NXP Semiconductors

MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP

MPN: MPC8260ACZUMIBB ✗ End of Life
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1.8 V Vdss 480-TBGA (37.5 x 37.5 mm) Package 266 MHz Speed
From $200 USD / Unit
MOQ: 1 |
Price updated: 2026-10-16
Volume Pricing
Qty Unit Price Extended
1 $360.71 $360.71
10 $320 $3,200.00
100 $280 $28,000.00
250 $240 $60,000.00
500 $200 $100,000.00
ℹ️ All prices are in USD

MPC8260ACZUMIBB Overview

The NXP MPC8260ACZUMIBB is a PowerQUICC II integrated communications microprocessor built on a 0.25 µm CMOS process, delivering 266 MHz of CPU core clock speed in a 480-pin T-BGA (37.5 × 37.5 mm) package. It integrates a PowerPC G2 core with a 32-bit RISC architecture, a CPM (Communications Processor Module), and floating-point support for telecom and networking workloads. The device operates from a 3.3 V I/O and 1.8 V core supply and is designed for high-throughput packet processing in embedded communications equipment.

A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions stored in external memory. The MPC82xx PowerQUICC II family belongs to the PowerPC microprocessor hierarchy, which itself descends from the Power architecture (POWER -> PowerPC -> PowerQUICC). Within an embedded system hierarchy, the MPU sits at the top of the SoC integration stack: MPU -> SoC/communications processor -> networking chipset -> telecom/networking equipment.

Key features include 266 MHz core frequency, an integrated CPM with multiple serial channels (FCC, MCC, SCC, SMC), 32-bit PowerPC G2 core with hardware multiply/accumulate, floating-point unit support, integrated memory controller for DRAM/SDRAM, and 1.8 V core / 3.3 V I/O dual-rail operation. The CPM offloads communications tasks from the core, enabling wire-speed processing on ATM, Ethernet, HDLC, and TDM interfaces.

Architecturally, the MPC8260 combines a PowerPC G2 core, dual-port system bus, and the CPM block connected via an internal 64-bit bus. The CPM includes a 32-bit RISC controller, DMA engines, and serial interface controllers, all running independently of the CPU. This heterogeneous architecture allows real-time protocol handling with low CPU overhead, making it well suited for high-availability routers, DSLAMs, and wireless base stations that need deterministic throughput.

Typical applications include telecommunications switching equipment, networking routers and bridges, ATM and SONET adapters, and industrial control platforms requiring deterministic serial communications. Its combination of integrated comms peripherals and PowerPC compatibility makes it ideal for legacy telecom infrastructure refreshes and long-lifecycle industrial designs.

When designing with this part, allocate decoupling capacitance close to each core/I/O voltage pin and provide a 25 MHz or 33 MHz system clock reference. Note that NXP has marked this part No Longer Manufactured - verify last-time-buy availability and consider the suggested replacement device listed on the manufacturer product page for new designs.

This page synthesizes authorized distributor inventory, drop-in alternatives from the same MPC82xx family, and lifecycle guidance not always found in the standalone datasheet, giving engineers a faster path to component selection and obsolescence planning.

Drop-in alternatives for MPC8260ACZUMIBB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MPC8260ACZUMIBB (same form factor and footprint) — differing in Process Technology, Core Architecture, Series, Mounting Type, Manufacturer.

NXP Semiconductors
Process Technology: 0.25 micron (HiP4) silicon revision
Core Architecture: PowerPC G2
Series: PowerQUICC II HIP4
Compare with MPC8260ACZUMIBB →
NXP Semiconductors
Process Technology: 0.25 micrometer CMOS (HiP4)
Series: PowerQUICC II (MPC82xx)
Manufacturer: NXP Semiconductors (originally Motorola / Freescale)
Compare with MPC8260ACZUMIBB →
NXP Semiconductors
Core Architecture: PowerPC G2, 1 Core, 32-Bit
Series: PowerQUICC II (PQ II HIP 3)
Mounting Type: Surface Mount (BGA)
Compare with MPC8260ACZUMIBB →
NXP Semiconductors
Process Technology: 0.29 µm CMOS
Core Architecture: PowerPC G2 (603e-derived), 32-bit RISC
Mounting Type: Surface Mount (BGA)
Compare with MPC8260ACZUMIBB →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MPC8260ACZUMHBB

✅ Drop-In
NXP Semiconductors
📦 480-TBGA (37.5 x 37.5 mm)
NXP Semiconductors (originally Motorola / Freescale) · PowerQUICC II (MPC82xx) · MPC8260A HiP4 Family (Hardware Specifications) · PowerPC G2 · RISC, 32-bit · 1 · 266 MHz · 64-bit

✓ In Stock

$162.1 / Unit

View Datasheet →

MPC8260AVVPJDC

✅ Drop-In ⚠️ Specs Unverified
📦 480-TBGA (37.5 x 37.5 mm)
Same 480-TBGA family footprint, higher speed grade (300 MHz class) vs this part's 266 MHz (+13% faster core)

📋 Reference alternative (not in catalog)

MPC8250AZUMHBC

✅ Drop-In
📦 480-TBGA (37.5 x 37.5 mm)
Same PowerQUICC II family and 480-TBGA footprint, lower CPM feature set (-1 FCC vs the 8260's 3 FCCs); for lighter comms workloads

📋 Reference alternative (not in catalog)

MPC8255AZUMHBB

✅ Drop-In ⚠️ Specs Unverified
📦 480-TBGA (37.5 x 37.5 mm)
Same 480-TBGA footprint, same PowerQUICC II architecture with reduced CPM serial channel count vs the 8260

📋 Reference alternative (not in catalog)

MPC8260ACZUMIBB Maximum Ratings & Electrical Characteristics

Core Processor PowerPC G2
Architecture RISC 32-bit
Number of Cores 1
Core Clock Speed 266 MHz
Co-Processor / DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Display & Interface Controllers None (per datasheet)
Supply Voltage - Core 1.8 V
Supply Voltage - I/O 3.3 V
Process Technology 0.25 µm CMOS
Package 480-TBGA (37.5 x 37.5 mm)
Mounting Type Surface Mount
Part Status Not For New Designs (No Longer Manufactured)

MPC8260ACZUMIBB 480-tbga (37.5 x 37.5 mm) Pin Configuration Guide

Pin configuration for MPC8260ACZUMIBB (480-tbga (37.5 x 37.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

480-tbga (37.5 x 37.5 mm) package pinout diagram for MPC8260ACZUMIBB

No detailed pinout data available for MPC8260ACZUMIBB.

Refer to the datasheet for full pin configuration.

Typical Applications

MPC8260ACZUMIBB is suitable for 6 applications: Telecommunications Switching Equipment, Networking Routers and Bridges, ATM and SONET Adapters, Industrial Control with Deterministic Serial, Wireless Base Station Controllers, Embedded Long-Lifecycle Compute Platforms.

🌐

Telecommunications Switching Equipment

The MPC8260ACZUMIBB is purpose-built for telecom switching platforms that wire-speed route voice and data traffic through multiple serial interfaces. Its 266 MHz PowerPC G2 core runs control-plane protocols while the integrated CPM handles ATM, TDM, HDLC, and Ethernet traffic across three FCCs, two MCCs, four SCCs, and two SMCs - offloading protocol processing so the CPU is reserved for routing and call-control tasks. The 480-TBGA package supports the dense BGA layouts typical of central-office line cards and provides robust thermal performance at full load. Recommended companion ICs include external PHY devices (e.g., NXP MC68160 Ethernet transceiver) and TDM framers such as the IDT82V2604, which pair over the MPC8260's standard serial channels.

🌐

Networking Routers and Bridges

In mid-range enterprise routers and bridges, the MPC8260ACZUMIBB's combination of a 32-bit PowerPC G2 core and on-chip memory controller makes it a compact routing engine. It interfaces directly with external SDRAM and supports 10/100 Ethernet MAC and T1/E1 framer connections through the CPM, eliminating the need for an external communications coprocessor. Compared with a discrete CPU+ASIC approach, integrating the CPM reduces BOM, board area, and software complexity - critical for cost-sensitive SMB routers. The 1.8 V core / 3.3 V I/O dual-rail power domain simplifies integration with common 3.3 V PHYs and 1.8 V DDR memory.

🌐

ATM and SONET Adapters

ATM SAR (segmentation-and-reassembly) and SONET/SDH adapter cards benefit from the MPC8260ACZUMIBB's hardware ATM support and multi-channel HDLC controllers. The CPM performs AAL2/AAL5 processing at line rate without CPU intervention, while the PowerPC G2 core handles connection-management and signaling. The 480-pin TBGA footprint also lets designers route the high-density parallel bus required for 155 Mbit/s and 622 Mbit/s ATM/SONET PHY interconnect. Legacy and long-lifecycle carrier-grade systems continue to deploy this part for its deterministic throughput and NXP's extended reliability data.

🏭

Industrial Control with Deterministic Serial

Industrial automation platforms that require deterministic multi-drop serial communication - such as programmable logic controllers (PLCs) and remote terminal units (RTUs) - can use the MPC8260ACZUMIBB as their communications controller. The CPM handles multiple UART, HDLC, and bisync channels in parallel, while the PowerPC G2 runs real-time control loops on the system side. The wide operating voltage tolerance and industrial temperature grades (per the orderable suffix) make this part suitable for factory-floor equipment. Compared with separate MCU + bridge chip implementations, the single-chip integration cuts board space and EMC noise sources.

📡

Wireless Base Station Controllers

GSM/UMTS base-station controllers and Node B baseband cards have historically used the MPC8260ACZUMIBB for the Layer-2/Layer-3 control plane. The CPM's HDLC channels terminate the Abis/Iub backhaul links, while the PowerPC G2 runs the radio-resource-management stack. The floating-point unit accelerates signal-processing computations such as channel coding and rate adaptation. For new carrier deployments, design longevity favors parts on NXP's suggested-replacement list, but the MPC8260ACZUMIBB remains in service in installed base stations in many markets.

✈️

Embedded Long-Lifecycle Compute Platforms

Defense, aerospace, and railway electronic systems often require 10- to 25-year lifecycle support - segments where the MPC8260ACZUMIBB continues to find design-ins despite older process technology. The PowerQUICC II family has well-maintained VxWorks, Linux, and NetBSD BSPs, and the BGA package supports ruggedized PCB assemblies. Designers pair this MPU with industrial-temperature SDRAM and supervisory ICs such as the MAX706 to build fault-tolerant embedded compute nodes. Long-term availability for these systems is best secured via authorized-channel stocking agreements.

Recommended Products Summary

MC68160 10/100 Mbps Ethernet PHY/transceiver companion Used in: Telecommunications Switching Equipment IDT82V2604 TDM/HDLC framer companion for serial channels Used in: Telecommunications Switching Equipment MPC8280 Higher-frequency sibling in same family for headroom growth Used in: Networking Routers and Bridges, Embedded Long-Lifecycle Compute Platforms SDRAM-MT48LC16M16A2 Standard SDRAM companion memory IC Used in: Networking Routers and Bridges PM5354 ATM SAR/PHY companion IC for ATM network termination Used in: ATM and SONET Adapters PM4351 SONET/SDH framer companion Used in: ATM and SONET Adapters MAX3162 Rugged RS-232/RS-485 transceiver companion Used in: Industrial Control with Deterministic Serial LM2576 3.3 V / 1.8 V step-down switching regulator companion Used in: Industrial Control with Deterministic Serial DSP56321 Companion DSP for baseband physical-layer processing Used in: Wireless Base Station Controllers MPC860 Predecessor part for migration paths Used in: Wireless Base Station Controllers MAX706 Supply voltage supervisor and watchdog companion Used in: Embedded Long-Lifecycle Compute Platforms
What is the core clock speed of the MPC8260ACZUMIBB?
The MPC8260ACZUMIBB runs at a core clock speed of 266 MHz. According to the NXP PowerQUICC II datasheet, this is achieved through an internal PLL fed from an external system clock reference, and the same family also offers 200 MHz and 300 MHz speed grades under different orderable suffixes (ZUM suffix families).
Is the MPC8260ACZUMIBB still in production?
No. The NXP MPC8260ACZUMIBB is marked No Longer Manufactured on the NXP product page. New designs should consult the discontinuance and replacement notice on the manufacturer page or evaluate the suggested replacement, while existing programs continue to be serviced through authorized distributor stock.
What is the difference between MPC8260ACZUMIBB and MPC8260ACZUMHBB?
Both parts share the same PowerPC G2 core, 480-TBGA package and die, and differ only in op-temperature grade and design revision per the data suffix. The CZUMHBB variant is typically the higher-temperature / revision-B counterpart; consult the device suffix decoder in the datasheet to confirm exact temperature and revision differences before substituting.
Where can I download the MPC8260ACZUMIBB datasheet PDF?
The official NXP MPC8260 PowerQUICC II datasheet can be downloaded from https://www.nxp.com/docs/en/data-sheet/MPC8260.pdf, which covers the entire MPC82xx family including the 8260, 8255, and 8250 variants. Authorized distributor DigiKey (https://www.digikey.com) also hosts the manufacturer-supplied PDF for this MPN.
What is the difference between MPC8260ACZUMIBB and MPC8250AZUMHBC?
Both belong to the PowerQUICC II MPC82xx family, but the MPC8260 is the higher-performance member with a faster CPM and additional communications peripherals compared to the MPC8250. They share the 480-TBGA package family footprint, but the MPC8260ACZUMIBB targets more demanding telecom/networking workloads. Cross-reference should be done with caution as CPM feature sets differ.
Can the MPC8260ACZUMIBB be replaced by the MPC8265AZUPJDC?
No direct drop-in replacement is documented between these two MPNs in the available cross-reference data. The MPC8265 uses a different package option (PBGA vs TBGA) and a higher-speed grade (up to 300 MHz), so PCB layout and pinout verification is required before any substitution. Use NXP's Cross Reference tool at https://www.nxp.com/products/cross-reference:CROSS-REFERENCE for an authoritative comparison.
What is the best drop-in replacement for the MPC8260ACZUMIBB?
Within the same PowerQUICC II family, the MPC8260ACZUMHBB (same 480-TBGA package, same die, revision-B) is the closest drop-in alternative. For modern designs requiring active production, the suggested replacement listed on NXP's MPC8260ACZUMIBB product page should be evaluated; cross-references should always be confirmed against the datasheet and BSP/operating-system support matrix before final selection.
What package does the MPC8260ACZUMIBB use?
The MPC8260ACZUMIBB is supplied in a 480-pin T-BGA (Tape Ball Grid Array) measuring 37.5 mm × 37.5 mm with a 1.55 mm height and 1.27 mm ball pitch. The H/V/U suffixes in the part number encode additional package/operating-grade information per NXP's ordering scheme.
What core architecture does the MPC8260ACZUMIBB use?
The MPC8260ACZUMIBB integrates a 32-bit PowerPC G2 core running at 266 MHz, accompanied by a 32-bit RISC Communications Processor Module (CPM). This heterogeneous architecture lets the PowerPC core run control-plane code while the CPM handles wire-speed serial protocols such as ATM, Ethernet, HDLC, and TDM.
Does the MPC8260ACZUMIBB support floating-point operations?
Yes. The MPC8260 PowerQUICC II added floating-point support compared to its predecessor MPC860 PowerQUICC. The integrated FPU accelerates signal-processing and control-plane math and is documented in the PowerQUICC II reference manual and the device datasheet family document on NXP's website.
How much does the MPC8260ACZUMIBB cost?
As of 2026-10-16, distributor pricing for the MPC8260ACZUMIBB ranges roughly from 87 USD (LCSC entry-level listing) to 360 USD unit price (Heisener distributor reference), with stock approximately 7,792 pieces at one reference distributor. The wide spread reflects no-longer-manufactured status and channel pricing; quotes are recommended for production volumes.
Is the MPC8260ACZUMIBB RoHS compliant?
Based on the verified distributor listings and NXP product page, RoHS compliance is not explicitly confirmed in the retrieved data; this depends on the specific date/lot code supplied through the channel. For New Designs, request a manufacturer RoHS/REACH declaration for the exact date code; the `_validation_note` flags compliance as unknown pending manufacturer confirmation.
What is the operating voltage of the MPC8260ACZUMIBB?
The MPC8260ACZUMIBB requires a dual-rail supply: 1.8 V on the core rail and 3.3 V on the I/O rail. Both rails must be sequenced within the limits given in the datasheet to prevent latch-up, and bulk decoupling should be placed adjacent to each power pin per NXP hardware design guidelines for PowerQUICC II.
What are typical applications for the MPC8260ACZUMIBB?
The MPC8260 PowerQUICC II is designed for telecommunications and networking markets, including routers, DSLAMs, ATM and SONET adapters, wireless base stations, and industrial control platforms with deterministic serial communications. Its integrated CPM makes it especially well suited to systems requiring multiple high-speed serial channels alongside a PowerPC control plane.

Engineering reference data for MPC8260ACZUMIBB — comparison, design guidance, and compliance information.

Selection Guide

Choose the MPC8260ACZUMIBB when you need a PowerPC G2 communications MPU with 266 MHz of CPU throughput and the full 3 FCC + 2 MCC + 4 SCC + 2 SMC serial-channel complement of the MPC8260 family, in a 480-TBGA package that matches your existing layout. For higher clock headroom, prefer MPC8260AVVPJDC (~300 MHz) on the same 480-TBGA footprint. For lighter comms workloads or cost reduction, evaluate MPC8250AZUMHBC or MPC8255AZUMHBB on the same footprint but with reduced CPM feature sets. Note the part is No Longer Manufactured: new designs should consult NXP's official discontinuance/replacement notice before committing.

Comparison with Alternatives

Parameter This Product MPC8260ACZUMHBB MPC8260AVVPJDC MPC8250AZUMHBC
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 480-TBGA (37.5 x 37.5 mm) 480-TBGA (37.5 x 37.5 mm) - same 480-TBGA (37.5 x 37.5 mm) - same 480-TBGA (37.5 x 37.5 mm) - same
Core Architecture PowerPC G2, 32-bit RISC, 1 core PowerPC G2, 32-bit RISC, 1 core - same PowerPC G2, 32-bit RISC, 1 core - same PowerPC G2, 32-bit RISC, 1 core - same
Core Clock Speed 266 MHz 266 MHz (same) Up to 300 MHz (+13%) Up to 266 MHz (same)
CPM Serial Controllers (FCC/MCC/SCC/SMC) 3 FCC / 2 MCC / 4 SCC / 2 SMC 3 FCC / 2 MCC / 4 SCC / 2 SMC - same 3 FCC / 2 MCC / 4 SCC / 2 SMC - same family 1 FCC / 0 MCC / 2 SCC / 1 SMC (-67%)
Floating-Point Unit Yes Yes Yes Yes
Core Supply Voltage 1.8 V 1.8 V 1.8 V 1.8 V
I/O Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V
Lifecycle Status Obsolete (No Longer Manufactured) Obsolete (No Longer Manufactured) Obsolete (No Longer Manufactured) Obsolete (No Longer Manufactured)

Key Differentiators

  • Industry-leading integrated CPM in a single-chip communications MPU (vs MPC8250AZUMHBC)
  • Floating-point unit on-chip (vs MPC860 (predecessor))
  • Same 480-TBGA package as family siblings (vs MPC8265AZUPJDC (PBGA variant))

Design Notes

Estimated: The MPC8260ACZUMIBB uses a dual-rail supply of 1.8 V core and 3.3 V I/O; power consumption scales roughly linearly with the 266 MHz core clock and CPM activity. Plan for at least 2 A of 1.8 V current and ~1 A of 3.3 V current at full CPM load, and place low-ESR bulk capacitors (>=220 µF) plus 0.1 µF + 10 nF ceramics within the BGA footprint. Sequence the rails within the datasheet-mandated window to avoid latch-up.

The 480-TBGA package is thermally enhanced with an exposed thermal-ball matrix; provide at least 4 thermal via arrays under the die and stitch vias to inner copper planes. Estimated: at 266 MHz with all CPM channels active, junction temperature may rise 15-25 °C above ambient with proper PCB thermal design. A heatsink is generally not required but airflow is recommended in enclosed chassis.

Use microstrip routing on at least 6 inner layers with matched impedance for the 64-bit system bus; serialize trace lengths to within 100 mil of each other across the byte lanes and the DDR/SDRAM address/command groups. Per NXP hardware design guidelines for PowerQUICC II, do not route high-speed edges over split power planes; use a continuous ground plane in the layer adjacent to BGA rows.

Firmware is not portable across MPC82xx speed grades without checking the CPM baud-rate generator dividers; bit fields differ across 8250/8255/8260 variants even at the same package. When migrating between same-package family members, re-validate the CPM configuration block, pin multiplexing, and JTAG/BDM initialization. Also confirm power-on-reset circuit timing matches the system clock reference in the new layout.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Distributor listings and NXP product page do not include explicit RoHS/REACH declarations for this obsolete MPN; for new designs request a manufacturer compliance letter against the specific date code, otherwise treat as unknown per data authenticity rule 10.

Data verified on: 2026-10-16 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor Motorola MPC8260ACZUMIBB MPC8260ACZUMHBB MPC8250AZUMHBC MPC8265AZUPJDC PowerQUICC II PowerPC G2 PowerPC MPC82xx family microprocessor MPU communications processor RISC architecture CPM FCC MCC SCC SMC T-BGA BGA package family DRAM SDRAM Floating Point Unit FPU ATM SAR HDLC TDM SONET RoHS REACH
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