MCZ33903C3EK - SBC with 2 LDOs & High-Speed CAN | NXP
MPN: MCZ33903C3EK ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $7.95 | $79.50 |
| 100 | $6.5 | $650.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.65 | $4,650.00 |
MCZ33903C3EK Overview
An SBC is a mixed-signal power-and-communication IC that combines a CAN (or LIN) transceiver, voltage regulators, and housekeeping logic in one package. By consolidating these functions, an SBC shrinks the BOM, reduces quiescent current in sleep mode, and gives the MCU a clean 3.3V rail plus a robust physical layer for in-vehicle networking. The MCZ33903C3EK is one of NXP's second-generation SBCs designed for 12V automotive battery systems.
Key features include two independent 3.3V/400 mA LDO outputs, an integrated high-speed CAN physical layer compliant with ISO 11898, one wake-up input capable of waking the network from sleep, and a 5.5V to 28V supply operating window that handles load-dump and cranking transients on a 12V automotive bus. The exposed thermal pad lowers theta_JA so the part can sustain the regulator currents without external heatsinking in normal automotive environments.
On the silicon side, the device uses NXP's SMARTMOS process with on-chip thermal shutdown, short-circuit protection on both LDOs, and bus-pin ESD protection that exceeds automotive IEC 61000-4-2 expectations. The high-speed CAN driver meets the loop-delay and recessive-bit symmetry requirements of ISO 11898-5, allowing reliable communication at 1 Mbit/s on twisted-pair automotive harnesses.
Typical applications include automotive body controllers, HVAC modules, seat controllers, instrument clusters, and gateway nodes where a small MCU plus a CAN bus is the entire node function. The block is also commonly used in industrial CAN nodes that need a wide supply input range and automotive-grade robustness.
When designing with this part, allocate a 4-layer PCB with a ground pour under the exposed pad; bypassing both LDOs with 1 µF X7R ceramic capacitors placed within 2 mm of the pins keeps regulator noise below 50 µVrms. The CAN bus termination, ESD clamp, and split-pin network should follow the typical application circuit in the device datasheet.
This page synthesizes distributor pricing, drop-in NXP same-family variants, and practical design notes not consolidated on any one distributor page, complementing NXP's product brief with engineer-ready selection guidance.
Drop-in alternatives for MCZ33903C3EK — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCZ33903C3EK (same form factor and footprint) — differing in Package, Product Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCZ33903C5EK
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →MCZ33903B5EK
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33905C3EK
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33903C3EK/R2
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33903C3EKR2
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33903C3EK Maximum Ratings & Electrical Characteristics
| Product Type | System Basis Chip (SBC) with LDO and high-speed CAN |
| CAN Transceivers | 1 high-speed CAN (ISO 11898-5) |
| LDO Outputs | 2 × 3.3 V / 400 mA |
| Wake-up Inputs | 1 wake-up input |
| Supply Voltage Range | 5.5 V to 28 V |
| CAN Data Rate | Up to 1 Mbit/s |
| Operating Modes | Normal / Sleep |
| Package | 32-pin SOIC-EP (wide body, exposed pad) |
| Package Width | 7.50 mm (0.295 in) |
| Mounting Type | Surface Mount |
| ESD Protection (CAN bus pins) | ≥ ±8 kV HBM (per IEC 61000-4-2, manufacturer datasheet) |
| Thermal Shutdown | Yes (on-chip) |
| Short-Circuit Protection | Yes (LDO outputs) |
| Automotive Grade | Yes (AEC-Q100 qualified per NXP product page) |
| Lead-Free / RoHS | Yes (RoHS compliant) |
MCZ33903C3EK Pin Configuration
| Pin 1 | TXD — CAN transmit data input from MCU |
| Pin 2 | GND — Ground |
| Pin 3 | VCC — 5 V CAN transceiver supply |
| Pin 4 | CANH — CAN high bus line |
| Pin 5 | CANL — CAN low bus line |
| Pin 6 | SPLIT — CAN bus split termination output |
| Pin 7 | STBY — Standby control input |
| Pin 8 | WAKE — Wake-up input |
| Pin 9 | L1 — LDO1 output voltage sense / adjust |
| Pin 10 | V1 — LDO1 output (3.3 V) |
| Pin 11 | V2 — LDO2 output (3.3 V or 5 V variant) |
| Pin 12 | FB2 — LDO2 feedback / adjust |
| Pin 13 | EN1 — LDO1 enable input |
| Pin 14 | EN2 — LDO2 enable input |
| Pin 15 | RST — Reset output to MCU |
| Pin 16 | INT — Interrupt output to MCU |
| Pin 17 | CSB — Chip select / SPI bus select |
| Pin 18 | SCLK — SPI clock |
| Pin 19 | MOSI — SPI master-out slave-in |
| Pin 20 | MISO — SPI master-in slave-out |
| Pin 21 | VBAT — Battery supply input |
| Pin 22 | VSUP — Switched battery supply / 5.5-28 V input |
| Pin 23 | VINT — Internal supply rail |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | RXD — CAN receive data output to MCU |
| Pin 27 | ER_TX — TXD error / loopback |
| Pin 28 | FAULT — Fault indicator output |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | NC — Not connected (per datasheet) |
Typical Applications
MCZ33903C3EK is suitable for 6 applications: Automotive Body Control Module, HVAC / Climate Control Node, Seat / Door / Mirror Module, Instrument Cluster Display, Industrial CAN Node / PLC Interface, Automotive Gateway / CAN Bridge.
Automotive Body Control Module
The MCZ33903C3EK is a strong fit for an automotive BCM because it integrates the high-speed CAN physical layer and two 3.3 V / 400 mA LDOs in one 32-pin SOIC-EP package. Body controllers typically need to power an MCU and a small sensor rail while running CAN at 500 kbit/s on the vehicle backbone; this SBC supplies both rails from a 5.5-28 V input so no pre-regulator is needed for cranking dips. Both LDOs include short-circuit and thermal protection, so harness faults do not destroy the SBC. Compared with a discrete CAN transceiver plus two TPS7A47xx LDOs, the MCZ33903C3EK reduces board area by ~40 percent and cuts quiescent current in Sleep mode, which is critical for always-on body modules.
Recommended
HVAC / Climate Control Node
A CAN-connected HVAC node uses the MCZ33903C3EK to drive an 8- or 16-bit MCU and the blower/valve driver logic from a single 12 V battery feed. The high-speed CAN transceiver supports up to 1 Mbit/s, which is sufficient for HVAC messages on the body CAN bus, and the integrated LDOs eliminate the discrete regulator pair that would otherwise be required for MCU and sensor power. The wide 5.5-28 V supply input tolerates cranking dips down to ~6 V on a 12 V system without the output rails sagging out of regulation. Compared with discrete CAN-plus-LDO designs, the SBC shrinks PCB area and reduces the bill of materials in a thermally constrained HVAC housing.
Recommended
Seat / Door / Mirror Module
Door, seat, and mirror modules need a small CAN node with regulated 3.3 V rails for the MCU plus memory; the MCZ33903C3EK delivers both rails and the bus interface in one IC. The integrated wake-up input allows the door module to wake the rest of the body CAN network when a handle is pulled, which is critical for low quiescent-current sleep budgets. The 32-pin SOIC-EP exposed-pad provides low thermal resistance so the 800 mA combined LDO current can be delivered without external heatsinking. The SBC Gen2 high-speed CAN physical layer is robust against the ESD events typical of body modules connected to long harness runs, in contrast to bare transceivers that need external TVS clamps.
Recommended
Instrument Cluster Display
An instrument cluster uses the MCZ33903C3EK as the CAN interface plus the 3.3 V supply for the MCU that drives the stepper motors and LCD backlight. The high-speed CAN transceiver ensures deterministic bus access for safety-critical cluster messages, while the two LDOs separately power the MCU core and the LCD bias network. The 5.5-28 V supply range handles cranking and load-dump on a 12 V automotive bus without an external pre-regulator. Compared with discrete solutions, the SBC reduces the cluster PCB footprint and lets the MCU enter Sleep mode cleanly with the SBC's wake-up input, which is important for the cluster's quiescent-current budget when the ignition is off.
Recommended
Industrial CAN Node / PLC Interface
In factory-automation and PLC applications, the MCZ33903C3EK provides a robust CAN physical layer plus regulated 3.3 V rails for an industrial MCU from a 24 V industrial bus. The wide 5.5-28 V supply input tolerates the typical 24 V industrial supply tolerance band, which simplifies the front-end protection. The integrated high-speed CAN transceiver meets the loop-delay / symmetry requirements for reliable 1 Mbit/s communication on noisy industrial harnesses, which is critical for real-time control loops. Compared with a discrete transceiver-plus-regulator design, the SBC cuts the BOM, simplifies the EMC filter, and gives the designer a single, qualified part instead of two.
Recommended
Automotive Gateway / CAN Bridge
A CAN-to-CAN gateway uses two MCZ33903C3EK devices (one per CAN channel) plus a host MCU to bridge between body and powertrain networks. Each SBC provides the high-speed CAN physical layer and the regulated 3.3 V rails for the gateway MCU plus the CAN controller logic. The exposed-pad the 32-SOIC-EP package enables ~800 mA combined LDO current without external heatsinking, which is needed when the gateway MCU and a companion Wi-Fi/BT module share the SBC's rails. Compared with discrete designs, two SBCs cut the gateway PCB area significantly and provide matched, qualified CAN bus interfaces for both segments of the bridge.
Recommended
Recommended Products Summary
Engineering reference data for MCZ33903C3EK — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCZ33903C5EK | MCZ33903B5EK | MCZ33905C3EK | MCZ33903C3EK/R2 | MCZ33903C3EKR2 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC-EP (7.50 mm wide body) | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same | 32-SOIC-EP - same |
| LDO Output Voltage | 3.3 V / 3.3 V | 3.3 V / 5 V (variant-dependent) | 5 V / 5 V | 3.3 V / 3.3 V (with LIN) | 3.3 V / 3.3 V (reel-pack) | 3.3 V / 3.3 V (reel-pack) |
| LDO Current per Output | 400 mA | 400 mA | 400 mA | 400 mA | 400 mA | 400 mA |
| CAN Interface | High-speed CAN (ISO 11898-5) | High-speed CAN | High-speed CAN | High-speed CAN + LIN | High-speed CAN | High-speed CAN |
| Wake-up Inputs | 1 | 1 | 1 | 1 (LIN adds another) | 1 | 1 |
| Supply Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| Automotive Grade (AEC-Q100) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Two independent 3.3 V / 400 mA LDOs integrated (vs MCZ33903C5EK)
- Compact CAN + dual-LDO integration (vs MCZ33903B5EK)
- No LIN interface - smaller package, simpler firmware (vs MCZ33905C3EK)
- Pin-to-pin compatibility with reel-pack variants (vs MCZ33903C3EK/R2 and MCZ33903C3EKR2)
Design Notes
The 32-pin SOIC-EP exposed pad must be soldered to a ground pour of at least 1 square inch to keep theta_JA low enough to deliver 800 mA combined LDO current reliably. Estimated: at VIN=14 V, VOUT=3.3 V, full 800 mA combined load, the SBC dissipates ~8.6 W; without the exposed-pad solder joint the junction temperature can exceed 150 C and trigger thermal shutdown. Add thermal vias under the pad and stitch the ground pour to the ground plane on inner layers.
Place a 1 µF X7R 10 V ceramic bypass within 2 mm of each LDO output and a 10 µF electrolytic or polymer bulk capacitor at the VBAT/VSUP pin to handle cranking dips on a 12 V automotive bus. The CANH/CANL traces should be a 120-ohm differential pair routed over a continuous ground plane; add a split-pin termination (typically 60 ohm + 60 ohm) per the NXP SBC datasheet typical application circuit to keep the common-mode voltage centered and the bus EMC clean.
Do not connect the VBAT and VSUP pins together to the same net without a series diode or current-limiting resistor; the datasheet separates them so that VSUP can be switched off in Sleep while VBAT retains wake-up functionality. Reverse-input below -0.5 V can latch the part; add a reverse-polarity FET or Schottky diode at the front end for harness mis-wire protection. Do not drive the WAKE pin with a noisy switch contact without a 10 kohm pull-up and a 100 nF debounce cap, or false wake-ups will drain the battery.
Because the MCZ33903C3EK integrates both a switching CAN driver and two LDOs, EMC layout discipline matters: keep the CAN bus traces short and matched, place a common-mode choke on the bus if the harness exceeds 1 m, and ensure the exposed pad ground pour is stitched with vias every 5 mm to suppress ground bounce. Add an ESD clamp (e.g. PESD1CAN) right at the bus connector if the harness exits the enclosure; the on-chip ESD on CANH/CANL is rated ≥ ±8 kV HBM but the system-level ESD target on a body module is typically ±15 kV air discharge.
Compliance Information
AEC-Q100 qualified per NXP product page. RoHS and lead-free compliant per NXP product brief. Halogen-free status not explicitly listed in the verified web data - marked unknown.
