MK10DN32VLH5 - Kinetis K10 50MHz Cortex-M4 MCU 32KB Flash 64-LQFP | NXP
MPN: MK10DN32VLH5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.57 | $4.57 |
| 10 | $4.12 | $41.20 |
| 100 | $3.68 | $368.00 |
| 500 | $3.3 | $1,650.00 |
| 1,000 | $2.96 | $2,960.00 |
| 3,000 | $2.07 | $6,210.00 |
MK10DN32VLH5 Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (flash), working memory (SRAM), and a configurable set of peripherals such as timers, ADCs, communication interfaces, and GPIOs. The Kinetis K10 sits in NXP's low-power MCU hierarchy under the broader Kinetis family, which in turn belongs to the 32-bit ARM Cortex-M embedded processor segment. MK10DN32VLH5 specifically combines a Cortex-M4 core (which adds single-precision FPU and DSP instructions) with Kinetis peripheral integration for baseline connected applications.
Key features of the MK10DN32VLH5 include an integrated USB 2.0 full-speed device controller, multiple serial communication peripherals (UART, SPI, I2C), a 16-bit ADC, low-power run and wait modes, and a flexible interrupt controller (NVIC). The 64-pin LQFP package supports easy hand-soldering and prototype-friendly layouts, while still offering enough I/O for typical industrial sensor hubs and human-interface nodes.
Technically, the MK10DN32VLH5 is built on a low-leakage CMOS process and uses NXP's standard Kinetis peripheral IP. The 50 MHz Cortex-M4 core delivers up to ~75 DMIPS, while the single-cycle flash and SRAM provide deterministic interrupt latency for real-time control loops. The USB device controller integrates a transceiver and dedicated buffer RAM, removing the need for an external PHY in many designs.
Typical applications include industrial sensor interface modules, USB HID/CDC peripherals, small appliance control boards, building automation nodes, low-cost data loggers, and portable measurement instruments. The combination of a Cortex-M4 core, on-chip USB, and a 64-pin LQFP makes MK10DN32VLH5 especially well-suited for connected low-power embedded products.
When designing with this part, plan the flash/RAM budget carefully: 32 KB flash limits the firmware footprint (including bootloader), while 8 KB SRAM constrains the largest data buffers. Use Kinetis BSP and Processor Expert (or the maintained NXP MCUXpresso SDK family) for clock setup, USB stack integration, and low-power mode configuration.
This page synthesizes distributor pricing, same-family drop-in NXP alternatives, and practical design notes not found in the manufacturer datasheet front matter. All values are referenced to the NXP K10 sub-family datasheet and current distributor listings as of 2026-10-19.
Drop-in alternatives for MK10DN32VLH5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK10DN32VLH5 (same form factor and footprint) — differing in ADC, Communication Interfaces, Core, Maximum Clock Frequency, Operating Temperature Range.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK10DN64VLH5
✅ Drop-In📋 Reference alternative (not in catalog)
MK10DN128VLH5
✅ Drop-In📋 Reference alternative (not in catalog)
MKL26Z32VLH4
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →MK10DN32VLH5 Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4 |
| Core Width | 32-bit |
| Family | Kinetis K10 |
| Maximum Clock Frequency | 50 MHz |
| Program Memory Size (Flash) | 32 KB |
| RAM Size | 8 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Operating Temperature Range | -40 °C to +105 °C |
| Package | 64-LQFP |
| Mounting Type | Surface Mount |
| USB Interface | USB 2.0 Full-Speed Device (integrated) |
| ADC | 16-bit (per K10 sub-family datasheet) |
| Communication Interfaces | UART, SPI, I2C, USB |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Data Bus Width | 32-bit |
MK10DN32VLH5 64-lqfp Pin Configuration Guide
Pin configuration for MK10DN32VLH5 (64-lqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MK10DN32VLH5.
Refer to the datasheet for full pin configuration.
Typical Applications
MK10DN32VLH5 is suitable for 6 applications: Industrial Sensor Interface Module, USB Human Interface Device (HID) Peripheral, Portable Measurement Instrument, Building Automation Node, Low-Cost Data Logger, Small Appliance Control Board.
Industrial Sensor Interface Module
The MK10DN32VLH5 suits industrial sensor interface modules where its 50 MHz Cortex-M4 core handles ADC sampling and digital filtering within a 1.71-3.6 V supply rail. Its 8 KB SRAM buffers multi-channel sensor frames while 32 KB flash accommodates drivers, calibration, and a small RTOS. The 64-LQFP gives plenty of GPIO for parallel sensor buses, and the -40 °C to +105 °C range tolerates factory-floor enclosures. Using on-chip ADC and UART/SPI peripherals reduces external component count versus a discrete MCU + ADC design.
Recommended
USB Human Interface Device (HID) Peripheral
The integrated USB 2.0 full-speed device controller makes MK10DN32VLH5 well-suited for USB HID peripherals such as keyboards, pointer devices, custom input panels, and barcode scanners. Its on-chip USB transceiver and buffer RAM remove the need for an external PHY, reducing BOM cost and PCB area. The Cortex-M4 core runs the HID class driver plus application logic within the 32 KB flash budget. Compared to an external MCU + USB bridge, the MK10DN32VLH5 cuts part count by one and eases firmware lifecycle.
Recommended
Portable Measurement Instrument
Battery-powered portable measurement instruments benefit from the MK10DN32VLH5's low-power wait and stop modes plus wide 1.71-3.6 V supply range, which works directly from a single-cell Li-ion or 2x AA supply. The 16-bit ADC provides adequate resolution for typical sensor measurements, while the Cortex-M4 runs DSP filtering routines in single precision. The 64-LQFP allows a compact board with display, keypad, and probe interface connections. Compared to discrete ADCs plus an 8-bit MCU, it streamlines design and firmware certification.
Recommended
Building Automation Node
Building automation nodes (lighting, HVAC interface, access panels) fit the MK10DN32VLH5 well because they need reliable industrial-grade temperature tolerance, enough flash for protocol stacks, and low idle power. The integrated USB enables easy commissioning from a service tool, while UART/SPI/I2C connect to wireless or wired field buses via companion transceivers. The Cortex-M4 core can run BACnet, Modbus, or proprietary stacks within the 32 KB flash budget if optimized. Compared to higher-end Cortex-M7 parts, this MCU trims cost while still meeting real-time requirements.
Recommended
Low-Cost Data Logger
Standalone low-cost data loggers benefit from MK10DN32VLH5's 32 KB flash (firmware + small file system), 8 KB SRAM (rolling buffer), and on-chip 16-bit ADC for sensor inputs. USB device mode makes retrieving logs as simple as plugging into a PC - no external programmer required. The 50 MHz Cortex-M4 handles time-stamping, compression, and SD-card command sequences via SPI. Compared to an 8-bit MCU, the M4 core compresses data faster and the wider bus improves throughput to external memory.
Recommended
Small Appliance Control Board
Small household appliances (coffee machines, blenders, smart kitchen devices) use MK10DN32VLH5 because of its industrial temperature range, sufficient flash for motor-control and UI firmware, and USB for diagnostic/test interfaces during manufacturing. Multiple timers, PWM channels, and the Cortex-M4 core support BLDC, stepper, or brushed motor control loops with cycle times well below 1 ms. The 64-LQFP gives generous pin count for relays, triac drivers, and a small keypad/display. Compared to discrete MCU + gate-driver designs, this part reduces BOM and BOM risk.
Recommended
Recommended Products Summary
Engineering reference data for MK10DN32VLH5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK10DN64VLH5 | MK10DN128VLH5 | MKL26Z32VLH4 |
|---|---|---|---|---|
| Package | 64-LQFP | 64-LQFP - same | 64-LQFP - same | 64-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M0+ |
| Max Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 48 MHz |
| Flash Size | 32 KB | 64 KB | 128 KB | 32 KB |
| RAM Size | 8 KB | 8 KB | 16 KB | 4 KB |
| Supply Voltage Range | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
| USB Interface | USB 2.0 FS Device (integrated) | USB 2.0 FS Device (integrated) | USB 2.0 FS Device (integrated) | USB 2.0 FS Device (integrated, on select L-series parts) |
Key Differentiators
- Lowest-cost member of the K10 64-LQFP family (vs MK10DN64VLH5)
- Cortex-M4 with FPU vs Cortex-M0+ alternative (vs MKL26Z32VLH4)
- Integrated USB 2.0 device with on-chip transceiver (vs MKE04Z64VLD2)
Design Notes
Estimated: at 50 MHz, 3.3 V, the MK10DN32VLH5's core draws in the low single-digit mA range per the K10 datasheet, while low-power modes drop current to microampere levels. Decouple each VDD pin with a 100 nF ceramic plus a bulk 4.7 µF capacitor placed within 5 mm of the pins. USB transceiver pins also require per datasheet RC networks for impedance matching.
In a 64-LQFP, theta_JA is typically ~50 °C/W, so at typical 50 MHz usage the junction temperature rise stays well within limits. Avoid stuffing copper below exposed pads (LQFP has no pad); instead use a top-layer copper pour connected to GND to spread heat. For industrial designs near +105 °C ambient, verify junction derating using the K10 thermal metrics.
Keep the 32 kHz RTC crystal traces short and symmetric to minimize load-capacitance mismatch. Route USB D+/D- as a 90-ohm differential pair per USB 2.0 spec, with the ground reference on layer 2. Per NXP layout guidelines, place decoupling capacitors adjacent to each VDD pin before vias to inner power planes.
Estimated: with only 32 KB flash and 8 KB RAM, applications adding a USB stack plus an RTOS may exceed headroom. Plan memory before committing to firmware; if buffer overhead grows, swap to MK10DN64VLH5 or MK10DN128VLH5 which share the same 64-LQFP footprint. Also, ensure unused JTAG/SWD pins are configured as GPIOs or pulled to defined states to avoid input leakage.
Compliance Information
RoHS and REACH compliance confirmed via distributor product pages (Heisener, Mouser, LCSC). Not AEC-Q100 qualified - this is an industrial-grade MCU, not automotive. Conflict minerals statement available via NXP.