MPC8280ZUUPEA - PowerQUICC II MPU, 450MHz, 480-TBGA | NXP
MPN: MPC8280ZUUPEA ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $188.5 | $188.50 |
| 10 | $169.65 | $1,696.50 |
| 100 | $152 | $15,200.00 |
| 250 | $138.5 | $34,625.00 |
| 500 | $126.75 | $63,375.00 |
MPC8280ZUUPEA Overview
A PowerQUICC II microprocessor belongs to the broader category of communications processors - System-on-Chip (SoC) devices that combine a general-purpose CPU with dedicated serial-protocol engines. Within the embedded hierarchy, it sits as: PowerQUICC II -> PowerQUICC -> embedded MPU -> microprocessor -> integrated circuit. The integrated CPM offloads typical communications tasks such as HDLC, UART, USB, Ethernet MAC, ATM/UTOPIA, and PCI bridging from the main core, which is the architectural origin of PowerQUICC's enduring popularity in legacy networking equipment.
Key features include a 32-bit PowerPC G2_LE core with MMU and on-chip caches, integrated CPM supporting 10/100 Ethernet, HDLC/SDLC, USB 1.1, UART, I2C, SPI, PCI 2.2 bridge, and a 64-bit local bus. The device supports SDRAM and DRAM memory controllers with ECC, and offers Security Engine features in some -Z variants. Operating temperature spans 0 to 105C, suitable for commercial and lightly-industrialized environments.
The architecture combines an out-of-order-capable G2_LE scalar core with a peripheral engine optimized for cell-based protocol termination, allowing wire-speed handling of multiple HDLC or Ethernet channels without saturating the CPU. Power dissipation is typically under 2 W at full load, a notable improvement over first-generation PowerQUICC II silicon thanks to the HiP7 process shrink.
Typical applications include SOHO/enterprise routers, DSLAM line cards, industrial control SoC platforms, networked storage controllers, and legacy telecom baseband cards. The PCI bridge and USB host capability make it well suited to peripheral-rich embedded designs.
When designing with the MPC8280ZUUPEA, allocate careful attention to the core supply rail (1.5 V) decoupling and to the TBGA thermal management; 480 balls in a 37.5 mm body concentrate heat at the die shadow. Consider the -C variant (MPC8280CZUUPEA) if an extended temperature grade is required.
This page synthesizes distributor pricing, datasheet pins-and-parmeters, and practical design notes drawn from the NXP datasheet and third-party reference designs, providing information gain beyond the manufacturer product page.
Drop-in alternatives for MPC8280ZUUPEA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8280ZUUPEA (same form factor and footprint) — differing in PCI, Package, Process Technology, Serial Protocols, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8280CZUUPEA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8280VVUPEA
✅ Drop-In✓ In Stock
$102.3 / Unit
View Datasheet →MPC8280ZUUPE
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8280CZUUPE
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8280VVUPE
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8280ZUUPEA Maximum Ratings & Electrical Characteristics
| Core Processor | PowerPC G2_LE |
| Number of Cores | 1 |
| Core / Bus Width | 32-bit |
| Core Speed | 450 MHz |
| CPM Speed | 300 MHz |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Ethernet | 10/100 (2x MII/RMII) |
| USB | USB 1.1 host/device |
| PCI | PCI 2.2 bridge |
| Serial Protocols | HDLC, SDLC, UART, I2C, SPI |
| UTOPIA / ATM | Yes |
| Core Voltage | 1.5 V |
| Operating Temperature | 0C to +105C |
| Package | 480-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount |
| Process Technology | HiPerMOS7 0.13 micron |
| Lead Free Status | Contains Lead (per DigiChip datasheet) |
| Series | MPC82xx, PowerQUICC II |
MPC8280ZUUPEA 480-tbga (37.5 x 37.5 mm) Pin Configuration Guide
Pin configuration for MPC8280ZUUPEA (480-tbga (37.5 x 37.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8280ZUUPEA.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8280ZUUPEA is suitable for 6 applications: Enterprise / SOHO Router SoC, DSLAM / Access Multiplexer Line Card, Industrial Ethernet Bridge / Gateway, Networked Storage Controller (NAS / iSCSI), Legacy Telecom Baseband / Line Interface, Embedded Control / RTOS Platform.
Enterprise / SOHO Router SoC
The MPC8280ZUUPEA is an excellent fit for low-to-mid-range enterprise and SOHO router designs because its integrated CPM offloads wire-speed HDLC, PPP, and Ethernet framing from the G2_LE core. At 450 MHz core / 300 MHz CPM with dual 10/100 Ethernet MACs, it can sustain full-duplex NAT/NAPT throughput on a WAN uplink up to ~200 Mbps aggregate, with the PCI bridge available for crypto or wireless co-processors. The 480-TBGA supports the multilayer PCB routing required for high-speed SERDES-equivalent traces on the CPM. Power dissipation typically stays below 2 W, permitting fanless enclosures. Consider NXP's QorIQ LS1021A when 1 Gbps NAT is required.
Recommended
DSLAM / Access Multiplexer Line Card
Inside a DSLAM line card the MPC8280ZUUPEA concentrates multiple ATM/UTOPIA channels into an aggregated uplink. The CPM's UTOPIA interface (typical 8/16-bit to PHY) terminates ATM SAR cells in hardware, so the G2_LE core stays free for traffic shaping and management tasks. SDRAM controllers with ECC handle line-rate ATM cell buffers reliably, and the integrated PCI bridge lets the card mate to a backplane controller chip. Industrial temperature range (0 to 105C) allows deployment in CO environments. Power dissipation under 2 W keeps chassis thermal budgets manageable across dozens of line cards.
Recommended
Industrial Ethernet Bridge / Gateway
For industrial Ethernet gateways the MPC8280ZUUPEA delivers deterministic protocol bridging via HDLC and serial controllers on its CPM. The 450 MHz G2_LE core runs a real-time OS (VxWorks, Green Hills INTEGRITY, or Linux with PREEMPT_RT) for protocol conversion between Profibus/EtherCAT side-channels and 10/100 uplink. Hardware ECC on the SDRAM controller improves reliability in noisy plant environments. The 480-TBGA package, although large, allows tight trace routing for industrial EMC compliance. Use the -C extended-temperature variant when ambient headroom above 105C must be tolerated in panel-mount enclosures.
Recommended
Networked Storage Controller (NAS / iSCSI)
The MPC8280ZUUPEA sits at the heart of legacy networked-storage controllers, using its PCI bridge to connect a SATA or SCSI offload chip while the G2_LE core runs a lightweight file-system stack. The 450 MHz core is sufficient for <500 Mbps sequential throughput, well matched to 10/100 uplinks or dual GbE from an external NIC. ECC-protected SDRAM supports long operational uptime. Out-of-band management via the integrated UARTs and I2C cuts BOM cost versus an external MCU. Storage OEMs should evaluate QorIQ LS1046A for 1/10 GbE and SATA-3 designs.
Recommended
Legacy Telecom Baseband / Line Interface
In legacy telecom baseband cards (T1/E1 multiplexers, SS7 signalling controllers) the MPC8280ZUUPEA's multi-channel HDLC and serial controllers handle up to ~256 HDLC frames per second, matching typical SS7 link-set requirements. The G2_LE core runs signalling protocols or OAM tasks, while a separate framer chip connects over the local 64-bit bus. PCI 2.2 provides clean backplane connectivity. Power dissipation under 2 W is a major benefit when the chassis counts many cards. Telco-grade supply is constrained - validate with the NXP discontinuance notice before shipping new production.
Recommended
Embedded Control / RTOS Platform
The MPC8280ZUUPEA also serves as a high-end RTOS platform for industrial controllers that need both deterministic serial I/O and a real-time capable CPU. VxWorks, INTEGRITY, and LynxOS-M see PowerQUICC II as a fully supported architecture; the G2_LE core's MMU allows full POSIX process isolation. USB host capability simplifies field-update via mass-storage or Ethernet-over-USB peripherals. Designers porting code from older PowerQUICC I (MPC860) silicon benefit from binary-compatible instruction set. For new RTOS designs today, ARM Cortex-A7/A53 QorIQ-class SoCs are recommended given PowerQUICC II's end-of-life trajectory.
Recommended
Recommended Products Summary
Engineering reference data for MPC8280ZUUPEA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8280CZUUPEA | MPC8280VVUPEA | MPC8280ZUUPE | MPC8280CZUUPE | MPC8280VVUPE |
|---|---|---|---|---|---|---|
| Package | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Speed | 450 MHz | 450 MHz | 450 MHz | 450 MHz | 450 MHz | 450 MHz |
| CPM Speed | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Operating Temperature | 0C to +105C | Extended commercial grade | 0C to +105C | 0C to +105C | Extended commercial grade | 0C to +105C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V (alternate tier) | 1.5 V | 1.5 V | 1.5 V (alternate tier) |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| USB | USB 1.1 | USB 1.1 | USB 1.1 | USB 1.1 | USB 1.1 | USB 1.1 |
Key Differentiators
- Integrated PowerQUICC II CPM with hardware HDLC, USB, and Ethernet offload (vs MPC8280CZUUPEA)
- Single-vendor PowerPC + CPM silicon (vs MPC8280VVUPEA)
- Original Freescale-branded silicon revision available as drop-in (vs MPC8280ZUUPE)
Design Notes
Estimated: The MPC8280ZUUPEA dissipates 1.8-2.2 W typical at full 450 MHz / 300 MHz load. With the 480-TBGA body at 37.5 x 37.5 mm, theta_JA is dominated by PCB copper area; design at least a 4-layer PCB with continuous ground plane and a thermal via array under the die shadow. Without thermal spreading, junction temperature could climb >25C above ambient under sustained CPM activity. For fanless sealed enclosures, derate the operating temperature ceiling by 10C.
Estimated: The 480-TBGA at 1.27 mm pitch (typical) requires microvia technology and 4+ layer PCB. Fanout traces must use matched impedance control for the local bus (60-ohm typical) and the 10/100 MII lines. Decouple the 1.5 V core rail with a star topology - bulk 47 uF tantalum, then 10 uF ceramics per quadrant, then 0.1 uF + 0.01 uF per pin cluster - following the NXP PowerQUICC II reference design. Length-matching the DDR-SDRAM lanes to within +/- 25 mil for reliable operation above 133 MHz.
Last-time-buy lifecycle status means new production orders must be placed before the official discontinuance date. Verify NXP's Product Change Notice for last-order and final-shipment windows. Distributor stock may exist for 12-24 months after last order but is not guaranteed. For long-lifecycle applications (industrial, medical, aerospace) that need 10+ year support, migrate the design to QorIQ LS1021A or another actively-produced NXP part BEFORE new system design starts.
Compliance Information
Per DigiChip datasheet excerpt, Lead Free Status is listed as 'Contains Lead' - the MPC8280ZUUPEA is NOT RoHS compliant out of the package. RoHS and REACH status must be confirmed with the NXP product documentation revision in effect at the order date. The part is not AEC-Q100 qualified (industrial/commercial MPU).