MPC857TCZQ66B - PowerQUICC MPU, 32-Bit 66MHz 357-PBGA | NXP
MPN: MPC857TCZQ66B ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $65.46 | $65.46 |
| 10 | $58.92 | $589.20 |
| 100 | $51.1 | $5,110.00 |
| 500 | $44.27 | $22,135.00 |
| 1,000 | $38.85 | $38,850.00 |
MPC857TCZQ66B Overview
A PowerQUICC (PowerPC QUICC) MPU is a category of integrated communications processor that combines a PowerPC execution core with on-chip peripheral subsystems optimized for networking, telecom, and data transport applications. PowerQUICC processors sit within the broader hierarchy of embedded microprocessor units (MPUs), a subclass of microcontrollers and integrated circuits, and they specifically target deterministic handling of serial communications alongside general-purpose computation. This positioning makes them distinct from microcontrollers (which prioritize low power and integrated flash) and from application processors (which prioritize high-throughput multimedia).
Key features include a 32-bit PowerPC architecture core, 66 MHz operating frequency, and the large 357-ball PBGA package that provides extensive I/O for memory and peripheral interfaces. The device is part of the MPC857 sub-series, which adds communications peripheral enhancements over the baseline MPC850/MPC855 devices. The 25x25 mm PBGA accommodates parallel external memory buses, multiple communication channels, and DMA controllers typical of PowerQUICC designs.
From an architecture standpoint, the MPC857TCZQ66B integrates a PowerPC integer unit, on-chip caches, a system interface unit for external memory, a communications processor module (CPM), and serial interface controllers. This integrated design allowed OEMs in the late 1990s and 2000s to build routers, WAN access equipment, and industrial control platforms with a single-chip solution rather than separate CPU plus ASIC implementations.
Typical applications include telecom line cards, WAN access routers, industrial serial communications gateways, and legacy embedded networking equipment. The wide operating temperature range and robust PBGA package also make the part usable in industrial control environments requiring long-term reliability.
When designing with the MPC857TCZQ66B, engineers should consider the legacy status of this part: the PowerQUICC I family is mature and has been superseded by newer QorIQ and Layerscape families from NXP. For new designs, evaluate newer alternatives unless specific software or qualification reasons lock the MPC857 in place. Existing designs benefit from stable supply through distributors carrying remaining inventory.
This page synthesizes distributor inventory status, drop-in same-package alternatives, and practical supply notes not found in the original Freescale/NXP datasheet.
Drop-in alternatives for MPC857TCZQ66B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC857TCZQ66B (same form factor and footprint) — differing in Manufacturer, Package, Core Architecture, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC857TCZQ66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC857TCVR66B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC855TCZQ66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC855TVR66D4
✅ Drop-In✓ In Stock
$55.4 / Unit
View Datasheet →MPC857DSLCVR66B
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →MPC857TCZQ66B
✅ Drop-In✓ In Stock
$38.85 / Unit
View Datasheet →MPC857TCZQ66B Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. |
| Series | MPC8xx (PowerQUICC) |
| Core Processor | MPC8xx (PowerPC) |
| Number of Cores | 1 |
| Core Architecture | 32-Bit |
| Operating Frequency | 66 MHz |
| Package | 357-PBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial) |
| Peripherals | PowerPC core + CPM (communications processor module) - per datasheet |
| Family Designation | MPC857 (PowerQUICC I) |
MPC857TCZQ66B 357-pbga (25x25 mm) Pin Configuration Guide
Pin configuration for MPC857TCZQ66B (357-pbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC857TCZQ66B.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC857TCZQ66B is suitable for 6 applications: Telecom Line Cards, WAN Access Routers, Industrial Serial Communications Gateways, Legacy Embedded Networking Equipment, Print and Imaging Controllers, Aerospace and Defense Avionics Interfaces.
Telecom Line Cards
The MPC857TCZQ66B's PowerPC core and integrated Communications Processor Module (CPM) make it well suited for telecom line cards that need deterministic serial-channel handling alongside control-plane processing. At 66 MHz, the core can run the host-side protocol stack while the CPM off-loads HDLC, UART, and TDM channels, reducing the need for a companion ASIC. The 357-PBGA package exposes the wide external memory bus required to interface with synchronous DRAM and flash for boot/RAM disk storage. Compared with newer QorIQ parts, this device draws on a mature toolchain (CodeWarrior, Linux 2.6 PowerQUICC BSPs) that telecom OEMs already have validated for carrier-grade deployments.
Recommended
WAN Access Routers
WAN access routers in the late 1990s and early 2000s frequently used the MPC857TCZQ66B as the main control processor because the CPM provides multiple SCC (Serial Communications Controller) channels for T1/E1, V.35, and synchronous serial WAN links. The 66 MHz PowerPC core can forward routing tables, run embedded Linux or VxWorks, and manage configuration interfaces. The 357-PBGA package's large ball count accommodates the parallel PCI bus used to connect Ethernet MAC PHYs and crypto accelerators. For legacy router refresh projects, the same 357-PBGA footprint enables sourcing across the MPC855/MPC857 family when one orderable code is exhausted.
Recommended
Industrial Serial Communications Gateways
Industrial protocol gateways that translate Modbus, Profibus, or CAN traffic to Ethernet benefit from the MPC857TCZQ66B's mix of multi-protocol serial controllers and a 32-bit control-plane core. At 66 MHz, the device can run a real-time OS handling industrial protocols while the CPM drives the physical serial interfaces. The 357-PBGA package is suited to industrial-grade carrier boards with extended copper pours for thermal management. Although QorIQ and Layerscape processors are the modern recommendation, the MPC857 family continues to support long-lifecycle industrial equipment already deployed in factory automation systems.
Recommended
Legacy Embedded Networking Equipment
Existing OEM designs in production or field deployment that were built around the MPC857TCZQ66B need replacement stock for service and warranty support. Because the part is in last-time-buy status, design engineers rely on cross-compatible MPC8xx family members to keep the supply chain moving. The 357-PBGA package is large and difficult to re-spin, so any drop-in alternative must share the same ball pattern and silicon-level I/O behavior. Verified cross-reference data on 2026-10-17 confirms the MPC857TCZQ66D4 and MPC855TCZQ66D4 are the most reliable drop-in substitutes.
Recommended
Print and Imaging Controllers
High-end network printers and multifunction imaging devices from the early 2000s used the MPC857TCZQ66B as the system controller, taking advantage of its PCI bus, parallel memory interface, and serial peripheral channels. The 66 MHz core provides enough throughput to manage the engine control plane while dedicated ASICs handle image processing. The 357-PBGA package supports the high pin count required for SDRAM, flash, and the print-engine interface. Service organizations supporting installed printer fleets can use the same 357-PBGA alternatives to maintain field-replacement inventories.
Recommended
Aerospace and Defense Avionics Interfaces
Avionics data concentrators and mission-computer interface boards have historically used the MPC857TCZQ66B for its deterministic interrupt response and ruggedized PBGA package. The 66 MHz PowerPC core can handle ARINC 429, MIL-STD-1553, and Ethernet traffic through the CPM and external glue logic. Although newer safety-certifiable processors exist, long program lifetimes (decades) keep PowerQUICC I in active service. The 357-PBGA footprint supports thermal management via large copper pours required for conduction-cooled avionics enclosures.
Recommended
Recommended Products Summary
Engineering reference data for MPC857TCZQ66B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC857TCZQ66D4 | MPC857TCVR66B | MPC855TCZQ66D4 | MPC855TVR66D4 | MPC857DSLCVR66B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Architecture | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC |
| Series / Family | MPC857 (PowerQUICC I) | MPC857 (PowerQUICC I) | MPC857 (PowerQUICC I) | MPC855 (PowerQUICC I) | MPC855 (PowerQUICC I) | MPC857 (PowerQUICC I) |
| Silicon Revision / Suffix | B | D4 | B | D4 | D4 | B |
Key Differentiators
- Enhanced communications peripheral module (CPM) versus baseline MPC850/MPC855 family (vs MPC855TCZQ66D4)
- Last-time-buy silicon revision 'B' explicitly documented in distribution channels (vs MPC857TCZQ66D4)
- Wide 32-bit external memory bus and CPM in a single die (vs MPC8548EVJAUJD)
Design Notes
The MPC857TCZQ66B in a 357-PBGA package dissipates significant power at 66 MHz across the core and I/O rails. Estimated: with a typical core+IO dissipation of approximately 2-3 W at full load, a 4-layer FR4 board with a copper-pour ground plane under the BGA is sufficient. For sealed industrial enclosures, add a thermal pad or heat-spreader to keep junction temperature below 125 C. Always verify with the actual NXP/Freescale power-consumption table from the family datasheet for your specific configuration.
The 357-ball PBGA on a 1.27 mm pitch requires a 4-layer (or 6-layer for signal integrity) PCB with controlled-impedance traces for the parallel memory bus and PCI interface. Use microvia-in-pad or dog-bone fanout routing per IPC-7351 and IPC-2222. Place decoupling capacitors (0.1 uF ceramic + bulk tantalum or polymer) within 5 mm of every power ball, and provide a continuous ground pour directly under the BGA for thermal spreading and return-path integrity.
PowerQUICC I designs require careful length matching on the 32-bit external memory bus to SDRAM; the address/command traces should be matched within +/- 1.5 cm of the longest strobe. Use IBIS simulation to verify setup/hold margins on the data bus at 66 MHz. The CPM's serial pins are not length-critical but should be routed away from the parallel bus to minimize crosstalk, especially on carrier boards that integrate both fast Ethernet and TDM interfaces.
Do not assume any MPC8xx orderable code is fully interchangeable: the orderable suffix (TC vs TV, B vs D4, etc.) encodes silicon revision, temperature grade, and feature subset. Always check the errata list for your specific mask set before substituting. The last-time-buy status of the MPC857TCZQ66B also means NXP may not accept orders for the exact -B suffix once inventory is depleted; design in the MPC857TCZQ66D4 or MPC857TCVR66B as a verified drop-in alternative for sustaining engineering.
The 66 MHz PowerPC core generates harmonics well into the hundreds of MHz across the parallel memory bus. Use series damping resistors (10-33 ohm) on heavily-loaded address/control lines, and keep stub lengths on the data bus below 6 mm. For PCI segments on the same board, follow the PCI 2.1 routing guidelines (max trace length, impedance, and load count) and verify with the IBIS model from NXP/Freescale.
Compliance Information
RoHS and lead-free status not specified in the verified distributor data; verify the exact orderable suffix code on the manufacturer datasheet before using in RoHS-required applications. AEC-Q100 not applicable (industrial/telecom MPU, not automotive-grade).
