MSC8101M1500F - 300MHz SC140 DSP with EFCOP, 332-FCBGA | NXP
MPN: MSC8101M1500F ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
MSC8101M1500F Overview
A digital signal processor is a specialized microprocessor whose architecture is optimized for the repetitive, multiply-accumulate arithmetic at the heart of real-time signal processing. Unlike general-purpose CPUs, a DSP exposes parallel MAC units, deterministic instruction timing, dedicated address generators, and tightly coupled memory so that filters, modems, vocoders, and protocol stacks run at line rate. The MSC8101 belongs to the SC140 family, an extension of the StarCore line, positioned as a network-ready DSP - that is, a programmable DSP that is paired with on-chip peripherals (CPM, EFCOP, multi-channel DMA) so it can be deployed as a single-chip modem, channel card, or protocol accelerator. The SC140 lineage sits inside the broader taxonomy: DSP -> programmable signal processor -> embedded processor -> integrated circuit.
Key features of the MSC8101M1500F include a 300 MHz core clock, the EFCOP hardware filter coprocessor for Viterbi, turbo, and finite-impulse-response acceleration, 512 kB of internal SRAM, an integrated CPM with serial interfaces for TDM/H.110-style streams, and a Host Interface that allows a host CPU to offload packet-processing tasks. The 332-FCBGA (17x17) package provides high signal density while remaining compatible with standard surface-mount assembly lines that support large BGA pitches.
Architecturally, the SC140 core combines four data ALUs and two address generation units driven by a single instruction stream, allowing up to four multiply-accumulates per cycle. Combined with the EFCOP and the CPM, the device can sustain full-duplex voice channels, multi-channel DSL front-ends, or backplane traffic shaping without external coprocessors. The 512 kB SRAM is split into M1 (instruction/boot), M2 (data), and M3/DDR-style external regions so that designers can map code and packet buffers without external memory thrash.
Typical deployments include channel banks and digital trunking in legacy TDM/VoIP gateways, multi-channel V.90/xDSL modems, packet processing line cards for SONET/SDH and Gigabit Ethernet routers, and security accelerators (IPsec/SSL bulk data paths) where the EFCOP accelerates bulk encryption primitives. It is also seen in industrial imaging and sonar front-ends where deterministic DSP cycles are required.
When designing with this part, pay close attention to PCB layout for the 332-ball FCBGA: use standard BGA escape routing, controlled-impedance traces for the Host Interface and DDR region, and a solid ground/power plane stack-up to meet signal-integrity targets. Note that this device has reached the end of its product lifecycle and should be considered primarily for legacy maintenance and form-fit-function replacements rather than new designs.
This page synthesizes distributor inventory, the SC140-family pin-compatible alternatives, and design guidance for the MSC8101M1500F in a single, decision-ready view not found in the original manufacturer datasheet.
Drop-in alternatives for MSC8101M1500F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MSC8101M1200F
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8101M1800F
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8101M1500F
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →MSC8101M1500D
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8101M1500C
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8101M1500B
✅ Drop-In📋 Reference alternative (not in catalog)
MSC8101M1500F Specifications
| Core Architecture | SC140 (StarCore family) |
| Core Clock Speed | 300 MHz |
| Data Width | 16-bit |
| On-Chip RAM | 512 kB |
| Non-Volatile Memory | External |
| Enhanced Filter Coprocessor (EFCOP) | Yes (integrated) |
| Communications Processor Module (CPM) | Yes (integrated) |
| Package / Case | 332-BFBGA, FCPBGA (17 x 17 mm) |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Number of Terminals | 332 |
| Package Code | FBGA (FCBGA) |
| Package Shape | Square |
| Length | 17 mm |
| Primary Application | Network infrastructure (TDM, DSL, packet processing) |
MSC8101M1500F square Pin Configuration Guide
Pin configuration for MSC8101M1500F (square package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for MSC8101M1500F.
Refer to the datasheet for full pin configuration.
Typical Applications
MSC8101M1500F is suitable for 7 applications: TDM Channel Bank / Voice Gateway, Multi-channel DSL Modem Line Card, Packet Processing / Classification Line Card, V.90 / Multi-Modem Modem Pool, Industrial Imaging / Sonar Front-End, Voice-over-IP (VoIP) Media Gateway, Legacy Form-Fit-Function Maintenance.
TDM Channel Bank / Voice Gateway
The MSC8101M1500F fits TDM channel banks because its SC140 core runs 300 MHz with deterministic instruction timing and its integrated Communications Processor Module (CPM) handles H.110/TDM framing for 16+ simultaneous voice channels without an external framer. The Enhanced Filter Coprocessor (EFCOP) accelerates Viterbi decoding, echo-cancellation FIRs, and tone-detection filters so the SC140 MAC units stay free for protocol-stack and signaling work. Designers typically place the DSP between a TDM backplane and an Ethernet/PoE uplink, using the 512 kB on-chip SRAM for active channel contexts and external DDR for jitter buffers and voice recordings. The 332-FCBGA package keeps the design compact at 17 x 17 mm while exposing the full Host Interface bus. Compared with a soft DSP on a host CPU, the MSC8101M1500F delivers predictable per-channel latency required for VoIP gateways and class-5 switches.
Recommended
Multi-channel DSL Modem Line Card
The MSC8101M1500F suits multi-channel xDSL line cards because the SC140 core at 300 MHz offers 1200 MMACs of headroom, while the EFCOP accelerates the upstream/downstream FIR equalizers and Viterbi decoders that dominate DSL PHY DSP load. The integrated CPM streams DSL framer data into DSP memory via DMA, so each channel's PHY processes can run back-to-back with deterministic latency. The 512 kB internal SRAM supports per-channel context plus interleaver buffers, and the external memory controller drives a DDR region for large interleaver depths on long-reach loops. The 332-FCBGA's high pin count gives designers access to the full Host Interface and external memory bus for routing in dense DSLAM line cards. Where channel counts exceed 16 per card, designers cascade multiple MSC8101 devices in a cluster tied together by their Host Interfaces.
Recommended
Packet Processing / Classification Line Card
The MSC8101M1500F accelerates deep-packet-inspection, classification, and queueing workloads in routers and security appliances because the EFCOP accelerates pattern-matching primitives while the SC140 core runs policy and queue-management code. At 300 MHz the part sustains line-rate processing on low- to mid-rate Ethernet links (e.g. Fast Ethernet and OC-3/STM-1 channelized links). The integrated CPM offloads MAC/PHY framing so packet payloads reach DSP memory with minimal host-CPU intervention, and the 512 kB SRAM holds flow-state tables for thousands of concurrent flows. The 332-FCBGA exposes the Host Interface bus so a network CPU can offload a flow into the MSC8101, retrieve verdicts, and forward the packet - typical in IPSec/SSL bulk-data path accelerators. Modern replacements are faster but the MSC8101M1500F remains a proven choice for legacy telecom line cards.
Recommended
V.90 / Multi-Modem Modem Pool
The MSC8101M1500F is well matched to multi-modem pools (modem-on-demand servers, remote-access concentrators) because the EFCOP accelerates V.90/V.34 modem DSP kernels (echo canceller, equalizer, Viterbi decoder) and the CPM multiplexes multiple TDM PCM streams into DSP memory via DMA. A single 300 MHz SC140 device typically handles 30-60 V.90 channels in a modem pool card, with deterministic per-channel latency required by softmodems. The 512 kB internal SRAM is shared across channels for active context and the external memory controller hosts per-channel buffers plus DTMF/tone buffers. The 332-FCBGA ballout supplies the Host Interface (PCI/HPI) needed to plug the modem pool into a host CPU backplane.
Recommended
Industrial Imaging / Sonar Front-End
The MSC8101M1500F powers industrial imaging and sonar-array front-ends because deterministic DSP latency and the EFCOP's FIR pipeline are well matched to beamforming, matched filtering, and FFT front-ends. The 300 MHz SC140 sustains real-time beamforming for small-marker sonar arrays, and the 512 kB on-chip SRAM holds per-channel filter state and ping-to-ping buffers. The CPM digitizes serial ADC data from sonar-hydrophone arrays via TDM/H.110 streams, and the Host Interface ships processed tracks to a host CPU for tracking and display. Designers appreciate the 332-FCBGA's mechanical rigidity in industrial-temperature enclosures and the deterministic interrupt response the SC1400u architecture provides.
Recommended
Voice-over-IP (VoIP) Media Gateway
The MSC8101M1500F fits VoIP media gateways because it can run G.711/G.723/G.729 codecs, echo cancellers, tone-detection DSP, and DTMF clamping in real time on the SC140 core while the EFCOP accelerates the echo-canceller FIR chain. The CPM connects TDM PCM backplanes on the PSTN side and a Host Interface to an Ethernet/PCI host running the SIP/MGCP stack on the IP side. Per-channel context fits in the 512 kB SRAM and the external memory region carries jitter buffers and VoIP recording streams. The 332-FCBGA package (17 x 17 mm) is well suited to dense gateway blades that pack dozens of channels per DSP. With 300 MHz of deterministic DSP, a single part typically handles 64-128 G.711 channels.
Recommended
Legacy Form-Fit-Function Maintenance
The MSC8101M1500F is primarily maintained today for legacy form-fit-function replacement in deployed telecom and industrial systems. Service networks require that any DSP swap must keep the FCBGA ballout, the SC140 register set, the EFCOP programming model, the CPM interrupt model, and the Host Interface timing unchanged so existing firmware runs unmodified. The 332-FCBGA ball map and the 512 kB memory map are unchanged across the MSC8101 family so code compiled for MSC8101M1500F runs on MSC8101M1200F/M1500F/M1800F revisions without re-qualification. Designers should treat the part as a managed-lifecycle component: plan a long-term migration path to MSC8156 or a QorIQ-class device while keeping MSC8101M1500F stock allocated for service contracts.
Recommended
Recommended Products Summary
Engineering reference data for MSC8101M1500F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MSC8101M1200F | MSC8101M1800F | MSC8101M1500D | MSC8101M1500C | MSC8101M1500B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 332-FCBGA (17x17 mm) | 332-FCBGA (17x17) - same | 332-FCBGA (17x17) - same | 332-FCBGA (17x17) - same | 332-FCBGA (17x17) - same | 332-FCBGA (17x17) - same |
| Core Clock Speed | 300 MHz | 200 MHz | 333 MHz | 300 MHz | 300 MHz | 300 MHz |
| Core Architecture | SC140 | SC140 | SC140 | SC140 | SC140 | SC140 |
| On-Chip RAM | 512 kB | 512 kB | 512 kB | 512 kB | 512 kB | 512 kB |
| EFCOP Coprocessor | Yes | Yes | Yes | Yes | Yes | Yes |
| CPM | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete (engineering sample) | Obsolete (prior mask) | Obsolete (first mask) |
Key Differentiators
- Integrated Communications Processor Module (CPM) (vs General-purpose DSPs without CPM)
- Enhanced Filter Coprocessor (EFCOP) (vs Generic DSP cores without EFCOP)
- Pin-compatible within the MSC8101 family (vs MSC8101M1200F / MSC8101M1800F siblings)
Design Notes
The 332-FCBGA package requires a multi-layer PCB stack-up with micro-via escape routing. Use a 1.0 mm pitch BGA escape pattern with at least 4 routing layers and a solid ground/power plane pair to maintain controlled impedance for the Host Interface and external memory bus. Match trace lengths within 50 mils for the DDR clock/address/control group and within 100 mils for the data byte lanes. Avoid routing signals under the BGA in inner layers; use those layers exclusively for planes. Reference the JEDEC JESD51-9 BGA thermal measurement methodology when characterizing theta_JA in production.
The 17 x 17 mm FCBGA package dissipates up to ~3.5 W at 300 MHz under full EFCOP and CPM utilization. Provide a thermal pad array on the top PCB layer or a heat-spreader lid to keep junction temperature below the recommended 105 C industrial limit. In sealed enclosures without airflow, consider derating the core clock to 200 MHz (use MSC8101M1200F) to reduce self-heating. Always measure theta_JA on the production PCB rather than relying on the manufacturer datasheet figure.
Do not assume a single MSP8101 device covers the full mask revision range: suffix letters (B/C/D) correspond to engineering sample or prior production masks, not speed grades. Confirm the exact ordering code (e.g. MSC8101M1500F versus MSC8101M1500B/C/D) before buying for production. Avoid cross-substituting the MSC8102 or MSC8103 in firmware written for the MSC8101 - the CPM and memory-controller register layouts differ and silent field failures are hard to diagnose.
Series-terminate the Host Interface and external memory bus at the driver side with 22-33 ohm resistors tuned to your stack-up characteristic impedance (typically 50 ohm single-ended). Use fly-by routing for DDR address/command lines rather than T-topology to avoid reflections. Place 0.1 uF decoupling capacitors within 100 mils of every VDD/VSS pair, and bulk 10 uF ceramics at each supply pin group. The SC140 core is sensitive to VDD ripple above 50 mVpp - keep switching regulators outside the FCBGA escape region.
Compliance Information
RoHS/REACH status not stated in the verified distributor data for the MSC8101M1500F; the original Motorola/Freescale device launched before the RoHS transition, so most early mask revisions are not RoHS - mark compliance as unknown and confirm with NXP's PCN archive before shipping to EU customers.
