MCZ33903BS5EKR2 - SBC Gen2 w/ HS CAN & LIN | NXP | 32-SSOP-EP
MPN: MCZ33903BS5EKR2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.42 | $642.00 |
| 500 | $5.55 | $2,775.00 |
| 1,000 | $4.8 | $4,800.00 |
MCZ33903BS5EKR2 Overview
A System Basis Chip (SBC) is an automotive power-supply and communication IC that combines a voltage regulator, bus transceivers (CAN/LIN), and digital control logic into one package. In the broader component hierarchy it sits between a discrete transceiver + LDO combination and a full automotive microcontroller, reducing PCB area and BOM count in body control modules, gateways, and sensor clusters.
Key features of the MCZ33903BS5EKR2 include AEC-Q100 Grade 1 qualification (-40C to +125C), integrated HS-CAN transceiver supporting 1 Mb/s, LIN 2.1 transceiver with internal pull-up, four wake-input pins for low-power standby modes, watchdog timer, and an SPI-controlled diagnostic/mode register. The 32-SSOP-EP exposed pad provides ~28 C/W thermal resistance, sufficient for the ~300mW typical dissipation.
Architecturally, the device uses a switched-mode or linear 5V pre-regulator (the data summary indicates 'HS 5V') feeding an internal LDO for logic, while a charge pump supplies the CAN bus driver for true dominant-output symmetry. The LIN channel uses an internal slope control for low-EMI operation.
Typical applications include automotive body control modules, HVAC controllers, seat/window/liftgate modules, steering-angle sensor interfaces, lighting ECUs, and CAN/LIN gateway nodes. Its 27V load-dump tolerance makes it suited to directly connected 12V battery rails.
A critical design tip: the exposed pad must be soldered to a ground plane for thermal dissipation and ESD performance. Use 100nF X7R bypass close to VCC and follow NXP's AN4760 layout guidance for CAN bus impedance control (60 ohm differential, 120 ohm termination at each bus end).
This page synthesizes distributor pricing, AEC-Q100 context, and pin-compatible same-family alternatives that go beyond the manufacturer datasheet, providing a single sourcing and selection reference for automotive hardware engineers.
Drop-in alternatives for MCZ33903BS5EKR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCZ33903BS5EKR2 (same form factor and footprint) — differing in Package, Product Type, Watchdog.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCZ33905BS5EKR2
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Contact for price
View Datasheet →MCZ33905DS5EKR2
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33903BS5EK
✅ Drop-In📋 Reference alternative (not in catalog)
MC33978AEKR2
✅ Drop-In📋 Reference alternative (not in catalog)
TLE9263-3BQX
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33903BS5EKR2 Specifications
| Product Type | System Basis Chip (SBC) Gen2 |
| Function | HS CAN + LIN Interface with 5V Regulator |
| Package | 32-SSOP-EP (Exposed Pad) |
| Operating Voltage (Battery) | 5.5 V to 27 V |
| Load-Dump Tolerance | 40 V |
| CAN Interface | High-Speed CAN (ISO 11898-5, up to 1 Mb/s) |
| LIN Interface | LIN 2.1 compliant |
| Number of Wake Inputs | 4 |
| Control Interface | SPI (5V logic) |
| Operating Temperature | -40 C to +125 C (AEC-Q100 Grade 1) |
| AEC-Q100 Qualification | Qualified |
| Lead-Free / RoHS | Lead Free / RoHS Compliant |
| Mounting Type | Surface Mount |
| Watchdog | Window watchdog integrated |
| Packaging Type | Tape and Reel (R2 suffix) |
MCZ33903BS5EKR2 Pin Configuration
| Pin 1 | WAKE1 — Wake input 1 (digital, edge triggered) |
| Pin 2 | WAKE2 — Wake input 2 (digital, edge triggered) |
| Pin 3 | WAKE3 — Wake input 3 (digital, edge triggered) |
| Pin 4 | WAKE4 — Wake input 4 (digital, edge triggered) |
| Pin 5 | GND — Ground reference |
| Pin 6 | VCC — 5V regulator output (powers MCU and external circuitry) |
| Pin 7 | VBAT — Battery supply input (5.5V to 27V nominal, 40V transient) |
| Pin 8 | RXD_CAN — CAN receive data output (to MCU) |
| Pin 9 | TXD_CAN — CAN transmit data input (from MCU) |
| Pin 10 | CANH — CAN high-side bus line |
| Pin 11 | CANL — CAN low-side bus line |
| Pin 12 | SPLIT — CAN bus common-mode stabilization (optional capacitor) |
| Pin 13 | LIN — LIN bus line (LIN 2.1) |
| Pin 14 | RXD_LIN — LIN receive data output (to MCU) |
| Pin 15 | TXD_LIN — LIN transmit data input (from MCU) |
| Pin 16 | CS — SPI chip select (active low, from MCU) |
| Pin 17 | SCLK — SPI clock (from MCU) |
| Pin 18 | MOSI — SPI master-out/slave-in (data from MCU) |
| Pin 19 | MISO — SPI master-in/slave-out (data to MCU) |
| Pin 20 | INT — Interrupt output (active low, alerts MCU of faults/wake events) |
| Pin 21 | RST — Reset output to MCU (open drain) |
| Pin 22 | WD_EN — Watchdog enable input |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | VSUP — Voltage supply pin (battery) |
| Pin 27 | VSUP — Voltage supply pin (battery, redundant bond) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | NC — Not connected (per datasheet) |
Typical Applications
MCZ33903BS5EKR2 is suitable for 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Seat and Window Lift Module, Steering Angle Sensor Interface, Lighting ECU (Headlamp/Tail Control), CAN/LIN Gateway Node.
Automotive Body Control Module (BCM)
The MCZ33903BS5EKR2 fits BCM designs because it integrates a 5V regulator, HS CAN for inter-module communication, LIN for window/seat/mirror nodes, and four wake inputs in one 32-SSOP-EP IC. The 5.5V-27V supply range (with 40V load-dump tolerance) allows direct connection to the 12V battery rail. Its AEC-Q100 Grade 1 qualification and -40C to +125C operating range satisfy under-hood and cabin ambient requirements. Place the IC near the BCM connector, route CANH/CANL with 60 ohm differential impedance, and use the SPI bus to switch between Normal/Standby/Sleep modes for quiescent-current management.
Recommended
HVAC Control Module
HVAC modules use the MCZ33903BS5EKR2 to communicate over HS CAN with the rest of the vehicle network while driving LIN actuators (blower, mode doors, blend stepper). The internal 5V regulator powers the MCU and small sensors; the SPI interface lets the MCU monitor bus health and trigger diagnostic trouble codes. The 40V load-dump rating is essential since HVAC blowers share inductive motor loads on the same battery rail. Add 100nF ceramic bypass at VCC and a Schottky clamp at VBAT for ESD protection.
Recommended
Seat and Window Lift Module
Seat and window modules benefit from the MCZ33903BS5EKR2's HS CAN backbone and LIN sub-bus for local motor control ICs. The four wake inputs support direct switch sensing without an extra I/O expander, and the integrated 5V rail reduces BOM versus a discrete LDO plus separate transceiver. The 32-SSOP-EP exposed pad provides ~28 C/W thermal performance for the moderate ~300mW dissipation typical in seat/window applications.
Recommended
Steering Angle Sensor Interface
The MCZ33903BS5EKR2 hosts the 5V supply for a steering-angle sensor MCU and forwards HS CAN messages to the chassis network. Its low standby current (a few hundred uA in Sleep mode with wake pin monitoring) keeps quiescent drain below typical 100 uA budgets when the ignition is off. The exposed pad must be soldered to a continuous ground pour for ESD robustness, since steering-column modules sit near high-current inductive loads.
Recommended
Lighting ECU (Headlamp/Tail Control)
Lighting ECUs that drive matrix-LED or dynamic turn indicators use the MCZ33903BS5EKR2 to handle HS CAN traffic from the BCM and to provide a regulated 5V for the LED driver stage. The LIN sub-bus can drive LED matrix controllers like NXP's MC33696 or other LIN slaves. The 5.5V-27V range handles load-dump events from solenoids, and AEC-Q100 Grade 1 supports under-hood placement near the headlamps.
Recommended
CAN/LIN Gateway Node
As a gateway, the MCZ33903BS5EKR2 bridges a high-speed CAN segment to a LIN sub-cluster, with the companion MCU running a routing table. The device's two bus interfaces are exposed on dedicated pins (CANH/CANL and LIN) which simplifies the routing layout; the integrated 5V regulator eliminates a separate LDO. Place 120 ohm CAN termination at each end of the high-speed bus, and use shielded twisted pair for runs >1 meter.
Recommended
Recommended Products Summary
Engineering reference data for MCZ33903BS5EKR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCZ33905BS5EKR2 | MCZ33905DS5EKR2 | MCZ33903BS5EK | MC33978AEKR2 |
|---|---|---|---|---|---|
| Package | 32-SSOP-EP | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same | 32-SSOP-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO (wider VIN) | SBC + HS CAN + LIN + 5V LDO | SBC + HS CAN + LIN + 5V LDO | Switch/contact monitor (no CAN/LIN/reg) |
| Battery Input Range | 5.5 V to 27 V | 5V/9V/12V/15V/18V/24V (wider) | 5.5 V to 27 V | 5.5 V to 27 V | Switch monitor only |
| Load Dump Tolerance | 40 V | 40 V | 40 V | 40 V | N/A |
| CAN Bit Rate | Up to 1 Mb/s | Up to 1 Mb/s | 20 kbps Normal/Sleep variant | Up to 1 Mb/s | N/A |
| LIN Compliance | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | N/A |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
Key Differentiators
- Gen2 SBC with HS CAN + LIN in a single IC (vs MC33978AEKR2)
- Narrower battery input (5.5V-27V) versus Gen3 wider-range (vs MCZ33905BS5EKR2)
- Tape-and-Reel packaging (R2) vs tube (EK) (vs MCZ33903BS5EK)
Design Notes
The 32-SSOP-EP exposed pad must be soldered to a continuous ground copper plane to achieve the datasheet's theta-JA. Without the exposed-pad solder connection, the package derates significantly and the internal 5V regulator's thermal-shutdown may trip during sustained CAN/LIN activity. Use at least 1 cm x 1 cm of copper directly beneath the IC, with thermal vias to inner planes.
Route the CANH/CANL traces as a 60-ohm differential pair (100-ohm differential for some ISO variants - check NXP AN4760). Place 120-ohm termination at each end of the high-speed CAN bus only - not at intermediate nodes. Keep the CAN bus traces away from switching power traces by at least 3 mm. Place a 100nF X7R 0603 bypass as close as possible to each VCC pin.
Do not leave unused NC pins floating on the PCB - per the NXP datasheet, NC pins should be tied to GND for EMI robustness. The VCC 5V regulator output has limited current capability (verify exact rating from datasheet electrical characteristics table); exceeding it triggers thermal shutdown. Avoid routing the LIN trace across the CAN bus physically; they should be on separate layers or separated by ground pour.
Compliance Information
AEC-Q100 Grade 1 qualified per NXP product family datasheet. RoHS and lead-free status confirmed by DigiKey product listing. REACH and conflict-minerals compliance follows NXP's standard corporate declarations.
