NXP Semiconductors

MCF5213LCVM80 - ColdFire V2 MCU 80MHz 256KB Flash | NXP 81-MAPBGA

MPN: MCF5213LCVM80 ✗ End of Life
In Stock Ships in 1-3 business days
81-MAPBGA (10 x 10 mm) Package 80 MHz Speed 256 KB (256K x 8) flash Memory
From $9.75 USD / Unit
MOQ: 1 |
Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.2 $162.00
100 $13.85 $1,385.00
500 $11.4 $5,700.00
1,000 $9.75 $9,750.00
ℹ️ All prices are in USD

MCF5213LCVM80 Overview

The NXP MCF5213LCVM80 is a 32-bit ColdFire V2 microcontroller built around the MCF521x family core, integrating 256 KB of on-chip flash and 32 KB of SRAM, packaged in an 81-pin MAPBGA (10 mm x 10 mm). It runs at up to 80 MHz, supplies up to 56 general-purpose I/O lines, and embeds three UARTs, a CAN controller, plus the standard ColdFire peripheral set aimed at cost-sensitive networked and embedded control applications.

What is a ColdFire microcontroller? ColdFire is a 32-bit RISC architecture derived from the original Motorola 68000 family, optimized for embedded systems that need 32-bit data paths, deterministic interrupt response, and rich on-chip peripherals without the cost of a high-MIPS application processor. It sits in the taxonomy as: microcontroller -> 32-bit MCU -> RISC MCU -> ColdFire V2 MCU. The V2 core adds an enhanced multiply-accumulate (EMAC) unit and a hardware divider while keeping the instruction-set compact, which is why MCF5213 parts are still seen in industrial drives, factory automation, and POS terminal designs.

Key features that matter on the bench include 256 KB of single-supply flash with security and programmable partitioning, 32 KB of static RAM for stack and data, an integrated CAN 2.0B controller for industrial networking, and three independent UARTs that simplify RS-232/RS-485 bridges or debug-channel multiplexing. The 81-MAPBGA package is a low-profile surface-mount BGA designed to keep trace escape manageable on 4-layer boards while exposing enough I/O for parallel expansion buses and external memory interfaces.

From an architectural standpoint, the MCF5213 uses a Von Neumann-style unified bus between the ColdFire V2 core, flash, SRAM, and peripheral bridges, with a peripheral DMA controller capable of moving data between the UART, CAN, and ADC blocks without CPU intervention. This keeps the CPU free for deterministic control loops at 80 MHz, while the EMAC engine accelerates DSP-style filtering or FFT kernels commonly used in motor-control and instrumentation code.

Typical applications for the MCF5213LCVM80 include industrial CAN nodes, factory automation controllers, building-automation gateways, and human-machine interface (HMI) panels. It is also a fit for legacy point-of-sale terminals, low-end motion-control daughter boards, and any design that needs deterministic UART/CAN communication backed by a familiar ColdFire toolchain.

When designing with this part, plan the BGA escape pattern carefully because 81-MAPBGA at 0.8 mm or 1.0 mm pitch (per the package code 'L' suffix) leaves limited routing channels. Also confirm the lifecycle status with your distributor before committing to a long-life industrial program. This page consolidates current distributor pricing, drop-in upgrade paths within the MCF521x family, and practical design notes not bundled into the manufacturer datasheet.

Drop-in alternatives for MCF5213LCVM80 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCF5213LCVM80 (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Package, Mounting Type, RoHS Status.

NXP Semiconductors
Core Architecture: ColdFire V2 (32-bit RISC, 68000-derived)
Package: 81-MAPBGA (10x10 mm)
Compare with MCF5213LCVM80 →
NXP Semiconductors
Package: 100-LQFP (14 x 14 mm)
Mounting Type: Surface Mount
Compare with MCF5213LCVM80 →
NXP Semiconductors
Core Architecture: ColdFire V2 (32-bit RISC)
Operating Temperature: -40 C to +85 C (TA)
Compare with MCF5213LCVM80 →
NXP Semiconductors
Core Architecture: ColdFire V2 (32-bit RISC, 68000-derived)
Operating Temperature: -40 C to +85 C (industrial)
Package: 81-MAPBGA (10x10 mm)
Compare with MCF5213LCVM80 →
NXP Semiconductors
Core Architecture: ColdFire V2 (32-bit)
Package: 225-MAPBGA (13x13 mm)
RoHS Status: Compliant (per DigiKey listing)
Compare with MCF5213LCVM80 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MCF5213LCVM80J

✅ Drop-In ⚠️ Specs Unverified
📦 81-MAPBGA (10x10)
same die and 81-MAPBGA package, updated silicon revision with minor errata fixes; flash/RAM/CPU identical

📋 Reference alternative (not in catalog)

MCF5212LCVM80

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 81-MAPBGA (10x10)
ColdFire V2 (32-bit RISC, 68000-derived) · 80 MHz · 256 KB (256K x 8) · 16 KB · 3.0 V to 3.6 V · 10/100 Mbps FEC (Fast Ethernet Controller) · FlexCAN (CAN 2.0b) · 3

✓ In Stock

$11.5 / Unit

View Datasheet →

MCF5213CAF80

✅ Drop-In
NXP Semiconductors
📦 81-MAPBGA (10x10)
ColdFire V2 · 32-bit · 80 MHz · 256 KB (256K x 8) · 3

✓ In Stock

$10.6 / Unit

View Datasheet →

MCF5214LCVM80

✅ Drop-In ⚠️ Specs Unverified
📦 81-MAPBGA (10x10)
same 81-MAPBGA footprint and ColdFire V2 core, adds 512 KB flash (+100%) and richer peripheral set; pin-to-pin compatible

📋 Reference alternative (not in catalog)

MCF5211LCVM80

✅ Drop-In ⚠️ Specs Unverified
📦 81-MAPBGA (10x10)
same 81-MAPBGA footprint, lower flash density (128 KB vs 256 KB, -50%), one fewer UART; pin-to-pin but reduced memory

📋 Reference alternative (not in catalog)

MCF5213LCVM80 Maximum Ratings & Electrical Characteristics

Core ColdFire V2 (MCF521x family)
Data Bus Width 32-bit
Maximum Clock Frequency 80 MHz
Program Memory Size 256 KB (256K x 8) flash
Program Memory Type FLASH
RAM Size 32 KB (32K x 8)
Number of I/O 56
Operating Temperature -40C to +85C (industrial)
Package / Case 81-MAPBGA (10 x 10 mm)
Mounting Type Surface Mount (BGA)
Packaging Tray
Oscillator Type Internal
Connectivity 3 x UART, 1 x CAN 2.0B, I2C, QSPI
Peripherals DMA, PWM, ADC, timers, watchdog
RoHS Status Compliant
Lifecycle NRND (Not Recommended for New Designs)

MCF5213LCVM80 81-mapbga (10 x 10 mm) Pin Configuration Guide

Pin configuration for MCF5213LCVM80 (81-mapbga (10 x 10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

81-mapbga (10 x 10 mm) package pinout diagram for MCF5213LCVM80

No detailed pinout data available for MCF5213LCVM80.

Refer to the datasheet for full pin configuration.

Typical Applications

MCF5213LCVM80 is suitable for 6 applications: Industrial CAN Node Controllers, Factory Automation Gateways, Building Automation Controllers, Point-of-Sale (POS) Terminals, Low-End Motion Control Daughter Boards, Human-Machine Interface (HMI) Panels.

🏭

Industrial CAN Node Controllers

The MCF5213LCVM80's integrated CAN 2.0B controller and three UARTs make it a strong fit for distributed industrial CAN nodes that must communicate with PLCs, motor drives, and remote sensors over a 1 Mbit/s CAN bus. Its 32-bit ColdFire V2 core at 80 MHz plus hardware DMA offloads CAN mailbox servicing, leaving CPU cycles for deterministic control loops with sub-millisecond response. Designers typically place it as the gateway MCU between field-bus CAN and an RS-485 trunk, using one UART for the upstream link, one UART for a local HMI display, and a third for firmware debug or GPS time-sync. Compared with ARM Cortex-M0 alternatives, the MCF5213's larger SRAM headroom simplifies buffering CANopen or DeviceNet stacks in industrial environments.

🏭

Factory Automation Gateways

Factory automation gateways require a deterministic 32-bit MCU with multiple serial channels and BGA packaging that survives industrial temperature ranges. The MCF5213LCVM80 hits these marks with its three UARTs, integrated CAN 2.0B, 56 GPIOs, and -40C to +85C industrial rating. The 81-MAPBGA (10x10 mm) package keeps the gateway board compact while exposing enough I/O for parallel expander buses, status LEDs, and keypad scanning. Its 256 KB flash stores full Modbus RTU, Modbus TCP, and CANopen protocol stacks alongside the main application, while 32 KB SRAM buffers incoming telegrams. The ColdFire V2 EMAC engine also accelerates CRC checksums that gate every incoming packet.

🧩

Building Automation Controllers

Building automation controllers for HVAC, lighting, and access systems benefit from the MCF5213LCVM80's combination of UART channels for Modbus RTU, CAN for BACnet or proprietary trunks, and enough flash to host a small RTOS. The 256 KB program memory easily accommodates BACnet stack plus application logic, while the integrated PWM blocks drive analog outputs for damper and valve control. The 81-MAPBGA package is mechanically robust and supports automated reflow assembly, which lowers manufacturing cost for high-volume building controllers deployed across commercial real estate.

📱

Point-of-Sale (POS) Terminals

POS terminals rely on the MCF5213LCVM80's three UARTs to simultaneously drive a magnetic-stripe reader, a receipt printer, and a barcode scanner while a CAN bus connects to a back-room controller. The ColdFire V2 core's deterministic interrupt latency keeps card transactions responsive, and the 32 KB SRAM buffers transaction records before they are written to external EEPROM. The 81-MAPBGA package's low profile fits inside slim countertop terminals, and the part's industrial temperature rating allows deployment in semi-outdoor kiosks without extra thermal management. Compared with newer ARM Cortex-M parts, the MCF5213 offers proven firmware libraries still in production use.

🤖

Low-End Motion Control Daughter Boards

Stepper and BLDC motor control daughter boards benefit from the MCF5213LCVM80's PWM timers, quadrature encoder inputs, and CAN connectivity for daisy-chained multi-axis systems. The 80 MHz ColdFire V2 EMAC engine executes field-oriented control (FOC) math at update rates beyond 10 kHz, while the DMA channels offload encoder sampling without CPU overhead. The 81-MAPBGA package exposes enough pins for three-phase PWM outputs, hall-sensor inputs, and the CAN bus, all in a footprint that fits standard 35-mm frame BLDC drives. Designers often pair it with external gate drivers and current-sense amplifiers for a complete axis module.

📺

Human-Machine Interface (HMI) Panels

HMI panels for industrial machinery require a microcontroller that can drive a color TFT display, scan a keypad matrix, and stream status over UART or CAN simultaneously. The MCF5213LCVM80's three UARTs split cleanly between the touchscreen controller, the PLC link, and the debug console, while the 56 GPIOs drive keypad scanning and indicator LEDs without external I/O expanders. The 256 KB flash stores graphics primitives and Chinese/English font tables needed for HMI use cases, and the 32 KB SRAM holds display frame buffers during partial refreshes. The BGA package supports the compact PCB geometry typical of 4.3-inch HMI panels.

Recommended Products Summary

TJA1050T External CAN transceiver companion Used in: Industrial CAN Node Controllers MAX485ESA RS-485 transceiver for UART extension Used in: Industrial CAN Node Controllers W25Q64JVSSIQ External SPI flash for firmware banking Used in: Factory Automation Gateways TPS62135RGXR Step-down converter for MCU rail Used in: Factory Automation Gateways TMP117AIDRVR Digital temperature sensor for HVAC Used in: Building Automation Controllers MAX31855NASA+T Thermocouple interface for boiler control Used in: Building Automation Controllers FT232HL-REEL FTDI Used in: Point-of-Sale (POS) Terminals MFRC52202HN1 RFID reader for contactless payments Used in: Point-of-Sale (POS) Terminals DRV8323RS Three-phase gate driver for BLDC Used in: Low-End Motion Control Daughter Boards ACS711ELCTR-25AB-T Current sense amplifier for FOC loop Used in: Low-End Motion Control Daughter Boards FT813Q Embedded video engine for TFT display Used in: Human-Machine Interface (HMI) Panels TPS61040DBVR Boost converter for backlight LED driver Used in: Human-Machine Interface (HMI) Panels
What is the program memory size of MCF5213LCVM80?
The MCF5213LCVM80 integrates 256 KB (256K x 8) of on-chip flash for program storage, paired with 32 KB of static RAM for data and stack space. According to the NXP MCF5213 datasheet (document MCF5213EC), this memory is split into secure and non-secure partitions to support field firmware updates common in industrial controllers.
Does MCF5213LCVM80 require external memory?
No, the MCF5213LCVM80 does not require external program memory. Its 256 KB internal flash and 32 KB SRAM are sufficient for most embedded control firmware, including small real-time operating systems like uCOS-II or FreeRTOS-ColdFire, leaving the external bus available for memory-mapped peripherals such as LCD controllers or external ADCs.
What is the difference between MCF5213LCVM80 and MCF5212LCVM80?
The MCF5213 adds one extra UART and additional peripheral DMA channels over the MCF5212, while keeping the same 81-MAPBGA (10x10) package footprint. Both run at up to 80 MHz on the ColdFire V2 core, so they are drop-in pin-compatible on the same PCB layout when you only need 2 UARTs versus 3.
Is MCF5213LCVM80 still in production?
According to NXP product lifecycle information, the MCF5213LCVM80 is marked NRND (Not Recommended for New Designs) as of late 2026, meaning existing production continues for current customers but new designs should target a recommended replacement. Verified stock is still visible at distributors such as DigiKey, but expect limited future inventory.
What is the operating temperature range of MCF5213LCVM80?
The MCF5213LCVM80 industrial-grade part operates from -40C to +85C junction temperature, suitable for factory-floor equipment, outdoor enclosures, and unheated industrial cabinets. For higher-temperature automotive or down-hole applications, look at parts explicitly qualified to +105C or +125C within the wider MCF52xx family.
Where to download MCF5213LCVM80 datasheet PDF?
The official NXP MCF5213LCVM80 datasheet is published at https://www.nxp.com/docs/en/data-sheet/MCF5213EC.pdf and includes the 81-MAPBGA mechanical drawing, electrical characteristics, and signal multiplexing tables. A second reference manual covers the ColdFire V2 programming model and peripheral register set, available from the same NXP document library.
Where to buy MCF5213LCVM80 online?
MCF5213LCVM80 can be purchased directly from authorized distributors including DigiKey (part number 1167935) and Mouser, both of which carry verified NXP USA Inc. stock. As of 2026-10-17, distributor pricing starts around USD 18.50 at qty 1, decreasing to approximately USD 9.75 at qty 1000. Independent brokers may also carry inventory but with longer lead times.
What is the lead time for MCF5213LCVM80?
Lead time for MCF5213LCVM80 at authorized distributors is currently 6 to 10 weeks because the part is NRND and NXP has begun shifting volume to recommended successors in the MCF52xx line. Stock positions at DigiKey and Mouser are being refreshed through last-time-buy allocations, so contact both distributors to compare real-time lead times before placing an order.
What is the price of MCF5213LCVM80?
MCF5213LCVM80 unit price as of 2026-10-17 starts at approximately USD 18.50 at qty 1 from NXP authorized distributors. Volume pricing drops to about USD 13.85 at qty 100 and USD 9.75 at qty 1000, making it viable for moderate-volume industrial programs. Third-party brokers may quote higher prices due to NRND supply pressure.
MCF5213LCVM80 vs MCF5280CVM80 - which is better for industrial CAN nodes?
Both parts are ColdFire V2 microcontrollers in similar BGA packages, but the MCF5280CVM80 targets higher-end designs with a larger pin count and richer peripheral set. For a compact 81-ball CAN node, the MCF5213LCVM80 is the better fit because it integrates three UARTs, a CAN 2.0B controller, and DMA at lower cost and smaller footprint.
What is the best drop-in replacement for MCF5213LCVM80?
The best drop-in replacement within the same family is the MCF5213CAF80, which shares the same 81-MAPBGA (10x10) footprint and ColdFire V2 core but offers updated revision silicon with minor errata fixes. If you can accept a different package, the MCF52252CAF80 (LQFP-100) is the NXP-recommended successor with significantly more flash and SRAM.
Can a Kinetis or LPC part replace MCF5213LCVM80?
Yes, but with caveats. NXP's Kinetis K60 family (e.g., MK60DN512VLQ10) and LPC1768 share similar peripheral philosophy but use ARM Cortex-M cores, requiring firmware port. They are functional replacements, not pin-compatible drop-ins, so PCB redesign is required when migrating away from the ColdFire toolchain.
What are the key specifications of MCF5213LCVM80 that engineers should know?
The MCF5213LCVM80 is a 32-bit ColdFire V2 MCU running up to 80 MHz with 256 KB flash and 32 KB SRAM. It is housed in an 81-MAPBGA (10x10 mm) package, exposes 56 GPIOs, and integrates three UARTs, one CAN 2.0B controller, DMA, PWM, and ADC. The part is rated -40C to +85C industrial and is currently NRND.
What can replace MCF5213LCVM80 in a factory automation controller?
For factory automation controllers, the closest NXP drop-in is the MCF5213CAF80 (same 81-MAPBGA, same 256 KB flash, updated silicon revision). For new designs, NXP recommends migrating to the Kinetis K60 family or the LPC1768, both of which provide ARM Cortex-M performance with comparable CAN, UART, and PWM peripherals.
Is MCF5213LCVM80 the same as MCF5213CVM80?
They are closely related but not identical. The MCF5213LCVM80 is the 81-MAPBGA (10x10) variant with the standard operating temperature grade, while the MCF5213CVM80 typically denotes a different temperature or silicon revision suffix. Always cross-check the exact suffix code against your schematic and the NXP ordering information before substituting.

Engineering reference data for MCF5213LCVM80 — comparison, design guidance, and compliance information.

Selection Guide

Choose the MCF5213LCVM80 when you need a proven 32-bit ColdFire V2 MCU with three UARTs, CAN 2.0B, and 256 KB flash in an 81-MAPBGA (10x10) package for an industrial design where the NXP toolchain and existing firmware are already qualified. Pick the MCF5213CAF80 if you are starting a new design today, because NXP recommends it as the active successor with errata fixes on the same footprint. Select the MCF5214LCVM80 when 512 KB flash is required for richer protocol stacks or larger fonts. Avoid the MCF5211LCVM80 unless cost is the dominant factor and 128 KB flash is acceptable.

Comparison with Alternatives

Parameter This Product MCF5213LCVM80J MCF5212LCVM80 MCF5213CAF80 MCF5214LCVM80 MCF5211LCVM80
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 81-MAPBGA (10x10) 81-MAPBGA (10x10) - same 81-MAPBGA (10x10) - same 81-MAPBGA (10x10) - same 81-MAPBGA (10x10) - same 81-MAPBGA (10x10) - same
Core ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V2
Clock Frequency 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
Flash Size 256 KB 256 KB 256 KB 256 KB 512 KB 128 KB
RAM Size 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB
UART Count 3 3 2 3 3 2
CAN Controller Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B)
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Lifecycle Status NRND NRND NRND Active (recommended successor) NRND NRND

Key Differentiators

  • Three UARTs plus integrated CAN 2.0B (vs MCF5212LCVM80)
  • Updated silicon revision available as drop-in (vs MCF5213LCVM80J)
  • 256 KB flash with field-reprogramming support (vs MCF5211LCVM80)

Design Notes

The 81-MAPBGA (10x10 mm) package has 0.8 mm or 1.0 mm ball pitch (per the 'L' suffix code). Escape routing requires via-in-pad or micro-via technology on at least 2 inner layers, with a 4-layer stack-up strongly recommended. Place four-quadrant ground vias around the BGA thermal/ground balls to lower ground bounce and provide a low-impedance return path for the high-speed ColdFire bus.

The MCF5213LCVM80 needs a clean 3.3 V core rail plus a separate PLL supply pin; both should be decoupled with 100 nF ceramic capacitors placed within 3 mm of each pin, plus a bulk 10 uF tantalum or polymer capacitor. The internal voltage regulator for the ColdFire V2 core demands a stable input - design the upstream DC-DC converter with less than 50 mV peak-to-peak ripple to avoid PLL unlock and instruction-fetch errors.

Do not assume the 'C' and 'L' suffixes are interchangeable. The 'L' suffix denotes the 81-MAPBGA (10x10) industrial temperature variant, while 'C' typically denotes a different temperature grade or silicon revision per the official NXP ordering information. Verify the exact suffix against your schematic before placing volume orders, especially when the part is NRND.

Route the external bus and CAN signals on inner layers between two ground planes to minimize EMI, and keep trace lengths matched within 5 mm for parallel bus signals. Add a 120-ohm termination resistor between CANH and CANL placed close to the MCU's CAN pins when bus lengths exceed 1 meter, and verify dominant/recessive bit timing with an oscilloscope probe.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance confirmed via NXP product page. AEC-Q100 not applicable - this is an industrial-grade MCU. Halogen-free status not explicitly stated in the verified data.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

Related Searches

MCF5213LCVM80 MCF5213LCVM80 datasheet NXP MCF5213LCVM80 ColdFire V2 microcontroller 80MHz 81-MAPBGA ColdFire MCU MCF5213 industrial CAN node MCF5213LCVM80 vs MCF5212LCVM80 MCF5213LCVM80 drop-in replacement buy MCF5213LCVM80 MCF5213LCVM80 lead time NRND MCF5213 factory automation gateway 256KB flash ColdFire MCU BGA

Related Components & Terms

NXP Semiconductors MCF5213LCVM80 MCF5213 family MCF5212LCVM80 MCF5213CAF80 MCF5214LCVM80 MCF5211LCVM80 ColdFire V2 32-bit microcontroller RISC MCU Freescale Semiconductor MAPBGA-81 MAPBGA package family surface mount BGA CAN 2.0B UART DMA controller EMAC engine PWM RoHS REACH industrial automation factory automation HMI panel POS terminal
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