MCF5213LCVM80 - ColdFire V2 MCU 80MHz 256KB Flash | NXP 81-MAPBGA
MPN： MCF5213LCVM80 ✗ 停產MCF5213LCVM80 概覽
What is a ColdFire microcontroller? ColdFire is a 32-bit RISC architecture derived from the original Motorola 68000 family, optimized for embedded systems that need 32-bit data paths, deterministic interrupt response, and rich on-chip peripherals without the cost of a high-MIPS application processor. It sits in the taxonomy as: microcontroller -> 32-bit MCU -> RISC MCU -> ColdFire V2 MCU. The V2 core adds an enhanced multiply-accumulate (EMAC) unit and a hardware divider while keeping the instruction-set compact, which is why MCF5213 parts are still seen in industrial drives, factory automation, and POS terminal designs.
Key features that matter on the bench include 256 KB of single-supply flash with security and programmable partitioning, 32 KB of static RAM for stack and data, an integrated CAN 2.0B controller for industrial networking, and three independent UARTs that simplify RS-232/RS-485 bridges or debug-channel multiplexing. The 81-MAPBGA package is a low-profile surface-mount BGA designed to keep trace escape manageable on 4-layer boards while exposing enough I/O for parallel expansion buses and external memory interfaces.
From an architectural standpoint, the MCF5213 uses a Von Neumann-style unified bus between the ColdFire V2 core, flash, SRAM, and peripheral bridges, with a peripheral DMA controller capable of moving data between the UART, CAN, and ADC blocks without CPU intervention. This keeps the CPU free for deterministic control loops at 80 MHz, while the EMAC engine accelerates DSP-style filtering or FFT kernels commonly used in motor-control and instrumentation code.
Typical applications for the MCF5213LCVM80 include industrial CAN nodes, factory automation controllers, building-automation gateways, and human-machine interface (HMI) panels. It is also a fit for legacy point-of-sale terminals, low-end motion-control daughter boards, and any design that needs deterministic UART/CAN communication backed by a familiar ColdFire toolchain.
When designing with this part, plan the BGA escape pattern carefully because 81-MAPBGA at 0.8 mm or 1.0 mm pitch (per the package code 'L' suffix) leaves limited routing channels. Also confirm the lifecycle status with your distributor before committing to a long-life industrial program. This page consolidates current distributor pricing, drop-in upgrade paths within the MCF521x family, and practical design notes not bundled into the manufacturer datasheet.
直接替換替代品，適用於 MCF5213LCVM80 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCF5213LCVM80 （相同外形與佔位） — 差異在於 Core Architecture, Operating Temperature, Package, Mounting Type, RoHS Status.
MCF5213LCVM80J
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCF5212LCVM80
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MCF5213CAF80
✅ 直接替換聯絡詢價
查看資料表 →MCF5214LCVM80
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCF5211LCVM80
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCF5213LCVM80 最大額定值與電氣特性
| Core | ColdFire V2 (MCF521x family) |
| 資料匯流排寬度 | 32-bit |
| 最大時脈頻率 | 80 MHz |
| Program Memory Size | 256 KB (256K x 8) flash |
| Program Memory Type | FLASH |
| RAM Size | 32 KB (32K x 8) |
| Number of I/O | 56 |
| 工作溫度 | -40C to +85C (industrial) |
| 封裝 / 外殼 | 81-MAPBGA (10 x 10 mm) |
| 安裝類型 | Surface Mount (BGA) |
| Packaging | Tray |
| Oscillator Type | Internal |
| Connectivity | 3 x UART, 1 x CAN 2.0B, I2C, QSPI |
| Peripherals | DMA, PWM, ADC, timers, watchdog |
| RoHS 狀態 | Compliant |
| Lifecycle | NRND (Not Recommended for New Designs) |
MCF5213LCVM80 81-mapbga (10 x 10 mm) 腳位配置指南
MCF5213LCVM80（81-mapbga (10 x 10 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MCF5213LCVM80.
請參閱 資料表 以查看完整腳位配置。
典型應用
MCF5213LCVM80 適用於 6 應用s: Industrial CAN Node Controllers, Factory Automation Gateways, Building Automation Controllers, Point-of-Sale (POS) Terminals, Low-End Motion Control Daughter Boards, Human-Machine Interface (HMI) Panels.
Industrial CAN Node Controllers
The MCF5213LCVM80's integrated CAN 2.0B controller and three UARTs make it a strong fit for distributed industrial CAN nodes that must communicate with PLCs, motor drives, and remote sensors over a 1 Mbit/s CAN bus. Its 32-bit ColdFire V2 core at 80 MHz plus hardware DMA offloads CAN mailbox servicing, leaving CPU cycles for deterministic control loops with sub-millisecond response. Designers typically place it as the gateway MCU between field-bus CAN and an RS-485 trunk, using one UART for the upstream link, one UART for a local HMI display, and a third for firmware debug or GPS time-sync. Compared with ARM Cortex-M0 alternatives, the MCF5213's larger SRAM headroom simplifies buffering CANopen or DeviceNet stacks in industrial environments.
推薦
Factory Automation Gateways
Factory automation gateways require a deterministic 32-bit MCU with multiple serial channels and BGA packaging that survives industrial temperature ranges. The MCF5213LCVM80 hits these marks with its three UARTs, integrated CAN 2.0B, 56 GPIOs, and -40C to +85C industrial rating. The 81-MAPBGA (10x10 mm) package keeps the gateway board compact while exposing enough I/O for parallel expander buses, status LEDs, and keypad scanning. Its 256 KB flash stores full Modbus RTU, Modbus TCP, and CANopen protocol stacks alongside the main application, while 32 KB SRAM buffers incoming telegrams. The ColdFire V2 EMAC engine also accelerates CRC checksums that gate every incoming packet.
推薦
Building Automation Controllers
Building automation controllers for HVAC, lighting, and access systems benefit from the MCF5213LCVM80's combination of UART channels for Modbus RTU, CAN for BACnet or proprietary trunks, and enough flash to host a small RTOS. The 256 KB program memory easily accommodates BACnet stack plus application logic, while the integrated PWM blocks drive analog outputs for damper and valve control. The 81-MAPBGA package is mechanically robust and supports automated reflow assembly, which lowers manufacturing cost for high-volume building controllers deployed across commercial real estate.
推薦
Point-of-Sale (POS) Terminals
POS terminals rely on the MCF5213LCVM80's three UARTs to simultaneously drive a magnetic-stripe reader, a receipt printer, and a barcode scanner while a CAN bus connects to a back-room controller. The ColdFire V2 core's deterministic interrupt latency keeps card transactions responsive, and the 32 KB SRAM buffers transaction records before they are written to external EEPROM. The 81-MAPBGA package's low profile fits inside slim countertop terminals, and the part's industrial temperature rating allows deployment in semi-outdoor kiosks without extra thermal management. Compared with newer ARM Cortex-M parts, the MCF5213 offers proven firmware libraries still in production use.
推薦
Low-End Motion Control Daughter Boards
Stepper and BLDC motor control daughter boards benefit from the MCF5213LCVM80's PWM timers, quadrature encoder inputs, and CAN connectivity for daisy-chained multi-axis systems. The 80 MHz ColdFire V2 EMAC engine executes field-oriented control (FOC) math at update rates beyond 10 kHz, while the DMA channels offload encoder sampling without CPU overhead. The 81-MAPBGA package exposes enough pins for three-phase PWM outputs, hall-sensor inputs, and the CAN bus, all in a footprint that fits standard 35-mm frame BLDC drives. Designers often pair it with external gate drivers and current-sense amplifiers for a complete axis module.
推薦
Human-Machine Interface (HMI) Panels
HMI panels for industrial machinery require a microcontroller that can drive a color TFT display, scan a keypad matrix, and stream status over UART or CAN simultaneously. The MCF5213LCVM80's three UARTs split cleanly between the touchscreen controller, the PLC link, and the debug console, while the 56 GPIOs drive keypad scanning and indicator LEDs without external I/O expanders. The 256 KB flash stores graphics primitives and Chinese/English font tables needed for HMI use cases, and the 32 KB SRAM holds display frame buffers during partial refreshes. The BGA package supports the compact PCB geometry typical of 4.3-inch HMI panels.
推薦
推薦產品摘要
工程參考資料，適用於 MCF5213LCVM80 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCF5213LCVM80J | MCF5212LCVM80 | MCF5213CAF80 | MCF5214LCVM80 | MCF5211LCVM80 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 81-MAPBGA (10x10) | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same | 81-MAPBGA (10x10) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Size | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| UART Count | 3 | 3 | 2 | 3 | 3 | 2 |
| CAN Controller | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | Active (recommended successor) | NRND | NRND |
主要差異化特點
- Three UARTs plus integrated CAN 2.0B (對比MCF5212LCVM80)
- Updated silicon revision available as drop-in (對比MCF5213LCVM80J)
- 256 KB flash with field-reprogramming support (對比MCF5211LCVM80)
設計說明
The 81-MAPBGA (10x10 mm) package has 0.8 mm or 1.0 mm ball pitch (per the 'L' suffix code). Escape routing requires via-in-pad or micro-via technology on at least 2 inner layers, with a 4-layer stack-up strongly recommended. Place four-quadrant ground vias around the BGA thermal/ground balls to lower ground bounce and provide a low-impedance return path for the high-speed ColdFire bus.
The MCF5213LCVM80 needs a clean 3.3 V core rail plus a separate PLL supply pin; both should be decoupled with 100 nF ceramic capacitors placed within 3 mm of each pin, plus a bulk 10 uF tantalum or polymer capacitor. The internal voltage regulator for the ColdFire V2 core demands a stable input - design the upstream DC-DC converter with less than 50 mV peak-to-peak ripple to avoid PLL unlock and instruction-fetch errors.
Do not assume the 'C' and 'L' suffixes are interchangeable. The 'L' suffix denotes the 81-MAPBGA (10x10) industrial temperature variant, while 'C' typically denotes a different temperature grade or silicon revision per the official NXP ordering information. Verify the exact suffix against your schematic before placing volume orders, especially when the part is NRND.
Route the external bus and CAN signals on inner layers between two ground planes to minimize EMI, and keep trace lengths matched within 5 mm for parallel bus signals. Add a 120-ohm termination resistor between CANH and CANL placed close to the MCU's CAN pins when bus lengths exceed 1 meter, and verify dominant/recessive bit timing with an oscilloscope probe.
合規資訊
RoHS and REACH compliance confirmed via NXP product page. AEC-Q100 not applicable - this is an industrial-grade MCU. Halogen-free status not explicitly stated in the verified data.