최종 구매 공지: MPC859DSLCVR50A 단종에 가까워지고 있습니다. 최종 주문일: 문의하기. 사용 가능한 대체 부품 보기 →
NXP Semiconductors

MPC859DSLCVR50A - PowerQUICC MPC8xx 32-bit MPU 50MHz | NXP

부품 번호: MPC859DSLCVR50A ⚠ 최종 구매
재고 있음 영업일 기준 1~3일 내 발송
1.8 V Vdss 357-PBGA (25x25 mm) Package 50 MHz Speed DRAM/EDO/SRAM interface integrated Memory
시작가 $17.2 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-15
볼륨 가격
수량 단가 합계
1 $25.48 $25.48
10 $23.4 $234.00
100 $20.9 $2,090.00
500 $18.75 $9,375.00
1,000 $17.2 $17,200.00
ℹ️ 모든 가격은 USD 기준입니다

MPC859DSLCVR50A 개요

The NXP MPC859DSLCVR50A is a 32-bit PowerQUICC microprocessor from the MPC8xx family, integrating a PowerPC core with on-chip communications peripherals and running at 50 MHz, housed in a 357-ball PBGA (25x25 mm) package. It features a 1.8V core voltage, 3.3V I/O voltage, a 32-bit RISC-style PowerPC architecture, and 0.18 µm CMOS process technology.

A PowerQUICC (PowerPC Quad Integrated Communications Controller) microprocessor is a specialized embedded processor that combines a PowerPC CPU core with dedicated peripherals for networking and telecommunications. Within the broader hierarchy, MPC8xx parts are embedded microprocessors (a subcategory of microcontrollers / MPU ICs) that target serial-communication-intensive designs such as routers, WAN interfaces, and industrial control. The 50 MHz core frequency, integrated SCCs (serial communication controllers), and PCI bridge make the MPC859DSLCVR50A a classic building block for legacy telecom and embedded networking equipment.

Key features include 50 MHz core clock speed, 32-bit PowerPC core, integrated communications processor module (CPM) with multiple serial interfaces, integrated memory controller supporting DRAM/EDO, a 32-bit PCI interface, and low-power 1.8V core operation. The 357-ball PBGA package is a plastic ball grid array measuring 25x25 mm, designed for surface-mount assembly on high-density embedded boards.

Technically, the MPC859DSLCVR50A uses the PowerPC 603e-derived core with a unified 4 KB instruction and 4 KB data cache, hardware MMU, and dual-port RAM between the core and the CPM. The CPM offloads communications tasks from the CPU through independent RISC engines, enabling wire-speed serial handling while the core runs application code. The 0.18 µm CMOS process delivers low power dissipation and high integration density.

Typical applications include WAN routers and CSU/DSU equipment, industrial serial networking hubs, ISDN terminal adapters, embedded communications controllers, protocol converters, and legacy telecom infrastructure requiring deterministic serial performance.

When designing with this device, note that it requires external SDRAM/DRAM, boot ROM, and a system PLL reference. Designers should consult the MPC866/859 hardware specifications document for AC/DC electrical characteristics and pin multiplexing. The 357-ball BGA requires X-ray inspection and reflow profiling compatible with large-array packages.

This page synthesizes distributor pricing from DigiKey and Rochester Electronics, drop-in same-family alternatives from the MPC8xx product line, and practical design notes not consolidated in the manufacturer datasheet, giving procurement and engineering teams a single reference for the MPC859DSLCVR50A.

드롭인 대체품: MPC859DSLCVR50A — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MPC859DSLCVR50A (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology.

NXP Semiconductors
Process Technology: 0.18 micron CMOS
비교 대상: MPC859DSLCVR50A →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MPC859DSLVR50A

✅ 드롭인
NXP Semiconductors
📦 357-PBGA (25x25 mm)
MPC8xx (Power Architecture, 32-bit) · 1 · 50 MHz · 66 MIPS · 32-bit · Communications Processor Module (CPM) · 10 Mbps (1), 10/100 Mbps (1) · DRAM

✓ 재고 있음

$19.85 / 개

데이터시트 보기 →

MPC859TCVR50A

✅ 드롭인
📦 357-PBGA (25x25 mm)
same 357-PBGA package, 50 MHz, TC variant may omit some SCCs vs DSLC

📋 참조 대체품 (카탈로그에 없음)

MPC866PCVR50A

✅ 드롭인
📦 357-PBGA (25x25 mm)
same 357-PBGA, 50 MHz, MPC866 superset with additional Ethernet support

📋 참조 대체품 (카탈로그에 없음)

MPC859TVR50A

✅ 드롭인
📦 357-PBGA (25x25 mm)
same 357-PBGA, 50 MHz, TV suffix variant within MPC859 family

📋 참조 대체품 (카탈로그에 없음)

MPC866TVR50A

✅ 드롭인
📦 357-PBGA (25x25 mm)
same 357-PBGA, 50 MHz, MPC866TV variant within same family

📋 참조 대체품 (카탈로그에 없음)

MPC859DSLCVR50A 최대 정격 & 전기적 특성

Processor Type MPC8xx PowerQUICC 32-bit MPU
Core Architecture PowerPC 603e-derived, 1 Core
Core Frequency 50 MHz
Core Voltage 1.8 V
I/O Voltage 3.3 V
Process Technology 0.18 µm CMOS
Bit Width 32-bit
패키지 357-PBGA (25x25 mm)
실장 유형 Surface Mount
Integrated Communications CPM with multiple SCCs, SMCs, SPI, I2C
PCI Interface 32-bit PCI bridge integrated
Memory Controller DRAM/EDO/SRAM interface integrated
RoHS 상태 Compliant
Lead Free Status Lead Free
Packaging Tray

MPC859DSLCVR50A 357-pbga (25x25 mm) 핀 구성 가이드

MPC859DSLCVR50A(357-pbga (25x25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MPC859DSLCVR50A의 357-pbga (25x25 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MPC859DSLCVR50A.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MPC859DSLCVR50A 적합 용도: 6 애플리케이션s: WAN Router / CSU-DSU Equipment, ISDN Terminal Adapter / Modem, Industrial Serial Networking Hub, Protocol Converter Bridge, Legacy Telecom Infrastructure Sustaining, Embedded Communications Controller Module.

🌐

WAN Router / CSU-DSU Equipment

The MPC859DSLCVR50A's integrated Communications Processor Module (CPM) with multiple Serial Communication Controllers (SCCs) makes it well-suited for WAN routers and CSU/DSU equipment. Its 50 MHz PowerPC core runs routing and management code while the CPM engines handle HDLC, transparent, and UART serial protocols at wire speed, eliminating the need for an external communications controller. The 32-bit PCI bridge simplifies attachment of additional peripheral chips. The 1.8V core and 3.3V I/O keep power dissipation manageable in fanless telecom enclosures. The 357-ball PBGA enables dense board layouts typical of rack-mount networking gear.

📱

ISDN Terminal Adapter / Modem

Legacy ISDN terminal adapters and modem banks rely on the MPC859DSLCVR50A for simultaneous handling of multiple B-channels. Each SCC can manage a full-duplex ISDN BRI link, while the PowerPC core runs higher-layer protocols and call control. The integrated DRAM controller and PCI bridge reduce BOM cost, and the 50 MHz clock is adequate for typical ISDN data rates of 64 kbps to 2 Mbps. The commercial temperature grade suits indoor telecom customer-premises equipment. Engineers maintain the MPC859DSLCVR50A in production for installed-base support contracts.

🏭

Industrial Serial Networking Hub

Industrial serial hubs use the MPC859DSLCVR50A to bridge multiple RS-232/RS-485 ports to Ethernet backbones. The CPM's serial management controllers and SCCs provide hardware-accelerated protocol handling for Modbus, Profibus, and other industrial serial protocols, offloading the PowerPC core. The 32-bit PCI interface allows expansion cards for additional physical interfaces. Wide operating temperature variants within the MPC8xx family extend deployment to factory floors. The 357-ball PBGA's mechanical robustness suits vibration-prone industrial cabinets.

🔧

Protocol Converter Bridge

Protocol converters translating between legacy serial protocols and modern IP networks commonly use the MPC859DSLCVR50A as the central controller. The integrated CPM handles low-level serial framing while the PowerPC core runs the protocol conversion logic and TCP/IP stack. PCI expansion allows adding protocol-specific PHY cards. The 50 MHz performance is adequate for protocol translation rates up to several Mbps aggregate. The mature toolchain and reference designs from NXP shorten development cycles for bridge products.

🖥️

Legacy Telecom Infrastructure Sustaining

The MPC859DSLCVR50A remains in service for legacy telecom infrastructure including PBX systems, channel banks, and T1/E1 multiplexers. Its deterministic CPM operation and field-proven reliability keep it specified in long-lifecycle telecom equipment where regulatory re-certification is impractical. The 357-ball PBGA supports high-density PCB layouts required for channel-bank shelf equipment. Repair depots stock the MPC859DSLCVR50A for sustaining customer networks. Consider NXP's product longevity program when qualifying for new deployments.

📡

Embedded Communications Controller Module

OEM communications modules for medical, transportation, and energy applications integrate the MPC859DSLCVR50A as a sub-processor managing radio links, sensor buses, and telemetry streams. The integrated PCI and memory controllers reduce module BOM, and the PowerPC architecture supports real-time operating systems like VxWorks and embedded Linux. The 50 MHz clock rate is sufficient for sub-Mbps sensor aggregation. The 357-ball BGA's small footprint suits compact embedded modules requiring multiple serial interfaces.

추천 제품 요약

MPC859DSLVR50A NXP Semiconductors 사용처: WAN Router / CSU-DSU Equipment, Industrial Serial Networking Hub, Legacy Telecom Infrastructure Sustaining MPC866PCVR50A Superset with Ethernet support 사용처: WAN Router / CSU-DSU Equipment, Protocol Converter Bridge, Embedded Communications Controller Module MPC859TCVR50A Same-family alternative 사용처: ISDN Terminal Adapter / Modem, Embedded Communications Controller Module MPC859TVR50A Same-family alternative 사용처: ISDN Terminal Adapter / Modem, Protocol Converter Bridge MPC866TVR50A Same-family variant 사용처: Industrial Serial Networking Hub, Legacy Telecom Infrastructure Sustaining
What is the core frequency of MPC859DSLCVR50A?
The MPC859DSLCVR50A runs at 50 MHz core frequency. According to the MPC866/859 hardware specifications document, the PowerPC 603e-derived core is clocked by an external system PLL and the 50 MHz rating represents the standard speed grade for this part number. The I/O ring operates at 3.3 V while the internal core uses 1.8 V to minimize power dissipation.
How much does the MPC859DSLCVR50A cost?
Pricing as of 2026-10-16 for the MPC859DSLCVR50A starts at approximately $25.48 per unit for single-piece orders, dropping to roughly $17.20 per unit at 1000-piece quantities. Heisener and DigiKey both list the part in inventory, with stock of approximately 6,848 pieces available through authorized distributors. Bulk pricing tiers for this obsolete-grade MPU are wider than for active parts due to constrained supply.
What package does the MPC859DSLCVR50A use?
The MPC859DSLCVR50A is housed in a 357-ball PBGA (Plastic Ball Grid Array) measuring 25x25 mm. The BGA is supplied in tray packaging for surface-mount assembly. This large-array fine-pitch BGA requires X-ray inspection after reflow and careful PCB land pattern design per JEDEC standards for 1.0 mm or 1.27 mm pitch grid arrays.
Is the MPC859DSLCVR50A pin-compatible with other MPC8xx parts?
The MPC859DSLCVR50A shares the 357-ball PBGA footprint with several MPC8xx family members such as the MPC866/MPC859 variants at different speed grades. Drop-in same-package alternatives include the MPC859DSLVR50A and MPC859TCVR50A when sourcing the same die generation. For different pinouts, the MPC852/MPC850 series use a smaller 256-ball PBGA and are NOT drop-in replacements.
What is the difference between MPC859DSLCVR50A and MPC852TZT50A?
The MPC859DSLCVR50A uses a 357-ball PBGA (25x25 mm) while the MPC852TZT50A uses a smaller 256-ball PBGA. Both are PowerQUICC MPC8xx 32-bit processors at 50 MHz but the MPC852 has reduced peripheral integration. They are not pin-compatible: a board designed for the 357-ball package cannot accept the 256-ball part without PCB rework.
Where can I download the MPC859DSLCVR50A datasheet?
The MPC859DSLCVR50A datasheet is available from multiple sources as of 2026-10-16. AllDataSheet hosts the 96-page hardware specifications PDF that covers DC/AC electrical characteristics, AC timing, and pin multiplexing. Freescale Semiconductor (now part of NXP) originally published the document, which applies to the MPC866/859 family. Search "MPC859DSLCVR50A datasheet" on distributor sites to find direct PDF links.
What is the lead time for MPC859DSLCVR50A orders?
Lead time as of 2026-10-16 is approximately 5-7 business days from Heisener, with delivery windows reported between April 7 and April 12 for expedited shipments. DigiKey and Rochester Electronics also list inventory. Because the MPC8xx family is approaching end-of-life status with NXP, lead times can extend significantly when authorized stock depletes; engaging franchised distributors early is recommended.
What are the integrated peripherals of the MPC859DSLCVR50A?
The MPC859DSLCVR50A integrates a Communications Processor Module (CPM) with multiple Serial Communication Controllers (SCCs), Serial Management Controllers (SMCs), an SPI interface, an I2C controller, a 32-bit PCI bridge, and a DRAM/EDO memory controller. The CPM uses independent RISC engines to handle serial protocols offloaded from the PowerPC core, enabling wire-speed telecom throughput.
Can the MPC859DSLCVR50A be replaced by MPC859TCVR50A?
Yes, the MPC859TCVR50A is a same-family MPC8xx part in the same 357-ball PBGA package and serves as a drop-in replacement with minor peripheral differences. Both run at 50 MHz with 1.8V core / 3.3V I/O. Verify the exact peripheral map against your firmware before substituting, since the MPC859TC variant may omit certain SCCs or differ in Ethernet configuration versus the MPC859DSLCVR50A.
What process technology does the MPC859DSLCVR50A use?
The MPC859DSLCVR50A is fabricated on a 0.18 µm CMOS process. This was the standard Freescale/NXP process for the MPC8xx generation, providing a balance between integration density, switching speed at 50 MHz, and low core power at 1.8 V. The 0.18 µm node also enabled the large 357-ball BGA to fit all integrated peripherals on a single die.
Is the MPC859DSLCVR50A RoHS compliant?
Yes, the MPC859DSLCVR50A is RoHS compliant and lead-free per distributor product pages as of 2026-10-16. The 357-ball PBGA uses lead-free solder balls compatible with RoHS reflow profiles. Confirm Reach and conflict-minerals compliance directly with NXP or via the manufacturer's material declaration if required for your end-application regulatory submission.
What is the best cross-brand equivalent for MPC859DSLCVR50A?
The MPC859DSLCVR50A has no true cross-brand drop-in equivalent because the MPC8xx family is NXP/Freescale proprietary and uses a unique PowerPC 603e core plus CPM architecture. Closest functional alternatives are other MPC8xx variants (MPC859DSLVR50A, MPC859TCVR50A, MPC866 family) from the same manufacturer. For new designs, consider modern NXP QorIQ or Layerscape processors which are NOT drop-in but offer a migration path.
How do I design a PCB for the 357-ball PBGA package?
Designing a PCB for the MPC859DSLCVR50A's 357-ball PBGA requires a 1.0 mm or 1.27 mm pitch land pattern per JEDEC MO-192 or equivalent. Use non-solder-mask-defined (NSMD) pads for reliability, place 0.1 µF decoupling capacitors adjacent to each power/ground ball pair, and provide at least 4 PCB layers with continuous ground planes for signal integrity. Reflow profile must match the lead-free solder ball alloy, and post-assembly X-ray inspection is recommended.
When should I choose MPC859DSLCVR50A over modern alternatives?
Choose the MPC859DSLCVR50A only when maintaining a legacy product whose firmware, regulatory certifications, and customer base depend on the exact MPC8xx architecture. For new designs, prefer NXP QorIQ or Layerscape processors which offer higher performance, modern peripherals, and longer lifecycle commitments. The MPC859DSLCVR50A is suitable for sustaining legacy telecom, industrial, or networking equipment where firmware rewrite costs exceed the price premium of modern parts.
What is the operating temperature range of MPC859DSLCVR50A?
The operating temperature range is not explicitly published in the verified web data snippets for the MPC859DSLCVR50A. The 'C' suffix in the part number (DSLCVR) typically denotes a commercial-grade temperature range of 0°C to +70°C for NXP MPC8xx parts. Confirm the exact grade from the manufacturer datasheet or NXP product page before deploying in industrial or automotive environments where extended ranges are required.

엔지니어링 참조 데이터: MPC859DSLCVR50A — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MPC859DSLCVR50A when sustaining or manufacturing legacy embedded equipment whose firmware, regulatory certifications, and customer base depend on the exact MPC8xx PowerQUICC architecture. The 357-ball PBGA package and 50 MHz PowerPC core with integrated CPM make it ideal for WAN routers, CSU/DSUs, ISDN terminal adapters, and industrial serial hubs. For drop-in alternatives within the same package, consider the MPC859DSLVR50A or MPC866PCVR50A (the latter adds Ethernet). For new designs, prefer modern NXP QorIQ or Layerscape processors, which require full PCB and firmware redevelopment but offer higher performance and longer lifecycle. Avoid the MPC852TZT50A as a substitute - it uses a smaller 256-ball PBGA and is not pin-compatible.

대체품과의 비교

파라미터 이 제품 MPC859DSLVR50A MPC859TCVR50A MPC866PCVR50A MPC859TVR50A MPC866TVR50A
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-PBGA (25x25 mm) 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same
Core Frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Core Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
I/O Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Bit Width 32-bit 32-bit 32-bit 32-bit 32-bit 32-bit
Ethernet Support Limited Limited Limited Full (Fast Ethernet) Limited Full (Fast Ethernet)
RoHS Status Compliant Compliant Compliant Compliant Compliant Compliant

주요 차별점

  • Same-family variant with reduced CPM (vs MPC859TCVR50A)
  • Migration path with Ethernet upgrade (vs MPC866PCVR50A)
  • Modern alternative NOT drop-in (vs NXP QorIQ / Layerscape)

설계 노트

The 357-ball PBGA (25x25 mm) requires a controlled-impedance PCB stack-up with continuous ground planes beneath the BGA footprint. Use non-solder-mask-defined (NSMD) land pads of approximately 0.5 mm diameter on a 1.0 mm or 1.27 mm pitch grid, matching JEDEC MO-192. Place 0.1 µF X7R decoupling capacitors within 2 mm of every power/ground ball pair. A minimum 4-layer PCB with dedicated VCC and GND planes is recommended to suppress simultaneous-switching noise from the parallel external memory bus.

At full 50 MHz operation with the CPM running multiple SCCs, junction temperature must remain below 105 °C. Estimated power dissipation at 1.8V core is approximately 0.5-1.0 W depending on CPM utilization. The PBGA's theta_JA is approximately 15-20 C/W with adequate PCB copper area. Provide at least 4 square inches of top-layer copper connected to the thermal balls for heat spreading. Forced-air cooling may be required in enclosed telecom enclosures.

Do not confuse the MPC859DSLCVR50A (357-ball PBGA, 50 MHz) with the MPC852TZT50A (256-ball PBGA, 50 MHz) - these are NOT pin-compatible and cannot be substituted on the same PCB. Verify boot configuration signals and external memory bus width (32-bit vs 16-bit) against your firmware before designing the boot ROM. Incorrect PLL configuration can cause the core to operate at twice or half the expected frequency, leading to silent failures.

규정 준수 정보

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Unknown

RoHS compliant and lead-free per distributor product pages. REACH, halogen-free, and conflict-minerals status not explicitly published in the verified web data snippets - confirm directly with NXP if required for regulatory submission. AEC-Q100 is not applicable as the MPC8xx family targets commercial/industrial telecom, not automotive.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MPC859DSLCVR50A MPC859DSLCVR50A datasheet NXP MPC859 PowerQUICC MPC8xx 32-bit 50MHz MPU 357-PBGA PowerQUICC microprocessor MPC859 WAN router application MPC859 vs MPC866 MPC859 drop-in replacement MPC859DSLCVR50A buy price stock where to download MPC859 datasheet PDF

관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor MPC859DSLCVR50A MPC859DSLVR50A MPC859TCVR50A MPC866PCVR50A MPC852TZT50A PowerQUICC MPC8xx PowerPC 603e Communications Processor Module CPM Serial Communication Controller SCC PBGA 357-ball BGA RoHS embedded MPU microprocessor WAN router CSU/DSU ISDN terminal adapter industrial networking PCI bridge
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