MCF5213LCVM66 - ColdFire V2 32-bit MCU, 66MHz, 256KB Flash | NXP
MPN: MCF5213LCVM66 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.9 | $1,490.00 |
| 500 | $13.25 | $6,625.00 |
| 1,000 | $11.95 | $11,950.00 |
MCF5213LCVM66 Overview
What is a ColdFire microcontroller? ColdFire is a 32-bit reduced instruction set computing (RISC) architecture derived from the Motorola 68000 family. ColdFire V2 (also called V2 core) is the entry-tier ColdFire core that combines a variable-length instruction set with 32-bit internal data paths, positioning it between traditional 8/16-bit MCUs and higher-end ColdFire V3/V4 cores in the power/performance hierarchy. Within the broader taxonomy, ColdFire sits as a 32-bit MCU -> microcontroller -> embedded processor -> semiconductor category, competing with ARM Cortex-M3 devices in cost-sensitive industrial designs.
Key features of the MCF5213LCVM66 include three UARTs for serial communication, a 10/100 Ethernet MAC (FEC) for networked embedded designs, an I2C interface, a queued SPI module, a 4-channel 32-bit DMA controller, two analog comparators, a 12-bit ADC (on select family members), and a 4-channel 32-bit general-purpose timer. The part operates from a 3.0V to 3.6V supply and integrates a phase-locked loop (PLL) for flexible clock generation. Security features include flash protection and a hardware random-number generator on certain variants.
Technical depth: The ColdFire V2 core delivers up to 56 Dhrystone MIPS at 66 MHz while consuming relatively modest power for a 32-bit MCU. The 256 KB flash is interleaved for higher throughput and supports byte, word, and long-word programming with hardware security. The integrated FEC (Fast Ethernet Controller) and external PHY interface enable deterministic networked embedded designs without an external MAC chip, a notable integration benefit over competitor MCUs in this class.
Typical applications for the MCF5213LCVM66 include industrial control and factory automation nodes, building automation controllers, networked sensor hubs, point-of-sale terminals, low-cost Ethernet-connected embedded devices, and HVAC control modules. The wide peripheral mix also suits motor control and general-purpose 32-bit embedded designs transitioning from 8/16-bit MCUs.
Design consideration: Because this part is now in NXP's NRND (Not Recommended for New Designs) lifecycle, engineers should plan long-term production on the same family with verified continuity stock or migrate to a current ColdFire / Kinetis successor. Verify BGA PCB manufacturing capability (laser-via or via-in-pad) before committing to layout.
This page synthesizes distributor pricing, lifecycle status, drop-in same-package alternatives, and practical design notes not aggregated on the manufacturer product page.
Drop-in alternatives for MCF5213LCVM66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5213LCVM66 (same form factor and footprint) — differing in Package, DMA Channels, Supply Voltage, Mounting Type, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF5213LCVM66J
✅ Drop-In✓ In Stock
$12.2 / Unit
View Datasheet →MCF5212LCVM66
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MCF5212LCVM66J
✅ Drop-In✓ In Stock
$9.88 / Unit
View Datasheet →MCF5213LCVM66 Maximum Ratings & Electrical Characteristics
| Core | ColdFire V2 (MCF521x family) |
| Data Bus Width | 32-bit |
| Maximum Clock Speed | 66 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 32 KB |
| Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) |
| Package | 81-MAPBGA (10x10 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +85C (industrial) |
| Communication Interfaces | 3x UART, 1x I2C, 1x QSPI, 1x Ethernet MAC (FEC) |
| DMA Channels | 4-channel 32-bit DMA |
| Timers | 4-channel 32-bit general-purpose timer |
| Ethernet | 10/100 Mbps Fast Ethernet Controller (FEC) |
| MSL Level | 3 (per BGA handling guidance) |
| Lifecycle | NRND (Not Recommended for New Designs) |
MCF5213LCVM66 81-mapbga (10x10 mm) Pin Configuration Guide
Pin configuration for MCF5213LCVM66 (81-mapbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5213LCVM66.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5213LCVM66 is suitable for 6 applications: Industrial Control / Factory Automation Nodes, Building Automation Controllers, Networked Sensor Hubs / IoT Gateways, Point-of-Sale (POS) Terminals, Low-Cost Ethernet-Connected Embedded Devices, HVAC Control Modules.
Industrial Control / Factory Automation Nodes
The MCF5213LCVM66 fits industrial control nodes where its -40C to +85C industrial temperature range, integrated Ethernet MAC, and three UARTs combine to support field-bus gateways, PLC sub-modules, and sensor hubs. The ColdFire V2 core delivers 56 MIPS at 66 MHz - enough for deterministic Modbus TCP, EtherNet/IP slave, or PROFINET stacks. Compared to adding an external MAC chip on a smaller MCU, the integrated FEC reduces PCB area and BOM cost while keeping 256 KB of flash available for protocol libraries and OEM application code.
Recommended
Building Automation Controllers
Building automation systems (HVAC, lighting, access control) benefit from the MCF5213LCVM66's mix of Ethernet for BACnet/IP or LonWorks over IP, three UARTs for legacy RS-485 sensor busses, and 32 KB SRAM for buffering telemetry. The 256 KB flash holds a BACnet stack plus custom control firmware. The 81-MAPBGA package at 10x10 mm allows compact controller boards, and the deterministic ColdFire V2 core simplifies timing analysis for control loops with sub-second response requirements.
Recommended
Networked Sensor Hubs / IoT Gateways
For IoT gateways aggregating multiple sensor busses, the MCF5213LCVM66's combination of an integrated 10/100 Ethernet MAC and three UARTs is particularly efficient: the MAC uplinks to the network while the UARTs collect downstream sensor data. The 4-channel 32-bit DMA offloads high-throughput data movement, freeing the ColdFire V2 core for application logic. At 3.3 V typical supply and modest power draw, the part suits always-on gateway designs that must run reliably in field-deployed enclosures.
Recommended
Point-of-Sale (POS) Terminals
POS terminals need a 32-bit MCU with Ethernet (for back-office sync), multiple UARTs (for barcode scanners, receipt printers, payment PIN pads), and enough flash for application and security code. The MCF5213LCVM66 covers all three with 256 KB flash and the integrated FEC. The ColdFire V2 core handles UI rendering and transaction crypto in parallel with DMA-driven peripheral traffic. The 81-MAPBGA 10x10 mm package supports slim terminal form factors common in retail hardware.
Recommended
Low-Cost Ethernet-Connected Embedded Devices
Any cost-sensitive Ethernet-enabled embedded design (print servers, networked sensors, IP-enabled appliances) benefits from the MCF5213LCVM66's integrated FEC, which removes the need for an external MAC chip and reduces BOM cost. An external MII/RMII PHY completes the Ethernet interface. The 256 KB flash supports TCP/IP stacks such as lwIP or NXP's own ColdFire TCP/IP lite. The ColdFire V2 core at 66 MHz delivers sufficient throughput for typical embedded IP traffic.
Recommended
HVAC Control Modules
HVAC controllers combine sensor I/O, motor/valve actuator PWM, and network connectivity for building management systems. The MCF5213LCVM66's three UARTs handle sensor busses and the integrated Ethernet MAC supports BACnet/IP or Modbus TCP to the building management system. The 32 KB SRAM and 256 KB flash accommodate control algorithms and network stacks. The industrial temperature range matches HVAC equipment environments (boiler rooms, rooftops, mechanical closets).
Recommended
Recommended Products Summary
Engineering reference data for MCF5213LCVM66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF5213LCVM66J | MCF5212LCVM66 | MCF5212LCVM66J |
|---|---|---|---|---|
| Package | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) - same | 81-MAPBGA (10x10 mm) - same | 81-MAPBGA (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Clock Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Size | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM Size | 32 KB | 32 KB | 32 KB | 32 KB |
| Ethernet MAC (FEC) | Yes (10/100) | Yes (10/100) | No | No |
| UARTs | 3 | 3 | 3 | 3 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Integrated 10/100 Ethernet MAC on-chip (vs MCF5212LCVM66)
- Refreshed die revision available as drop-in (vs MCF5213LCVM66J)
- Mature ColdFire V2 ecosystem with documented TCP/IP stacks (vs Smaller 8/16-bit MCUs)
Design Notes
The 81-MAPBGA package requires either laser-via or via-in-pad PCB technology for reliable second-level interconnection. Standard through-via PCBs will not work. Allocate at least 4 PCB layers with continuous ground planes under the BGA for thermal spreading and signal return paths. Follow NXP's BGA land-pattern recommendations exactly - non-standard land patterns cause head-in-pillow defects during reflow.
Place the external MII/RMII PHY within 50 mm of the MCF5213LCVM66's Ethernet MAC pins and route MII/RMII traces with matched lengths and controlled 50-ohm impedance. Keep PHY clock traces short and shielded with ground. The integrated FEC drives the MII bus at 25 MHz (for 10/100), so route the MII signals as a matched-length bus. Decouple each AVDD/AVSS pair (analog supply) with a 100 nF ceramic capacitor placed within 2 mm of the pin.
Do not assume the MCF5213LCVM66 is recommended for new production. The part is NRND as of 2026-10-17. Engineers planning long-life industrial designs should evaluate current ColdFire successors or NXP Kinetis ARM Cortex-M migration paths now. When reworking BGA packages, use proper BGA rework stations with controlled profile; hand-hot-air rework will damage the laminate. Confirm flash security bits before locking the part in field-deployed designs - locked devices cannot be re-flashed without a mass-erase.
Compliance Information
RoHS / REACH / halogen-free status not present in the verified web data for this part number - defaulting to 'unknown' until confirmed from the NXP material declaration. AEC-Q100 is not_applicable - this is an industrial-grade MCU, not an automotive part.