MPC870CZT66 vs MPC875ZT66 Comparison
Detailed side-by-side comparison of MPC870CZT66 by NXP Semiconductors and MPC875ZT66 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC870CZT66 | MPC875ZT66 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | End of Life |
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) | — |
| Core Count | 1 | 1 core |
| Data Bus Width | 32-bit | — |
| Maximum Clock Frequency | 66 MHz | 66 MHz |
| Supply Voltage | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +100C | — |
| Process Technology | 0.18 um CMOS | 0.18 µm |
| Package | 256-PBGA (23x23 mm) | — |
| Mounting Type | Surface Mount | — |
| Mounting Style | Tray | — |
| Instruction Set | RISC | — |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI | — |
| External Memory Bus | Yes (SDRAM/Flash controller) | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| MSL Level | 3 (168 hours) | — |
| Processor Type | — | MPC8xx communications processor |
| Architecture | — | Power Architecture |
| Data Width | — | 32-bit |
| Operating Temperature Range | — | 0 °C to 95 °C |
| Package Type | — | 256-pin PBGA (23 mm x 23 mm) |
| Package Code | — | HBGA |
| Terminal Count | — | 256 |
| Package Shape | — | Square |
| Peak Reflow Temperature | — | 245 °C |
| Application Category | — | Networking and communications applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete numbered pinout] |