the MC9SDG128EVPVR2 to acquire analog signals from pressure, flow, or position sensors and translate them into CAN or RS-232 outputs. The 16-bit CPU executes digital filtering (FIR/IIR) in software at 50 MHz, the 128KB Flash stores calibration tables, and the 112-LQFP exposes many ADC channels for multi-sensor aggregators. Its low-latency interrupts let the firmware react to over-threshold events within microseconds.
Recommended
Servo Motor Control
Brushless-DC and stepper servo loops require precise PWM with deterministic interrupt response, which the MC9SDG128EVPVR2 delivers through its 16-bit CPU12 core and on-chip PWM generators. The 128KB Flash stores field-oriented control firmware, while the 112-LQFP exposes enough I/O to drive three-phase inverter gate drivers and read quadrature encoders. The built-in CAN enables real-time servo tuning over the bus, and the -40C to +125C temperature grade supports motion-control cabinet environments.
Recommended
Recommended Products Summary
Engineering reference data for MC9SDG128EVPVR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12DJ128CPVE | MC9SDG256BCFUR2 | MC9SDT256BCPVR2 | MC9SXDP512VPVR2 | MC9S12HZ256CPV | MC912DG128AVPV-FR |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same |
| Flash Size | 128 KB | 128 KB | 256 KB | 256 KB | 512 KB | 256 KB | 128 KB |
| Maximum Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz | 50 MHz | 50 MHz |
| Core Architecture | CPU12 (16-bit) | CPU12 (16-bit) | CPU12 (16-bit) | CPU12 (16-bit) | CPU12 + XGATE (16-bit) | CPU12 (16-bit) | CPU12 (16-bit) |
| CAN Controller | msCAN (CAN 2.0 A/B) | msCAN (CAN 2.0 A/B) | msCAN (CAN 2.0 A/B) | msCAN (CAN 2.0 A/B) | msCAN (CAN 2.0 A/B) | msCAN (CAN 2.0 A/B) | msCAN (CAN 2.0 A/B) |
| Debug Interface | BDM | BDM | BDM | BDM | BDM | BDM | BDM |
Key Differentiators
- Established S12DG mainstream sub-family for automotive ECUs (vs MC9S12HZ256CPV)
- 128KB Flash hits the sweet spot between 64KB and 256KB S12 parts (vs MC9SDG256BCFUR2)
- Lower pin/BOM redundancy than SXDP512 XGATE-enabled variants (vs MC9SXDP512VPVR2)
Design Notes
The MC9SDG128EVPVR2 supplies its core from VDDR (2.5V regulator output) and its I/O from VDD5 (5V). Place four 100 nF decoupling capacitors adjacent to VDD/VSS pin groups and reserve a continuous ground plane under the 112-LQFP thermal pad. Add a bulk 10 uF tantalum plus 100 nF ceramic on VDDR to keep the on-chip regulator stable under dynamic CPU load. Estimated: at 50 MHz CPU activity the core current peaks near the tens of mA; populate all VDD/VSS pin pairs even if the datasheet indicates internal tie-off, as floating pins risk ESD during reflow.
Route the EXTAL/XTAL crystal traces as short, symmetric stubs within 10 mm of the MCU and guard them with a ground ring to prevent EMI coupling into the PLL. The BDM header must reach BKGD, GND, RESET, and VDD; add a 4-pin 2.54 mm test-pad array for in-system firmware updates. Keep CANH/CANL differential pair matched within 5 mm and avoid routing near the 50 MHz oscillator traces.
Do not assume legacy MC912 (pre-S12) peripheral registers map identically to S12DG; a firmware port from MC912DG128AVPV must verify the ADC, PWM, and TIM channels against the MC9SDG128 register map. Pull RESET high through 10 kohm after power-up to avoid spurious resets, and confirm the PLL filter network (XFC pin capacitor of 1 nF to 10 nF) per the device datasheet. Background-debug is not bond-out, so production test must rely on BDM rather than scan.
Compliance Information
RoHS and lead-free compliance inferred from distributor product description. AEC-Q100 grade and halogen-free status require verification against the device-specific NXP material declaration.
