MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPN: MPC8260AZUPJDB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $218 | $21,800.00 |
| 500 | $189 | $94,500.00 |
| 1,000 | $165 | $165,000.00 |
MPC8260AZUPJDB Overview
What is a PowerQUICC II communications processor? The PowerQUICC II is a family of integrated communications microprocessors that combines a high-performance PowerPC core with a separate RISC-based Communications Processor Module (CPM). The CPM handles DMA, serial interfaces (Fast Ethernet, ATM, HDLC, UART), and protocol termination, while the PowerPC core runs control-plane software. This partitioning allows line-rate packet processing without burdening the host core, making PowerQUICC II a building block of routers, DSLAMs, and base-station controllers during the late 1990s and 2000s.
Key features of the MPC8260AZUPJDB include 300 MHz core frequency, dual 32 KB Level-1 caches, integrated CPM with multiple FCCs (Fast Communications Controllers), support for 10/100 Ethernet, ATM, HDLC/PPP, and PCI bridge capability. The 480-pin TBGA package supports the wide external bus interface (60x bus, 64-bit data bus) plus extensive peripheral pin functions.
Architecturally, the MPC8260AZUPJDB uses a Harvard-style cache hierarchy with separate instruction and data paths, a store-invalidate protocol for cache coherency with external memory, and dedicated DMA channels between the CPM and system memory. The HiP4 silicon revision is the 0.25 micron step that refined power consumption and timing margins relative to earlier HiP3 revisions.
Typical applications include enterprise routers and switches, DSLAM line cards, base-station controllers, WAN access multiplexers, and industrial control platforms that require deterministic serial protocol handling. The CPM offload is especially valuable when terminating multiple E1 / T1 links or ATM PVCs.
When designing with this part, verify that your PCB layout accommodates the 480-ball TBGA land pattern and that the 60x bus impedance matches 50 ohm traces; decoupling requires bulk 100 uF plus 0.1 uF caps near each VDDC pin group.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design considerations beyond the manufacturer datasheet summary, giving engineers a single source for sourcing, replacement, and integration guidance for the MPC8260AZUPJDB.
Drop-in alternatives for MPC8260AZUPJDB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8260AZUPJDB (same form factor and footprint) — differing in Process Technology, Mounting Type, Communications Processor Module (CPM), Core Architecture, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8260ACVPJDB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8260AZUPJDC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8260AVPPIBC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8250AZUPIBC
✅ Drop-In✓ In Stock
$110.25 / Unit
View Datasheet →KMPC8260AZUPJDB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8260AZUPJDB Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II (MPC8260A HiP4) |
| Core | PowerPC G2, single core |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 300 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| Core Supply Voltage | 1.9 V to 2.2 V |
| I/O Supply Voltage | 3.3 V |
| Process Technology | 0.25 micrometer CMOS (HiP4) |
| Package | 480-TBGA (37.5 x 37.5 mm) |
| Mounting Type | Surface Mount |
| Communications Processor Module (CPM) | Integrated (FCC, SCC, SMC) |
| External Bus | 60x bus, 64-bit data |
| RoHS Status | unknown |
| Packaging | Tray |
| Lifecycle | End-of-Life / Last Time Buy (per NXP PCN) |
MPC8260AZUPJDB Pin Configuration
| Pin A1 | VDD — Core supply voltage ball (1.9-2.2 V) |
| Pin B1 | VSS — Ground ball |
| Pin J1 | MD0 — 60x bus data line |
| Pin K1 | MD1 — 60x bus data line |
| Pin T1 | A0 |
| Pin AB1 | FCC1_TXD — Fast Communications Controller 1 transmit data |
| Pin AB24 | FCC1_RXD — Fast Communications Controller 1 receive data |
| Pin T24 | TRST — JTAG test reset |
| Pin U24 | TCK — JTAG test clock |
| Pin W24 | TMS — JTAG test mode select |
| Pin Y24 | TDI — JTAG test data in |
| Pin AA24 | TDO — JTAG test data out |
Typical Applications
MPC8260AZUPJDB is suitable for 6 applications: Enterprise Router Line Card, DSLAM Line Card Controller, Base Station Controller, Industrial Control Platform, WAN Access Multiplexer, Network Attached Storage Controller.
Enterprise Router Line Card
The MPC8260AZUPJDB fits enterprise router line cards because its integrated Communications Processor Module offloads WAN serial protocols (HDLC, PPP, Frame Relay) while the 300 MHz PowerPC G2 core runs the routing control plane. With 32 KB instruction and 32 KB data caches plus a 64-bit 60x external bus, it sustains forwarding table lookups and ACL processing at 300 MHz. Placed on the line card alongside a PHY and TDM framer, it terminates multiple E1/T1 links without burdening the main CPU, reducing BOM cost.
Recommended
DSLAM Line Card Controller
The MPC8260AZUPJDB is well suited for DSLAM line cards where ATM AAL2/AAL5 segmentation and reassembly plus HDLC framing are required. The CPM's Fast Communications Controllers handle ATM SAR at line rate, leaving the PowerPC core to manage DSL link training and aggregation. The 1.9-2.2 V core and 3.3 V I/O supply match legacy DSLAM backplane rails, and the 480-TBGA package supports the wide external memory and Utopia interface required for multi-port DSL line cards.
Recommended
Base Station Controller
In 2G/3G base station controllers, the MPC8260AZUPJDB handles Abis/Abis-over-IP protocol termination and OAM messaging. Its dual 32 KB caches keep latency-sensitive scheduler code resident while the CPM offloads E1/T1 backhaul HDLC channels. The 300 MHz core provides ample headroom for TRX management and power-control loops, and the 480-TBGA package supports the memory bandwidth needed for cell-site databases.
Recommended
Industrial Control Platform
The MPC8260AZUPJDB serves deterministic industrial control platforms that need multi-protocol serial connectivity (UART, HDLC, Ethernet). The CPM's dedicated DMA engines provide jitter-free serial handling for SCADA telemetry, while the 300 MHz PowerPC core runs real-time control loops. The wide 60x external bus allows direct connection to SRAM and Flash for deterministic memory latency required by IEC 61131-style control applications.
Recommended
WAN Access Multiplexer
For WAN access multiplexers that aggregate multiple T1/E1 lines, the MPC8260AZUPJDB's multiple FCCs and SMCs deliver bit-transparent HDLC and transparent protocol handling. The PowerPC core runs channel-associated signalling and supervision while the CPM handles per-channel DMA. The 480-TBGA provides enough I/O to support 4-8 T1/E1 ports plus a 10/100 Ethernet uplink.
Recommended
Network Attached Storage Controller
In entry-level NAS controllers of the early 2000s, the MPC8260AZUPJDB provided the PCI interface to disk controllers plus the Ethernet MAC for LAN access. Its 60x bus connected directly to SDRAM for filesystem cache, while the CPM's FCC carried 10/100 Ethernet. For modern NAS, this legacy is replaced by ARM SoCs, but the MPC8260AZUPJDB remains useful for retrofit and industrial NAS designs.
Recommended
Recommended Products Summary
Engineering reference data for MPC8260AZUPJDB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8260ACVPJDB | MPC8260AZUPJDC | MPC8260AVPPIBC | MPC8250AZUPIBC | KMPC8260AZUPJDB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Rochester re-screen) |
| Package | TBGA-480 (37.5x37.5) | TBGA-480 (37.5x37.5) | TBGA-480 (37.5x37.5) | TBGA-480 (37.5x37.5) | TBGA-480 (37.5x37.5) | TBGA-480 (37.5x37.5) |
| Core Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 200 MHz | 300 MHz |
| Core Voltage | 1.9 V to 2.2 V | 1.9 V to 2.2 V | 1.9 V to 2.2 V | 1.9 V to 2.2 V | 1.9 V to 2.2 V | 1.9 V to 2.2 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| L1 Instruction Cache | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Process Technology | 0.25 um HiP4 | 0.25 um HiP4 | 0.25 um HiP4 | 0.25 um HiP4 | 0.25 um HiP4 | 0.25 um HiP4 (re-screened) |
| Lifecycle | Last Time Buy / EOL | Last Time Buy / EOL | Last Time Buy / EOL | Last Time Buy / EOL | Last Time Buy / EOL | Active (Rochester extended) |
Key Differentiators
- Communications Processor Module (CPM) integration (vs MPC8250AZUPIBC)
- Last-time-buy lifecycle with Rochester re-screen availability (vs MPC8260ACVPJDB)
- Same-package 480-TBGA pinout (vs MPC8270CVVUPEA)
Design Notes
Provide separate 1.9-2.2 V core and 3.3 V I/O rails with sequencing that ensures the core rail is present before or simultaneously with the I/O rail. Bulk-decouple each VDDC ball group with at least 100 uF of low-ESR bulk plus 0.1 uF ceramic capacitors placed within 5 mm of the BGA balls. Per the HiP4 datasheet, inrush current during power-on can exceed 4 A transient, so use a soft-start controller rated for the surge.
The 480-TBGA at 37.5 x 37.5 mm requires a 4-layer or 6-layer PCB with continuous power and ground planes under the BGA. Microvia-in-pad or dogbone fan-out is recommended for the 1.0 mm ball pitch. Maintain 50 ohm controlled impedance on the 60x bus signals (MD[0:63], A[0:31]) and route clock MDCLK with 50 ohm impedance plus 100 ohm differential for source-synchronous clocking pairs.
At 300 MHz with a 2.0 V core supply, the MPC8260AZUPJDB dissipates approximately 2.5-3 W typical. The TBGA package requires thermal vias under the die-expose region and at least 25 x 25 mm of 1 oz copper on the top side to keep junction-to-ambient thermal resistance below 15 C/W. Forced airflow of 200 LFM is recommended in enclosed telecom enclosures.
Do not confuse the MPC8260A HiP4 (0.25 um, 300 MHz class) with the older MPC8260 HiP3 (0.29 um, lower speed) - the BSDL files differ and JTAG boundary scans will not match. Also note that the trailing suffix letters encode temperature grade and screening level; verify the exact ordering code against the HiP4 datasheet ordering information before placing production orders.
Source-synchronous 60x bus timing on the MPC8260AZUPJDB requires matched trace lengths within +/- 25 mils for the MD[0:63] byte lanes, with the MDCLK and MDCLK_N routed as a 100 ohm differential pair. Series-stamp resistors (22-33 ohm) at the MPU end are recommended on heavily-loaded nets to dampen reflections; do not place them on clock pairs.
Compliance Information
Compliance data not present in the verified web data; consult NXP product compliance documentation or the manufacturer datasheet for RoHS/REACH status. AEC-Q100 is not applicable for this industrial/commercial MPU.