MPC857DSLCVR66B - 66MHz PowerQUICC MPU 357-BGA | NXP
MPN: MPC857DSLCVR66B ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118.5 | $11,850.00 |
| 500 | $105.2 | $52,600.00 |
| 1,000 | $92 | $92,000.00 |
MPC857DSLCVR66B Overview
What is an MPU (Microprocessor Unit)? An MPU is a processor IC that integrates a central processing unit, memory controller, and peripheral interfaces onto a single silicon die. The PowerQUICC MPC8xx family specifically combines a PowerPC integer unit with embedded communications peripherals (CPM - Communication Processor Module) optimized for WAN, LAN, and telecom routing equipment. These MPUs are positioned between standalone microcontrollers (which integrate memory on-chip) and high-end application processors (which require external DRAM), offering a balanced compute-plus-I/O architecture for legacy networking systems.
Key features of the MPC857DSLCVR66B include a 32-bit RISC core, integrated Memory Management Unit (MMU), dual 10/100Mbps Ethernet MAC via the CPM, serial communication controllers (SCCs) and serial management controllers (SMCs), and an industry-standard PCI interface. The 357-ball PBGA package provides 1.27mm pitch and supports multilayer PCB designs typical in networking hardware. The -40C to +95C industrial temperature grade makes the part suitable for outdoor and industrial telecom cabinets.
Architecturally, MPC857 PowerQUICC devices decouple the general-purpose PowerPC core from the CPM, which handles DMA-driven protocol processing independently, offloading the core from real-time packet processing. This hardware acceleration makes the part well-suited for medium-throughput routers, DSLAM line cards, and base-station control plane applications where determinism and packet throughput matter more than raw clock speed.
Typical applications include industrial Ethernet routers, telecom line-card controllers, protocol converter gateways, ATM/Frame Relay access devices, and military/aerospace embedded systems. The 32-bit core and rich peripheral set also suit SCADA controllers and ruggedized IoT gateways.
When designing with this part, ensure your PCB supports the BGA-357 land pattern with controlled-impedance routing for the external memory bus. Power sequencing between the core and I/O rails must follow NXP's reference design or unexpected resets may occur during power-up.
This page consolidates distributor pricing, same-package NXP alternatives, and design notes not found in the manufacturer datasheet, including a flagged lifecycle observation that several distributors list the part as Last Time Buy or obsolete.
Drop-in alternatives for MPC857DSLCVR66B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC857DSLCVR66B (same form factor and footprint) — differing in Manufacturer, Core Architecture, Mounting Type, Package, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC857TCZQ66B
✅ Drop-In✓ In Stock
$38.85 / Unit
View Datasheet →MPC857TVR66B
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →MPC857TVR50B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC857TVR80B
✅ Drop-In📋 Reference alternative (not in catalog)
MPC855TVR66D4
✅ Drop-In✓ In Stock
$55.4 / Unit
View Datasheet →MPC857DSLCVR66B Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC MPC8xx |
| Core Architecture | PowerPC 32-bit RISC |
| Core Count | 1 |
| Core Frequency | 66 MHz (66.66 MHz) |
| Process Technology | 0.32 um CMOS |
| Package | 357-Pin PBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Package Code | BGA (PBGA-357) |
| Temperature Grade | Industrial |
| Supply Voltage (I/O) | 3.3 V typical |
| On-chip Peripherals | CPM with SCCs, SMCs, FCCs, Ethernet MAC, PCI |
| Memory Management | MMU (32-bit virtual addressing) |
| Lead-Free | unknown |
MPC857DSLCVR66B bga (pbga-357) Pin Configuration Guide
Pin configuration for MPC857DSLCVR66B (bga (pbga-357) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC857DSLCVR66B.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC857DSLCVR66B is suitable for 6 applications: Industrial Ethernet Router, Telecom Line Card Controller, Protocol Converter Gateway, SCADA Master Controller, Military / Aerospace Embedded System, ATM / Frame Relay Access Device.
Industrial Ethernet Router
The MPC857DSLCVR66B's dual 10/100 Mbps Ethernet MACs and 66MHz PowerPC core handle switching fabric management, routing table lookup, and IP packet forwarding at wire speed for low-port-count industrial routers. Its MPC8xx CPM (Communication Processor Module) offloads protocol processing via dedicated RISC engines, freeing the integer core for control-plane tasks like OSPF or BGP route computation. The MPC857DSLCVR66B suits ruggedized factory-floor routers where -40C to +95C operation is required, and its PCI bus enables connection to external crypto or TDM accelerators. Power dissipation runs approximately 2.5W typical, manageable with a copper spreader plane, no forced cooling required. Compared with modern QorIQ parts it is slower but offers mature ecosystem support for legacy routing software.
Recommended
Telecom Line Card Controller
MPC857DSLCVR66B integrates the on-chip CPM with serial communication controllers (SCCs) and serial management controllers (SMCs), reducing external component count for telecom line cards terminating T1/E1 or DSL lines. The 66MHz PowerPC core executes call-control signaling while the CPM manages HDLC framing and time-slot assignment without host intervention. The 357-BGA package supports backplane-mounted designs and the PCI interface can connect to framer ICs or DSP arrays. Industrial temperature rating matches outdoor DSLAM cabinet requirements. Board designers should follow NXP's MPC857 power-up sequencing to avoid DCM lock failures during startup.
Recommended
Protocol Converter Gateway
Industrial protocol converters bridging RS-485/Modbus, Ethernet/IP, and legacy fieldbus networks benefit from the MPC857DSLCVR66B's mix of Ethernet MACs, SCCs, and PCI expansion. The 66MHz PowerPC runs the protocol-translation logic while the CPM handles DMA for the SCC channels, eliminating frame-by-frame host interrupts at typical industrial polling rates. The 32-bit MMU supports real-time OS preemptive scheduling, isolating each protocol stack. The 357-BGA footprint with 1.27mm pitch is suitable for multilayer industrial backplane designs. Compared with newer Cortex-M gateway platforms, the PowerQUICC offers verified long-term lifecycle support and deterministic interrupt response critical for protocol timing.
Recommended
SCADA Master Controller
SCADA master stations requiring deterministic packet processing and industrial-grade reliability can leverage the MPC857DSLCVR66B as the central processor. The PowerPC core runs the SCADA host application while the integrated CPM manages redundant serial links to RTUs at typical 300-19200 baud DNP3/IEC 60870-5-104 protocols. Dual Ethernet MACs enable redundant LAN connectivity for ring-topology substations, while the PCI bus provides expansion to DNP3 secure-authentication modules or GPS time-stamping cards. The -40C to +95C industrial temperature grade suits outdoor substation installations, and the MPC8xx firmware ecosystem has 20+ years of vendor support. Power dissipation is moderate enough for sealed enclosure deployment.
Recommended
Military / Aerospace Embedded System
The MPC857DSLCVR66B's industrial temperature grade and 357-BGA ruggedized package make it a candidate for military embedded applications where PowerPC software reuse is mandated. The single 66MHz core executes mission-control algorithms while the CPM handles MIL-STD-1553 or ARINC 429 bridging via external transceivers on the PCI bus. The MMU enforces memory partitioning required by partitioning RTOSes like VxWorks MIL-STD. Designers should note the LTB status and qualify a second source (Rochester Electronics holds authorized stock) for mission-critical programs with multi-decade support requirements. Conduction-cooled heatsink attachment is recommended given the BGA's thermal interface on metal-core PCB.
Recommended
ATM / Frame Relay Access Device
Legacy ATM and Frame Relay access concentrators designed around the PowerQUICC MPC857DSLCVR66B deliver deterministic cell/packet segmentation via the CPM's FCC (Fast Communications Controller) channels, supporting DS1/E1 line rates up to 2.048 Mbps without host intervention. The 66MHz PowerPC core manages PVC/PVP routing tables and ATM signaling (UNI 3.1) while the PCI bus interfaces to SAR (Segmentation and Reassembly) accelerators in denser trunk-side designs. The 357-BGA package suits the compact wall-mount form factors typical of carrier DSLAM/IDLC cabinets. Designers should note that the part is in legacy LTB and qualify an authorized redistributor for multi-year deployment programs.
Recommended
Recommended Products Summary
Engineering reference data for MPC857DSLCVR66B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC857TCZQ66B | MPC857TVR66B | MPC857TVR50B | MPC857TVR80B | MPC855TVR66D4 |
|---|---|---|---|---|---|---|
| Package | 357-Pin PBGA (25x25 mm) | 357-Pin BBGA-357 - same BGA footprint | 357-Pin PBGA (25x25 mm) - same | 357-Pin PBGA (25x25 mm) - same | 357-Pin PBGA (25x25 mm) - same | 357-Pin PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 66 MHz | 66 MHz | 66 MHz | 50 MHz | 80 MHz | 66 MHz |
| Series | MPC857 PowerQUICC | MPC857 PowerQUICC | MPC857 PowerQUICC | MPC857 PowerQUICC | MPC857 PowerQUICC | MPC855 PowerQUICC |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Pin Count | 357 | 357 | 357 | 357 | 357 | 357 |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tray |
| MMU Support | Yes (32-bit) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- 66MHz balanced speed/power point in MPC857 family (vs MPC857TVR50B)
- Industrial temperature grade in MP-letter part number (vs MPC857TCZQ66B)
- BGA-357 footprint in same family as 80MHz upgrade option (vs MPC857TVR80B)
- Free MMU enables full virtual-memory RTOS support (vs MPC850 series (no MMU in some variants))
Design Notes
Estimated: at typical 2.5W power dissipation with a 357-BGA on a standard 4-layer PCB, theta_JA is roughly 15-20 C/W, giving a 38-50 C junction rise above ambient. For sealed enclosures or industrial -40C to +95C operation, a copper spreader plane or thermal pad underneath the BGA thermal balls is recommended to keep Tj below 110 C. Avoid placing heat-generating ICs directly under the BGA footprint on the opposite PCB layer.
The 357-ball PBGA at 1.27mm pitch requires laser-drilled or precision-etched microvia technology on HDI multilayer boards (typically 6-8 layers). Use the manufacturer's BGA land-pattern reference and allocate continuous reference planes under the BGA for power delivery. Place 0.1uF decoupling capacitors within 5mm of every power ball, with 10uF bulk tantalums near the core supply pins.
Power sequencing: the MPC857DSLCVR66B requires the I/O 3.3V supply to ramp before or simultaneously with the core 1.8V supply - reverse sequencing can latch up the I/O cells. Use a power management IC with adjustable sequencing or a discrete MOSFET/resistor network. Allow a 50ms minimum reset hold time after both rails stabilize, per the NXP MPC8xx hardware specification.
The external memory bus and PCI interface run at bus frequencies up to 66MHz with edge rates fast enough to generate 2nd-harmonic content above 130MHz. Maintain 50-ohm controlled impedance on memory data/address lines and 90-ohm differential on PCI signals. Keep bus traces less than 50mm and use series termination resistors close to the driver pins to suppress reflections on multi-load topologies.
Do not assume firmware/software compatibility across all MPC857 speed-grade variants (50/66/80MHz) - bus timing parameters in UPM (User-Programmable Machine) configurations must be regenerated for each clock rate. Likewise, the MPC855 predecessor uses different CPM microcode revision IDs and may require BSP (Board Support Package) updates when migrating. Confirm host bootloader compatibility before a PCB spin only changes the speed grade.
Compliance Information
Manufacturer RoHS statement was not present in the verified web data. Contact Rochester Electronics or NXP for an authoritative compliance certificate. AEC-Q100 does not apply - this is a microprocessor for industrial/telecom embedded systems, not an automotive-grade IC.
