NXP Semiconductors

MCF5212LCVM66 - ColdFire V2 66MHz 256KB Flash MCU | NXP

MPN: MCF5212LCVM66 ✗ End of Life
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3.3 V Vdss 81-MAPBGA (10x10 mm) Package 66 MHz Speed 256 KB (256K x 8) Memory
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Price updated: 2026-10-18
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MCF5212LCVM66 Overview

The NXP Semiconductors MCF5212LCVM66 is a 32-bit microcontroller based on the ColdFire V2 (MCF521x) core, operating at 66 MHz with 256 KB of embedded flash memory, 32 KB of SRAM, and a 3.3 V supply, housed in an 81-pin MAPBGA (10x10 mm) package.

A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals such as timers, serial interfaces, and analog-to-digital converters on one die. Within the semiconductor hierarchy, the MCF5212 belongs to the embedded processor family descended from the Motorola 68000 architecture, which NXP (formerly Freescale Semiconductor) continues under the ColdFire brand. MCUs like this one sit at the device level of embedded systems, coordinating sensors, actuators, and communication links in industrial and consumer products.

Key features of the MCF5212 include cost-effective, low-power single-chip operation with up to 521 KB of near-single-access, interleaved and securable embedded flash memory across the MCF521X family. According to NXP product data, the device integrates DMA, I2C, LVD (low-voltage detect), POR (power-on reset), PWM, and watchdog timer (WDT) peripherals, providing the building blocks for autonomous embedded control without external glue logic.

On the technical side, the ColdFire V2 core executes a variable-length RISC instruction set that delivers strong code density and mature toolchain support through the CodeWarrior development environment. Three UARTs enable medium-to-long-distance serial communication, while SPI and I2C interfaces handle board-level connectivity to sensors, EEPROMs, and displays. The 256 KB on-chip flash supports in-system programming, and the 32 KB SRAM accommodates stack, heap, and real-time data buffers for typical control loops.

Typical applications include industrial control panels, building automation nodes, motor control front-ends, and legacy system maintenance where ColdFire code bases must be preserved. The 81-MAPBGA footprint suits compact, two-sided PCB assemblies requiring a high pin count in a 10x10 mm body.

A key design consideration is lifecycle status: NXP has designated the MCF5212LCVM66 as NRND (Not Recommended for New Designs), so new projects should evaluate the MCF5213 or migrate to supported families, while existing designs can continue sourcing for production maintenance. Verify temperature grade and ordering suffix compatibility before substitution.

This page synthesizes distributor pricing context, drop-in alternatives, practical design notes, and lifecycle guidance not consolidated in the manufacturer datasheet, helping engineers make sourcing decisions faster.

Drop-in alternatives for MCF5212LCVM66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCF5212LCVM66 (same form factor and footprint) — differing in Package, DMA Channels, Core Architecture, Supply Voltage, Mounting Type.

NXP Semiconductors
Package: 64-pin LQFP (10x10 mm)
DMA Channels: 4
Core Architecture: ColdFire V2 (32-bit)
Compare with MCF5212LCVM66 →
NXP Semiconductors
DMA Channels: 4
Core Architecture: ColdFire V2 (32-bit)
Compare with MCF5212LCVM66 →
NXP Semiconductors
DMA Channels: 4 x 32-bit
Core Architecture: ColdFire V2 (32-bit RISC, 68000-derived)
Mounting Type: Surface Mount (BGA)
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NXP Semiconductors
Package: 100-LQFP (14x14 mm)
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NXP Semiconductors
DMA Channels: 4-channel 32-bit DMA
Supply Voltage: 3.0 V to 3.6 V (3.3 V typical)
Mounting Type: Surface Mount (BGA)
Compare with MCF5212LCVM66 →
NXP Semiconductors
Package: 81-MAPBGA (10 mm x 10 mm)
DMA Channels: 4 (32-bit)
Core Architecture: ColdFire V2 (32-bit Variable-Length RISC)
Compare with MCF5212LCVM66 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MCF5212LCVM66J

✅ Drop-In
NXP Semiconductors
📦 81-MAPBGA (10x10)
ColdFire V2 (32-bit) · 66 MHz · 256 KB Flash · 81-MAPBGA (10x10 mm) · 3.0 V to 3.6 V · 3.3 V · 3

✓ In Stock

$9.88 / Unit

View Datasheet →

MCF5212LCVM66-NXP

✅ Drop-In
📦 81-MAPBGA (10x10)
Rochester Electronics authorized aftermarket re-mark of the same NXP die - identical specifications, alternate supply channel

📋 Reference alternative (not in catalog)

MCF5213LCVM66J

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 81-MAPBGA (10x10)
ColdFire V2 (32-bit Variable-Length RISC) · 66 MHz · 256 KB (256K x 8), interleaved, securable · 32 KB · 3.0 V to 3.6 V · -40C to +85C (industrial, J suffix JEDEC) · 81-MAPBGA (10 mm x 10 mm) · Surface Mount (BGA)

✓ In Stock

$12.2 / Unit

View Datasheet →

MCF5213CAF66

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 81-MAPBGA (10x10)
ColdFire V2 · 32-Bit · 66 MHz · 256 KB (256K x 8) · MCF521x (KIRIN) · 100-LQFP (14x14 mm) · Surface Mount · RISC (ColdFire, 68K-derived)

✓ In Stock

$19.82 / Unit

View Datasheet →

MCF5212LCVM66 Maximum Ratings & Electrical Characteristics

Core Processor ColdFire V2 (MCF521x)
Core Size 32-Bit
Maximum Clock Frequency 66 MHz
Flash Memory 256 KB (256K x 8)
SRAM 32 KB
Supply Voltage 3.3 V
Package 81-MAPBGA (10x10 mm)
Number of Pins 81
Mounting Type Surface Mount
Peripherals DMA, LVD, POR, PWM, WDT
Interfaces I2C, SPI, UART, USART
Number of UARTs 3
Product Family MCF521x KIRIN (MCF521X)
Family Flash Range Up to 521 KB (MCF521X family)
Packaging Tray

MCF5212LCVM66 81-mapbga (10x10 mm) Pin Configuration Guide

Pin configuration for MCF5212LCVM66 (81-mapbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

81-mapbga (10x10 mm) package pinout diagram for MCF5212LCVM66

No detailed pinout data available for MCF5212LCVM66.

Refer to the datasheet for full pin configuration.

Typical Applications

MCF5212LCVM66 is suitable for 6 applications: Industrial Control Panels, Building Automation Nodes, Motor Control Front-Ends, Legacy System Maintenance, Embedded Communication Gateways, Test and Measurement Instrumentation.

🏭

Industrial Control Panels

The MCF5212LCVM66 fits industrial control panel controllers where deterministic serial networking and supervisory functions dominate. Its 66 MHz ColdFire V2 core executes Modbus RTU frames on three UARTs while the integrated watchdog timer guarantees recovery from field-induced lockups, and low-voltage detect plus power-on reset provide predictable boot behavior on electrically noisy factory floors. The PWM module drives contactors, dampers, and small actuators directly with minimal CPU load thanks to the DMA controller. The 81-MAPBGA 10x10 mm package keeps controller PCBs compact for DIN-rail mounting. With 256 KB flash, the part stores protocol stacks, ladder-interpreter code, and calibration tables; the NRND status means this fits best in sustaining programs maintaining validated panel designs rather than new panel platforms.

🧩

Building Automation Nodes

Building automation controllers benefit from the MCF5212LCVM66's three UART channels, which natively map to RS-485 BACnet MS/TP or Modbus field buses connecting thermostats, dampers, and sensor loops. The I2C and SPI interfaces attach environmental sensors and EEPROMs for configuration storage, while the DMA engine offloads serial transfers so the 66 MHz core sustains scheduling of multiple networked zones. The 32 KB SRAM holds point tables and trend logs typical of small nodes, and 256 KB flash leaves room for OTA-style field update loaders. Low power consumption supports unattended operation, and the securable flash protects proprietary control algorithms. As the part is NRND, it is best suited to maintaining installed automation fleets with validated MCF5212 firmware rather than new node designs.

⚙️

Motor Control Front-Ends

The MCF5212LCVM66 serves as a supervisor and communication front-end in small motor drive systems. Its hardware PWM outputs generate gate or speed-command signals while the DMA keeps UART traffic - setpoint commands over Modbus, status telemetry - flowing without CPU intervention on the 66 MHz ColdFire V2 core. The watchdog timer enforces fail-safe shutdown if firmware hangs, a critical safety behavior in rotating equipment. Three UARTs let one MCU service a drive, an HMI, and a field bus simultaneously. The 256 KB flash holds PI-loop tuning tables, fault logs, and protocol stacks within the 32 KB SRAM working set. Because the device lacks a high-resolution ADC on this suffix, pair it with external sensing or a family member with richer analog, and note NRND status limits new drive platforms.

🔧

Legacy System Maintenance

The primary ongoing role of the MCF5212LCVM66 is keeping fielded ColdFire-based systems alive - medical lab instruments, test fixtures, and industrial equipment designed in the Freescale era. The part's value here is binary compatibility: existing CodeWarrior projects and validated firmware re-run unchanged, avoiding the compiler, driver, and RTOS porting cost of an ARM migration. Authorized channels such as Rochester Electronics (listed as MCF5212LCVM66-NXP at DigiKey Marketplace) provide aftermarket supply, and the suffix variant MCF5212LCVM66J offers an identical die for BOM continuity. Engineers should secure lot-consistent buffer stock given NRND status, track NXP product change notices, and plan a final-time-buy horizon so end-of-life does not strand service inventory.

🌐

Embedded Communication Gateways

Protocol gateway designs use the MCF5212LCVM66 to translate between serial networks - its three UARTs simultaneously terminate a Modbus field bus, an RS-232 service port, and a device-level link, while SPI connects to CAN or Ethernet offload controllers via SPI-to-network bridges. The 66 MHz core sustains tens of thousands of small frames per second, and the DMA controller buffers traffic so the CPU focuses on protocol state machines. Low-voltage detect guards data integrity during brownouts common in industrial cabinets, and the securable flash region protects configuration credentials. The 81-MAPBGA package's 10x10 mm footprint suits gateway DIN-rail and DIN-rail-adjacent form factors. Target sustaining gateway programs here; NRND status makes the part inappropriate for new gateway platforms.

🖥️

Test and Measurement Instrumentation

Bench and portable instruments use the MCF5212LCVM66 as a control engine managing front-panel interfaces, calibration storage, and host communication. The SPI and I2C buses configure precision data converters and programmable gain stages, while a UART provides SCPI-style command links to PCs. The 256 KB securable flash protects factory calibration constants and firmware IP; the DMA supports continuous data streaming into the 32 KB SRAM buffer. Deterministic ColdFire V2 timing at 66 MHz keeps measurement sequencing jitter low, and the watchdog guarantees instrument recovery during host-driven stress tests. The 81-MAPBGA package integrates cleanly into multi-layer instrument main boards. Given NRND status, the part suits maintenance of qualified instruments where re-certification cost makes board redesign uneconomical.

What is the MCF5212LCVM66 microcontroller?
The MCF5212LCVM66 is a 32-bit microcontroller from NXP Semiconductors based on the ColdFire V2 core, running at 66 MHz with 256 KB of embedded flash and 32 KB of SRAM in an 81-pin MAPBGA (10x10 mm) package. According to NXP product data, it integrates DMA, PWM, watchdog timer, low-voltage detect, and power-on reset peripherals, with I2C, SPI, and UART communication interfaces. The part is currently designated NRND, meaning it is not recommended for new designs but remains sourced for existing production.
What is the operating frequency and flash size of MCF5212LCVM66?
The MCF5212LCVM66 operates at a maximum core frequency of 66 MHz and contains 256 KB (256K x 8) of embedded flash memory plus 32 KB of SRAM. According to DigiKey product data, the ColdFire V2 core delivers single-cycle access to interleaved flash. Within the broader MCF521X family, flash capacity extends up to 521 KB for applications needing more code space, so designers can scale within the same architecture if 256 KB becomes insufficient.
What is the difference between MCF5212LCVM66 and MCF5212LCVM66J?
The MCF5212LCVM66J is the same die, core, memory configuration, and 81-MAPBGA package as the MCF5212LCVM66; according to the Xecor comparison database, no measurable differences were detected across the primary technical parameters. The suffix generally denotes a lead-finish or temperature-grade ordering variant rather than a functional change. Either part can serve as a drop-in replacement for the other in existing MCF5212 designs, but confirm the exact suffix requirement of your PCB assembly documentation and any customer qualification constraints before ordering.
Is MCF5212LCVM66 still in production?
The MCF5212LCVM66 is designated NRND (Not Recommended for New Designs) by NXP Semiconductors according to the official NXP product page. This means NXP no longer recommends it for new designs and may eventually move it to end-of-life, but the part may still be orderable through authorized distributors or the aftermarket. Engineers with active production should plan a migration path, while new designs should select the MCF5213 or a currently supported NXP MCU family. Monitor NXP product change notices for lifecycle updates.
What is the best drop-in replacement for MCF5212LCVM66?
The closest drop-in replacements are MCF5212LCVM66J (identical die, package, and parameters - the J suffix variant) and MCF5213LCVM66J, which shares the same 81-MAPBGA footprint and ColdFire V2 core but doubles flash to 512 KB. Rochester Electronics also lists MCF5212LCVM66-NXP as an authorized aftermarket source per DigiKey Marketplace data. For same-footprint upgrades, the MCF5213 variant is preferred because it is software-forward-compatible; verify flash size mapping and any errata differences before reflowing onto an existing board.
Where can I download the MCF5212LCVM66 datasheet PDF?
The MCF5212LCVM66 datasheet is available from the official NXP product page at nxp.com/part/MCF5212LCVM66 under the Data Sheet section. Mirror copies exist on aggregator sites such as Alldatasheet (a Freescale Semiconductor document) and FindIC, which lists a 977 KB document published 2007-02-06. Because Freescale was acquired by NXP, always prefer the nxp.com-hosted document for the latest revision and errata. The datasheet covers the full MCF5213/MCF5212 ColdFire integrated microcontroller family.
Where can I buy MCF5212LCVM66 and what is the price?
The MCF5212LCVM66 can be ordered through DigiKey (ships same day when in stock), Mouser, and independent distributors such as Xecor and Jaron Semiconductor, which offer BOM-quantity sourcing quotes and lead-time checks. Octopart tracks pricing from 5 distributors for this part. Because the device is NRND, authorized stock is limited and price breaks vary significantly with availability; as of 2026-10-18, XAIPART lists this part on a quote basis. Request a formal quotation with your target quantity for current pricing.
What is the lead time for MCF5212LCVM66?
Lead time for the NRND-status MCF5212LCVM66 depends on distributor stock rather than factory production schedules. DigiKey indicates ships-today availability when inventory exists, while aftermarket sources like Xecor and Jaron Semiconductor quote lead times on a BOM-quantity basis, typically ranging from a few days for stock to several weeks for allocated lot sourcing. Because NXP production is winding down, request lead-time confirmation with every order and consider buffer stock if your program extends beyond 12 months. Never assume factory-fresh lead times for NRND parts.
MCF5212LCVM66 vs MCF5213LCVM66J - which should I choose?
Choose the MCF5213LCVM66J for new PCB spins or long-lived programs: it shares the same 81-MAPBGA footprint and ColdFire V2 66 MHz core but provides 512 KB flash versus 256 KB, giving headroom for future code growth. Choose the MCF5212LCVM66 only to maintain binary compatibility with an existing validated 256 KB design, since re-qualification cost may outweigh flash benefits on legacy boards. The MCF5213 also carries additional CAN and USB capabilities on some family members per the MCF5213 datasheet, so check peripheral requirements before committing.
When should I choose MCF5212LCVM66 over a modern ARM MCU?
Choose the MCF5212LCVM66 when you must preserve an existing ColdFire code base, toolchain investment, or qualified hardware design - porting legacy 68K/ColdFire firmware to ARM Cortex-M involves compiler, peripheral-driver, and RTOS changes that cost more than the silicon savings. For genuinely new designs, a modern ARM Cortex-M4/M7 NXP MCU offers lower power, better availability, and long-term supply guarantees, especially given the NRND status of this part. The MCF5212 makes sense as a maintenance bridge, not a foundation for future development.
Is the MCF5212LCVM66 suitable for industrial control applications?
Yes, the MCF5212LCVM66 is well suited to industrial control: its integrated PWM module drives motors and actuators, the watchdog timer provides fault recovery, and low-voltage detect plus power-on reset ensure predictable startup on noisy factory floors. The three UARTs support Modbus RTU links to PLCs and drives, while SPI and I2C connect to industrial sensors and isolated transceivers. The 66 MHz ColdFire V2 core handles deterministic control loops, and the 81-MAPBGA 10x10 mm package fits compact industrial PCB assemblies. Verify the temperature grade suffix matches your ambient requirements.
What peripherals does the MCF5212LCVM66 include?
According to distributor catalog data, the MCF5212LCVM66 integrates DMA, PWM, watchdog timer (WDT), low-voltage detect (LVD), and power-on reset (POR) peripherals, along with I2C, SPI, UART, and USART communication interfaces. The UART block provides three independent serial channels for medium-to-long-distance communication per the NXP MCF521X family description. On-chip resources include 256 KB of securable, interleaved flash and 32 KB of SRAM. This peripheral set covers typical embedded control needs - serial networking, motor/timing PWM outputs, and supervisory functions - without external support ICs.
What are the key specifications of MCF5212LCVM66 engineers should know?
The essential specifications are: 32-bit ColdFire V2 core at 66 MHz; 256 KB embedded flash (256K x 8) with 32 KB SRAM; 3.3 V supply; 81-pin MAPBGA package measuring 10x10 mm; peripherals including DMA, PWM, WDT, LVD, and POR; and I2C, SPI, and UART interfaces with three UART channels. The device belongs to the MCF521x KIRIN family and carries NRND lifecycle status as of NXP's current product page. These figures come from DigiKey and NXP verified product data.
What NXP equivalent can replace MCF5212LCVM66?
The best NXP equivalent is the MCF5213LCVM66J, a same-family, same-81-MAPBGA-footprint part with 512 KB flash and identical 66 MHz ColdFire V2 core - effectively a firmware-compatible upgrade. The MCF5212LCVM66J is the exact-equivalent variant differing only in ordering suffix, and Rochester Electronics supplies MCF5212LCVM66-NXP as an authorized aftermarket channel. No cross-brand pin-compatible replacement exists for ColdFire parts because the architecture is proprietary to Motorola/Freescale/NXP; any alternative from another vendor requires a board redesign, not a drop-in swap.
What package does the MCF5212LCVM66 use and what are its PCB layout considerations?
The MCF5212LCVM66 uses an 81-ball MAPBGA (Molded Array Process Ball Grid Array) package measuring 10x10 mm with a 0.8 mm ball pitch typical for this family. PCB layout requires a matching 81-pad BGA land pattern with via-in-pad or dogbone fanout on the inner grid, controlled-impedance routing is not mandatory at 66 MHz but short, direct traces to flash and crystal help signal integrity. Recommend a solid ground plane under the die, decoupling capacitors on each supply ball, and reflow profile per NXP application notes for BGA assemblies.

Engineering reference data for MCF5212LCVM66 — comparison, design guidance, and compliance information.

Selection Guide

Choose the MCF5212LCVM66 only when sustaining an existing validated ColdFire design: it preserves CodeWarrior firmware binary compatibility and qualified hardware with zero board changes. If your BOM allows a suffix change, the MCF5212LCVM66J is the safest sourcing hedge - verified identical parameters on the same die. When code space is tight or programs run long, step to the MCF5213LCVM66J: same 81-MAPBGA footprint and 66 MHz ColdFire V2 core with 512 KB flash, requiring only a flash-map review. The MCF5213CAF66 suits designs needing the same family at a different grade suffix. For genuinely new designs, avoid this NRND family entirely and select a supported ARM Cortex-M based NXP MCU - long-term supply, toolchain support, and power efficiency all favor ARM. No cross-brand drop-in exists because ColdFire is proprietary to NXP.

Comparison with Alternatives

Parameter This Product MCF5212LCVM66J MCF5212LCVM66-NXP MCF5213LCVM66J MCF5213CAF66
Package 81-MAPBGA (10x10 mm) 81-MAPBGA (10x10 mm) - same 81-MAPBGA (10x10 mm) - same 81-MAPBGA (10x10 mm) - same 81-MAPBGA (10x10 mm) - same family footprint
Brand NXP Semiconductors NXP Semiconductors NXP (Rochester Electronics aftermarket) NXP Semiconductors NXP Semiconductors
Core ColdFire V2 (MCF521x) ColdFire V2 - identical ColdFire V2 - identical ColdFire V2 - identical ColdFire V2 - identical
Max Frequency 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz
Flash Memory 256 KB 256 KB 256 KB 512 KB 256 KB
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V

Key Differentiators

  • Identical-die sourcing flexibility (vs MCF5212LCVM66J)
  • Flash upgrade headroom in the same footprint (vs MCF5213LCVM66J)
  • Aftermarket availability channel (vs MCF5212LCVM66-NXP (Rochester Electronics))

Design Notes

The 81-MAPBGA (10x10 mm) uses a fine-pitch ball grid requiring an exact NXP-recommended land pattern with dogbone or via-in-pad fanout on the interior grid. Place a solid, unbroken ground plane on layer 2 directly beneath the die to reference all signal returns and help thermal spreading. Distribute 100 nF ceramic decoupling capacitors across the supply ball cluster, one per pair of power/ground balls, with bulk 10 uF near the regulator. Follow NXP BGA reflow application notes - BGA rework is costly, so verify land pattern against the datasheet before PCB fabrication.

The part is NRND: do not start new designs on MCF5212LCVM66. Before ordering, confirm the exact ordering suffix - the J-suffix variant differs in lead finish/grade and purchasing the wrong suffix can invalidate customer qualifications. When substituting MCF5213 for MCF5212, remap flash addresses if linker scripts hardcode 256 KB boundaries; the larger 512 KB flash changes the reset configuration area. Also program the write-protection and security bits deliberately - the family flash is securable, and an accidental mass-erase protection can lock field units.

Run the device at 3.3 V with clean sequencing relative to any external flash, transceivers, or ADCs on the board. The integrated power-on reset and low-voltage detect peripherals provide brownout protection, but set LVD trip thresholds appropriate for your supply rail tolerance. Estimated: check total I/O loading when budgeting supply current, since 3.3 V GPIO drive into RS-485 terminations and LED indicators can dominate the budget relative to core current at 66 MHz. Follow the MCF521x datasheet power section for exact numbers rather than assuming family-typical values.

At 66 MHz core frequency, keep crystal and clock traces short, guarded by ground, and away from UART/RS-485 switching lines. For the three UART channels driving long cables, place transient protection and proper isolation (optocouplers or digital isolators) on RS-485/RS-232 transceiver lines, since industrial environments inject surges beyond MCU absolute maximum ratings. Route BGA fanout breakout traces symmetrically to avoid skew on parallel-addressed external buses if used, and reserve test points on the JTAG/debug balls - ColdFire BDM access is essential since reflowed BGA packages cannot be probed directly.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data was not stated in the verified web results. Consult the official NXP product page (Environmental Quality section) for RoHS/REACH status of this exact ordering code.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MCF5212LCVM66 MCF5212LCVM66J MCF5213LCVM66J MCF5213CAF66 MCF52252CAF66 MCF5280CVM66J ColdFire V2 MCF521x KIRIN family microcontroller embedded processor 32-bit MCU MAPBGA 81-MAPBGA (10x10) NRND I2C SPI UART PWM DMA watchdog timer CodeWarrior Rochester Electronics
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