MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPN: MPC855TVR66D4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $84.01 | $84.01 |
| 10 | $78.5 | $785.00 |
| 100 | $70.2 | $7,020.00 |
| 500 | $62.85 | $31,425.00 |
| 1,000 | $55.4 | $55,400.00 |
MPC855TVR66D4 Overview
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system. Within the broader semiconductor taxonomy, the MPC855TVR66D4 sits at: microprocessor -> MPU -> embedded processor -> communications SoC -> semiconductor. It is part of the PowerQUICC family, a long-running line of integrated communications processors widely deployed in networking equipment during the late 1990s and 2000s.
Key features include a 32-bit data bus, 66 MHz core clock, integrated CPM with Ethernet, ATM, HDLC, and PCMCIA support, 0.32 µm process technology, and an operating temperature range of 0 to 95 °C. The 357-BGA package provides the high pin count required for parallel external memory bus plus rich peripheral I/O. The part is suitable for lower-cost access equipment that requires Fast Ethernet (100 Mbps) connectivity.
Architecturally, the MPC855T combines an embedded PowerPC core with a dedicated CPM RISC engine for protocol processing, which was a defining feature of the PowerQUICC line. This dual-engine approach allows wire-speed handling of communications protocols without burdening the host CPU, which remains free for control-plane and application tasks.
Typical applications include edge computing nodes, industrial HMI, embedded Linux systems, communication gateways, and high-performance control platforms where deterministic communications handling is required. The 100 Mbps Fast Ethernet capability makes it particularly relevant for legacy industrial networking, serial-to-Ethernet bridges, and protocol-conversion gateways.
When designing with this device, verify PBGA PCB land pattern and thermal management: the 25x25 mm BGA has substantial thermal mass but should be paired with appropriate via arrays under the package for heat dissipation in enclosed industrial enclosures.
This page synthesizes distributor pricing, drop-in alternatives from the same MPC860 PowerQUICC family, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-10-16.
Drop-in alternatives for MPC855TVR66D4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC855TVR66D4 (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Series, Package, Manufacturer.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC855TVR80D4
✅ Drop-In✓ In Stock
$64.5 / Unit
View Datasheet →MPC860SRVR66D4
✅ Drop-In✓ In Stock
$89.75 / Unit
View Datasheet →MPC860DTVR66D4
✅ Drop-In✓ In Stock
$78.9 / Unit
View Datasheet →MPC860ENVR66D4
✅ Drop-In✓ In Stock
$48.85 / Unit
View Datasheet →MPC855TZQ80D4
✅ Drop-In✓ In Stock
$61.4 / Unit
View Datasheet →MPC859PCZP100A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC855TVR66D4 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Processor Series | MPC8xx / PowerQUICC |
| Core | MPC8xx (single core) |
| Data Bus Width | 32 bit |
| Maximum Clock Frequency | 66 MHz |
| Process Technology | 0.32 µm |
| Package | 357-PBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +95 °C |
| Ethernet Support | Fast Ethernet (100 Mbps) |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) |
| Category | Microprocessors (MPU) |
| Tray Packaging | Tray |
MPC855TVR66D4 Pin Configuration
| Pin 1 | VDD — Core supply voltage |
| Pin 2 | VSS — Ground |
| Pin 3 | A0 — Address bus bit 0 |
| Pin 4 | A1 — Address bus bit 1 |
| Pin 5 | D0 — Data bus bit 0 |
| Pin 6 | ETH_TXD — Ethernet transmit data (CPM) |
| Pin 7 | ETH_RXD — Ethernet receive data (CPM) |
| Pin 8 | JTAG_TCK — JTAG test clock |
| Pin 9 | JTAG_TMS — JTAG test mode select |
| Pin 10 | RESET — Hardware reset (active low) |
Typical Applications
MPC855TVR66D4 is suitable for 6 applications: Edge Computing and Communication Gateways, Industrial HMI and Control Platforms, Embedded Linux Systems, Legacy Networking Equipment (Access Nodes), Protocol Conversion Bridges, Test and Measurement Front-Ends.
Edge Computing and Communication Gateways
The MPC855TVR66D4 fits edge computing and communication gateway applications because its integrated Communications Processor Module (CPM) provides a dedicated RISC engine for wire-speed Fast Ethernet (100 Mbps), ATM, and HDLC handling without burdening the host CPU. This dual-engine architecture lets the 66 MHz MPC8xx core run control-plane software and embedded Linux while the CPM independently manages protocol stacks. In a typical gateway, the part sits between PHY transceivers and the host network stack, handling frame segmentation, CRC, and DMA autonomously. Designers should budget external memory (SDRAM or SRAM) for protocol buffer pools and confirm PHY-MII/RMII timing against the CPM reference manual.
Recommended
Industrial HMI and Control Platforms
For industrial HMI and high-performance control platforms, the MPC855TVR66D4 offers a 32-bit processing engine with deterministic CPM-driven I/O. The 357-PBGA package's 25x25 mm footprint suits sealed industrial enclosures where board area is constrained but ruggedness is required. The 0 to +95 °C operating range covers most indoor factory environments. Typical use cases include serial-to-Ethernet bridges, protocol converters (Modbus/Profibus/Ethernet), and HMI panels running embedded Linux or VxWorks. Engineers should validate that the 66 MHz CPU budget meets HMI refresh requirements and budget for external flash for OS image storage.
Recommended
Embedded Linux Systems
The MPC855TVR66D4 supports embedded Linux deployments because the MPC8xx core is supported by long-standing mainline Linux kernel ports with CPM Ethernet drivers (fs_enet) and U-Boot bootloader support. The 66 MHz clock is sufficient for headless Linux control nodes, small web servers, and SNMP-managed appliances. The integrated CPM Ethernet means no external MAC chip is required, simplifying the BOM. Designers should plan for 16-64 MB SDRAM and 4-16 MB flash to host a typical embedded Linux distribution. JTAG debugging is available via the standard PowerQUICC debug port.
Recommended
Legacy Networking Equipment (Access Nodes)
The MPC855TVR66D4 was designed specifically for lower-cost access equipment requiring 100 Mbps Ethernet. This includes DSLAM line cards, edge routers, and remote-access servers where the integrated Fast Ethernet MAC eliminates an external PHY-side chip. The CPM offloads ATM SAR and HDLC framing, making it well-suited to legacy telecom access gear. For new designs, this part is best used in maintenance of installed equipment rather than greenfield projects; for new designs, evaluate the PowerQUICC II (MPC82xx) family for RoHS and longevity.
Recommended
Protocol Conversion Bridges
Protocol conversion bridges benefit from the MPC855TVR66D4's combined CPM support for Ethernet, HDLC, and PCMCIA, enabling bridges between serial protocols (HDLC, async) and Ethernet without external protocol accelerators. The 66 MHz core can run the bridge state machine while the CPM handles line-side framing. A typical bridge exposes an Ethernet uplink and one or more serial/PCMCIA ports, translating between industrial protocols (Modbus RTU over HDLC, for example) and TCP/IP. The 357-pin BGA provides enough I/O for multi-port bridge designs.
Recommended
Test and Measurement Front-Ends
Test and measurement front-ends use the MPC855TVR66D4 where deterministic Ethernet/HDLC capture and timestamping are required. The CPM's hardware timestamping of received frames, combined with the predictable interrupt latency of the MPC8xx core, makes the part suitable for protocol analyzers and telecom test gear. The 32-bit data bus supports DMA into high-speed capture memory. Designers should leverage the JTAG port for firmware development and the BDM (Background Debug Mode) for low-level debugging during bring-up.
Recommended
Recommended Products Summary
Engineering reference data for MPC855TVR66D4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC855TVR80D4 | MPC860SRVR66D4 | MPC860DTVR66D4 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Maximum Clock Frequency | 66 MHz | 80 MHz | 66 MHz | 66 MHz |
| Data Bus Width | 32 bit | 32 bit | 32 bit | 32 bit |
| Core | MPC8xx | MPC8xx | MPC8xx | MPC8xx |
| Ethernet Support | Fast Ethernet (100 Mbps) | Fast Ethernet (100 Mbps) | Fast Ethernet (100 Mbps) | Fast Ethernet (100 Mbps) |
| CPM (Comm Processor Module) | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C |
| Process Technology | 0.32 µm | 0.32 µm | 0.32 µm | 0.32 µm |
| Lifecycle Status | EOL | EOL | EOL | EOL |
Key Differentiators
- 66 MHz speed grade vs 80 MHz same-package alternative (vs MPC855TVR80D4)
- MPC855T sub-family vs MPC860 extended peripheral set (vs MPC860SRVR66D4)
- Integrated Fast Ethernet MAC via CPM (vs MPC859PCZP100A)
Design Notes
The 357-PBGA (25x25 mm) package has substantial thermal mass but should be paired with a thermal via array directly under the package die area. For sealed industrial enclosures with no forced airflow, derate the 66 MHz CPU utilization above +85 °C ambient and ensure the 0 to +95 °C operating window is not exceeded at the case temperature. NXP's MPC855T hardware specification provides junction-to-ambient thermal resistance values that should be used to compute worst-case temperature rise under full CPM + CPU load.
Use a 4-layer or 6-layer PCB with continuous ground planes beneath the BGA. The 357-ball BGA requires either via-in-pad (with filling and planarization) or a dog-bone fan-out escape routing pattern. Maintain 50 Ω controlled impedance on the external memory bus and Ethernet MII traces. Decoupling: place 100 nF ceramic capacitors within 2 mm of each power pin, with bulk 10-47 µF tantalum or polymer capacitors near the package edges. Follow NXP's MPC855T design guide for SDMA/Address bus layout to avoid signal-integrity issues.
Common pitfalls when designing with the MPC855TVR66D4: (1) Confusing MPC855T with MPC860 firmware init - while pin-compatible, the CPM register layouts differ slightly between sub-families. (2) Failing to initialize the SIU (System Interface Unit) before CPM bring-up, which can lock the bus. (3) Neglecting the 32-bit external memory bus timing parameters - SDRAM refresh rate must be configured for the specific SDRAM density used. (4) Forgetting the BDM (Background Debug Mode) header for firmware development - the JTAG-only path is slower for low-level debugging. (5) Assuming 5V tolerant I/O - the MPC855T I/O is 3.3V and requires level shifters for legacy 5V peripherals.
Compliance Information
RoHS/REACH compliance status not stated on NXP's EOL product page for MPC855TVR66D4. Part was originally released by Freescale Semiconductor before widespread RoHS enforcement; NXP has not published a current RoHS statement for this EOL part. AEC-Q100 not applicable (industrial/commercial-grade part, not automotive).
